2023/09/13 09:00:00
The Northern California Chapter of the American Vacuum Society invites you to participate in a Joint User Group Meeting on Wednesday, September 13, 2023. The meeting is being hosted by NCCAVS via the CMP Users Group, the Plasma Applications Group, and the Thin Film Users Group.
AGENDA:
12:30 p.m. Welcome and Acknowledgement of Meeting Sponsors
Co-Chairs: Rob Rhoades, Jeff Shields, Paul Werbaneth
12:40 p.m. Knut Gottfried, ErzM and Fraunhofer ENAS, “Waferbonding and CMP – A Perfect Couple”
1:10 p.m. Liangyu Chen, NASA, “Pt / HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications”
1:40 p.m. Scott Sikorski, IBM, “The CHIPS Act-related National Advanced Packaging Manufacturing Program”
2:10 p.m. P M Raj, Florida International University, ”Hybrid Multiscale Manufacturing Technologies for Heterogeneous Package Integration”
2:40 p.m. G. Bahar Basim, Intel, “A Review on CMP Challenges in HWB and Wafer Level Packaging”
3:10 p.m. Thank you and adjournment
All presentations from the joint meeting will be posted on the CMPUG, PAG, and TFUG Users Group Proceedings webpage ~2 weeks following the meeting.
CO-CHAIRS:
Rob Rhoades, X-trinsic, zestrion@gmail.com
Jeff Shields, GlobalFoundries, jeffrey.shields@att.net
Paul Werbaneth, Independent Consultant, pfwerbaneth@gmail.com
Sponsorship
If you would like to sponsor a 2023 or 2024* User Group (CMPUG, JTG, PAG, or TFUG) meeting please check out opportunities at:
NCCAVS User Groups Marketing Opportunities
*2024 Schedule is TBD