TFUG Proceedings

2018

October Agenda – Advances in Display Technology

• High yield equipment enables profitable OLED manufacturing, Dr. Xuena Zhang, Applied Materials
• Reliability Assessment of Rotary Sputter Targets in PV Manufacturing, Dr. Venkata Bheemreddy, MiaSole Hi-Tech Corp.
• Large Area Magnetron Sputtering, Ready and Waiting for Gen 10 and Beyond, Peter Sieck (Not Available)

June Agenda-Joint User Group (CMP, PAG, & TFUG) Meeting: Advanced Packaging Technology

• Monolithic Integration of GaN Sensors and Electronics for Harsh Environments, Dr. Caitlin Chapin, XLab (Not Available)
• Equipment and Process Challenges for the Advanced Packaging Landscape, Laura Rothman Mauer, Veeco Instruments, Inc.
• Heterogeneous Integration Needs Heterogeneous Package Assembly, Annette Teng, Promex Industries
• Fan-out IC Packaging Trends and the Impact on Equipment Capital Structures (e.g., Wafer Processing Versus Traditional PCB Styles) Today and in the Future, Jon Woodyard, SiPAQ, LLC
• Low temperature, low damage plasma technologies for advanced packaging applications, David Lishan, Plasma-Therm, Inc.

February Agenda-NCCAVS Joint Users Group Technical Symposium: Process, Materials, and Technology Innovation for Smart Devices, Displays, and Internet of Things

• Reliability for the 21^st Century: Meeting Challenges of New Technologies and New Markets, (Plenary Talk) Milena Vujosevic
• Development and R2R Scale up of a Hybrid Printed CMOS Silicon TFT Process, Patricia Beck, Thin Film Electronics
• Tool Design Considerations for Advanced Atomic Layer Deposition, Duane Bingaman, Kurt J. Lesker Company
• Electron Heating in Sputtering Magnetrons, Andre Anders, LBNL, Leibniz Institute of Surface Engineering
• Plasma-based Thin Film Depositions: Applications, Limitations, Our Improvements, and Case Studies in Battery, Photovoltaic, Non-volatile Memory, and Medical Devices Applications, George Guo, Ascentool Inc.
• Can a New Materials Innovation in Thin Film Optical Applications be Faster and Cheaper?, Guowen Ding, Labforinvention Corp.
• A Quantitative Approach to Optical Emission Spectroscopy, Frank Papa, Gencoa
• Thin Film Roadmap for Solid State Li Metal Batteries, Ernest Demaray, Demaray LLC

2017

February Agenda – NCCAVS Joint Users Group Technical Symposium: Novel Materials, Processes, and Devices for Future Generation Electronics

• Mechanisms of Plasma Therapy (Plenary Talk), David Graves, UC Berkeley
• Large-Scale, Thin-Film Battery, Ernest Demaray, Demaray LLC
• Inkjet Printing for Manufacturing of Flexible and Large-Size OLEDs, Jeff Hebb, Kateeva
• Rapid Materials and Device Innovation for Non-Volatile Memory Applications, Larry Chen, Intermolecular
• BEOL Interconnect Innovations for Improving Performance, Paul Besser, Lam Research
• Nanoscale Chemical Imaging & Topography with Photo-induced Force Microscopy, Thomas R. Albrecht, Molecular Vista, Inc.

June Agenda – Joint CMPUG/TFUG Meeting: 3D Packaging Technology

• Monolithic 3D Integration Using Standard Fab and Standard Transistors, Zvi Or-Bach, Monolithic 3D Inc.
• Reliability of ultra-fine RDL Structures in Advanced Packaging Patterned by Excimer Laser Ablation, Markus Arendt, SUSS MicroTec Photonic Systems, Inc.
• CMP and Current Trends Related to Advanced Packaging, Robert L. Rhoades, Entrepix, Inc.

September Agenda – Advances in Display Technology

• Quantum Dots’ Next Act: Moving to the Mainstream, Jason Hartlove, Nanosys
• Advanced Display Manufacturing Technology, John D. Busch, Applied Materials
• Advanced inkjet printing: Enabling the OLED display revolution, Jeff Hebb, Kateeva

2016

February Agenda – Materials, Devices, and Systems for Intelligent Engineering Solutions

• NCCAVS Joint User Group Symposium Abstract Book and Exhibit Guide

April Agenda– Advanced Memory

• “NAND Flash: Where are we, where are we going?,” Pranav Kalavade, Intel
• “Emerging Memory: From Technology to Applications,” Dave Eggleston, GLOBALFOUNDRIES
• “STT MRAM Technology and Productization,” Jing Zhang, Ph.D., Avalanche Technology

June Agenda – 3D Packaging

• “Novel Process of RDL formation for Advanced Packaging by Excimer Laser Ablation,” Markus Arendt, SUSS MicroTec Photonic Systems Inc.
• “Optical Metrology and Inspection for Fan-Out Wafer Level Packaging (FOWLP),” Ben Garland, Jim Xu, Ph.D., and Vamsi Velidandla , Zeta Instruments Inc.
• “CMP for Advanced Packaging,” Robert L. Rhoades, Entrepix, Inc.
• “Between 2D and 3D: WLFO Packaging Technologies and Applications, “Minghao Shen, Altera Corporation (now part of Intel)

November Agenda- Energy Storage & Conversion

• “An Advanced Bipolar Silicon-Lead Technology for Renewable Energy Applications,” Collin Mui, Gridtential

2015

February Agenda – Technology Innovation for Next Generation Materials and Manufacturing

• “Message from Indium Corporation,” Jacques Matteau, Indium Corporation
• “Low Emissivity (Low-E) Coating Technologies for Energy Saving Window Applications,” Guowen Ding, Intermolecular
• “40 Years of Magnetron Sputtering: Still an Exciting Field for Discovery,” Andre Anders, Lawrence Berkeley National Laboratory
• “New Applications of Chemical Mechanical Polishing,” Rob Rhoades, Entrepix, Inc.

June Agenda– 3D Packaging

• “Electromigration Simulation Flow For Chip-Scale Parametric Failure Analysis,” Jun-Ho Choy, Mentor Graphics Corp.

July Agenda – Biomedical Applications

• “Novel Use Of Reactive Multilayer Foil For Mars Planetary Exploration,” Jacques Matteau, Indium Corporation
• “Atmospheric Pressure Plasma Based Fabrication of Low Cost Paper Biosensors,” Ramprasad Gandhiraman, NASA Ames Research Center (USRA)

September Agenda– Semiconductor Technology Beyond 7nm

• “Carbon-based Materials for Flexible Electronics,” Nan Liu; Zhenan Bao, Stanford University
• “Zeiss Process Gas Analyzer based on Ion Trap Technology, Outstanding Performances as In-line, Real Time Gas Analyzer,” Michel Aliman, Hin Yiu Anthony Chung , Martin Antoni, Gennady Fedosenko, Alexander Laue, Rüdiger Reuter, Valerie Derpmann, Leonid Gorkhover, Andreas Gorus, Andreas Pecher Carl Zeiss SMT GmbH, Rudolf-Eber-Str. 22, 73447 Oberkochen, Germany
• “Energy-efficient Design for Emerging NVM Technology: Enabled by Carbon Nano-materials,” Ethan C. Ahn, Ph.D., Department of Electrical Engineering, Stanford Nanoelectronics Lab., Stanford University
• “Limitations and Challenges to Meet Moore’s Law,” Sung Kim, Sr. Director of Maydan Technology Center; Advanced Products Technology Development, Applied Materials
• “Sub-5 nm Patterning and Applications by Nanoimprint Lithography and Helium Ion Beam Lithography,” Yuanrui Li, Ahmed Abbas, Yuhan Yao, Yifei Wang, Wen-Di Li, Chongwu Zhou, and Wei Wu

November – Energy Storage & Conversion

• “The Future of Energy Storage,” Venkat Srinivasan, Lawrence Berkeley National Lab

2014

February – Nanomaterials for Energy, Biomedical, and Electronic Devices

• “Biomedical Devices: Engineering’s Contributions to Improving Quality of Life,” Guna Selveduray, San Jose State University
• “Metal-Carbon Nanotube Contacts,” Patrick Wilhite and Cary Yang, Santa Clara University
• “Efficient Electromagnetic and Multiphysics Simulation – from Nanomaterials to Macro Devices,” Mike Hook, Cobham Technical Services
• “Controlled Nanoparticle Generation by Terminated Cluster Growth in a Sputtering Chamber,” Andre Anders and Cesar Clavero, Lawrence Berkeley National Laboratory
• “Implement Smell and Taste with Nano-sensor,” Zhiyong Li, HP Labs

June – 3D Packaging

• “Monolithic 3D is now Practical,” Zvi Or-Bach, MonolithIC 3D Inc.
• “TCAD Modeling for Mechanical Stress Management in 3D IC Packages,” Xiaopeng Xu, TCAD R&D, Synopsys, Inc.

July – Display and Lighting

• “High efficiency LCDs using Quantum Dot Enhancement Film,” Jian Chen, Nanosys, Inc.
• “A novel method of managing joint stress, in a metallic bond made using reactive multilayer foils, at a user selected temperature (for applications of bonding LEDs to heat sinks),” Jacques Matteau, Indium Corporation
• “Reinventing Memory for Things (TM) – Application specific memory solutions for integrated, connected, and high-temperature applications,” Bard Pedersen, Adesto Technologies
• “High power radio-frequency plasma light sources for industrial applications,”Lars Dugaiczyk, Luxim Corp.

August Agenda – Biomaterials Applications

• “Sterilization of Biomedical Devices,” Jeff Sauter, NUTEK Corporation

September Agenda – Energy Storage

• “Fueling the future: Safe, Dense, Reversible Hydrogen Storage in Hybrid Nanomaterials,” Jeffrey Urban, Lawrence Berkeley National Laboratory
• “Graphene-based Electrodes for Electrochemical Energy Conversion and Storage,” Min Hwan Lee, University of California Merced
• “Sun to Fiber: a thin film optical funnel for broadband transport and conversion,” Matthew Garrett, University of California Santa Cruz

December Agenda – Advanced Memory

• “The Internet of Things…,” Lucian Shifren, ARM
• “Memory Selector Devices,” An Chen, Global Foundries
• “Perpendicular MTJ Stack Development for STT MRAM,” Mahendra Pakala, Applied Materials
• “Perpendicular Magnetic Multilayers,” Sangmun Oh, HGST
• “NEMS Memory for Low Power Application,” Jin-Woo Han, NASA Ames Center for Nanotechnology

2013

February – Technology for Clean Energy
June – 3D Packaging
September – Energy Storage
November – Advanced Memory

2012

February – Technology for Clean Energy
June – 3D Packaging
July – Advanced Process and Integration in Semiconductor Technologies

2011

February – NCCAVS Joint User Group Topical Conference on Photovoltaic Technology
June – 3D Packaging
July – Advanced Process and Integration in Semiconductor Technologies
September – Energy Storage

2010

February – Photovoltaic Energy
April – Display and Imaging Technology
June – Bio-Nano, Bio-MEMS and Nano-MEMS Technology
August – Energy Storage
October – Advanced Memory
December – Advanced Device Integration – FEOL/BEOL

2009

February – Alternative Energy
April – Integration – FEOL
June – Bio-Nano-MEMS Technology
August – Display and Imaging Technology
October – Advanced Memory

2008

February – Alternative Energy
April – Display and Imaging Technology
August – Advanced FEOL Integration
October – Advanced Memory Technology
December – Advanced BEOL Integration

2007

March – Energy Technologies
April – Diagnostics
June – 3-D Interconnect for Wafer Level Packaging
August – Advanced Thin Films
October – Advanced FEOL Integration
November – Intellectual Property in Nano & Semiconductor Technology
December

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2002

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