2023
September Agenda – Packaging Beyond the Mainstream
(Joint User Group Meeting: CMPUG, PAG, TFUG)
- Waferbonding and CMP – A Perfect Couple, Knut Gottfried, ErzM and Fraunhofer ENAS
- Pt / HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications, Liangyu Chen, NASA
- The CHIPS Act-related National Advanced Packaging Manufacturing Program, Scott Sikorski, IBM
- Hybrid Multiscale Manufacturing Technologies for Heterogeneous Package Integration, P M Raj, Florida International University (not available)
- A Review on CMP Challenges in HWB and Wafer Level Packaging, G. Bahar Basim, Intel
May Agenda – Advances in CMP Consumables, Materials and Tools
- CMPUG 2023 Report on US Activities and Program Status, Bob Roberts, X-trinSiC Inc (not available)
- Removal Rate Enhancement, Selectivity Modulation, and In-Line Monitoring During DracoTM Hard-Mask Flucto-CMP®, Dr. Ara Philipposian, Araca Inc (not available)
- Tuning Molecular Structure to Promote Surface Activation for Enhanced p-CMP Cleaning Processes,
Dr. Jason Keleher, Lewis University Dept of Chemistry (not available) - Towards Understanding Smaller Ceria Particles (<10nm For SiO2 Removal Rates During CMP,
Ravitej Venkataswamy, Clarkson University - Advancements in Selective Mo CMP For Front End Applications, Dr. Christopher Newman, Research Scientist, Fujimi Corporation (not available)
- Overview of NY CREATES at Albany Nanotech, Lamar Hill, New York CREATES Samples and Simulations to Understand CMP Metrology, Benjamin Bunday, AMAG Nanometro (not available)
- Community Strengthening within CMPUG, Tricia Burroughs, Global Foundries (not available)