2022/04/27 09:00:00
Co-Chairs:
Robert Rhoades, X-trinsic Inc., zestrion@gmail.com
Jeffrey Shields, Renesas Electronics, jeffrey.shields@att.net
Paul Werbaneth, Ichor Systems, pfwerbaneth@gmail.com
Agenda –
1:00 p.m. Welcome and Acknowledgement of Meeting Sponsors, Joint User Group Meeting Co-Chairs: Rob Rhoades, Jeff Shields, Paul Werbaneth
1:15 p.m. Andy Mackie, Ph.D., Indium Corporation, “Die-attach Materials Empowering Power Devices: Removing Heat and Supplying Power”
1:45 p.m. Steffen Kroehnert, ESPAT Consulting, “Packaging Advances in the OSAT, Foundry, and MEMS Markets with a Highlight on Europe”
2:15 p.m. David Harame, Ph.D., SUNY Polytechnic, Colin McDonough, AIM Photonics, “AIM Photonics Electronic-Photonic Technologies and Packaging outside the Mainstream”
2:45 p.m. Charles Woychik, Ph.D., SkyWater Technology, “On-Shoring the Next Generation of Advanced Packaging”
3:15 p.m. Melissa Grupen-Shemansky, Ph.D., SEMI, “Packaging Methods for Flexible Hybrid Electronics”
3:45 p.m. Amy Leong, FormFactor, ”Test and Measurement Challenges and Opportunities for Chiplet Heterogeneous Integration”
4:15 p.m. ADJOURN
Zoom Login
| Please use the following Zoom credentials to login to the meeting taking place June 29, 2022 beginning at 1:00pm PDT (check your timezone)
Topic: NCCAVS Joint User Group Meeting on Advanced Packaging Outside the Mainstream Please click the link below to join the meeting: https://us02web.zoom.us/j/84663550617?pwd=qDPQ9CH9Aakx_AjBYD8ROEdLhzXKtd.1 Passcode: 924917 Or One tap mobile : Or Telephone: US: +1 301 715 8592 or +1 312 626 6799 or +1 929 205 6099 or +1 253 215 8782 or +1 346 248 7799 or +1 669 900 6833 Webinar ID: 846 6355 0617 International numbers available: https://us02web.zoom.us/u/keAe8fLSzk |
Sponsorship
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