2022
June Agenda – Semiconductor Packagin Outside the Mainstream (Joint User Group Meeting: CMPUG, PAG, & TFUG)
- Die-attach Materials Empowering Power Devices: Removing Heat and Supplying Power, Andy Mackie, Ph.D., Indium Corporation (not available)
- Packaging Advances in the OSAT, Foundry, and MEMS Markets with a Highlight on Europe, Steffen Kroehnert, ESPAT Consulting
- AIM Photonics Electronic-Photonic Technologies and Packaging outside the Mainstream, David Harame, Ph.D., SUNY Polytechnic, Colin McDonough, AIM Photonics
- On-Shoring the Next Generation of Advanced Packaging, Charles Woychik, Ph.D., SkyWater Technology
- Packaging Methods for Flexible Hybrid Electronics, Melissa Grupen-Shemansky, Ph.D., SEMI
- Test and Measurement Challenges and Opportunities for Chiplet Heterogeneous Integration, Amy Leong, FormFactor