2020
February Agenda – NCCAVS User Group Joint Technical Symposium – The Quantum World
NCCAVS 2020 Poster Session – Results
- Modeling Systems with Quantum Computers, Rudy J. Wojtecki, IBM Research – Almaden (N/A)
- Optimizing Quantum Optimization Algorithms for Noisy Quantum Computers, Davide Venturelli, USRA Research Institute for Advanced Computer Science (Pending)
- Enterprise Software to accelerate the quantum revolution, Christopher T. Brown, Zapata Computing, Inc.
- Materials Engineering for Quantum Information Technology, Robert Jan Visser, Applied Materials (Pending)
- Introduction of a new technology platform to enable scalable fabrication of single silicon vacancy defect arrays, Andre Linden, Raith America, Inc.
- Thin Film Fabrication of Quantum Upconverting Sensors for Dark Matter Detection, Dale Li, SLAC National Accelerator Lab
- Quantum Measurement Protocols for Upconverting Sensors, Stephen Kuenstner, Stanford University
- Superconducting quantum coherent circuits: introduction, challenges, and near-term applications, John Mark Kreikebaum, Lawrence Berkeley National Laboratory & University of California, Berkeley
May Agenda – Metrology
- Advanced film adhesion characterization by scratch testing, Pierre Morel, VP for applications at Rtec Instruments (n/a)
- Golden Eye for the IoT Age – Industrial Applications of Transmission Electron Microscopy, Dr. Peng Zhang, EAG Laboratories (n/a)
- X-Ray Diffraction From the Easy to the Hard, Chris Moore, VP Technology, Covalent Metrology
- Thin Film Measurements by Multi-Wavelength Ellipsometry, Blaine Johs, Filmsense LLC (n/a)
June Agenda – Advanced Packaging Technology
- Plasma Dicing – The “Next Normal” Richard Barnett, Senior Product Manager, Etch Products (SPTS Technologies Ltd, Newport, UK)
- Heterogeneous Integration Roadmap and the Revolution Enabling Future Progress, Dr. Wilmer R. Bottoms, Chairman, Third Millennium Test Solutions
- Surviving the Heat Wave – A presentation on thermally induced failures and reliability risks created by advancements in electronics technologies…and How Modeling Early in the Design Process can Identify these Issues, Greg Caswell, ANSYS
- Heterogeneous Integration Competence Center – An Open Acces
- s Innovation Incubator, Garrett Oakes, EV Group (Pending)
- Solving the DataCenter Energy Crisis with Silicon Photonics and Overcoming Photonics Wafer-level Test Challenges, Dr. Choon Beng Sia, FormFactor
September Agenda – Plasma and Thin Film Technology Helping in the Fight Against COVID-19
- Point-of-Care Molecular Detection for Pathogen Testing, Nader Pourmand PhD, Professor of Biomolecular Engineering, University of California, Santa Cruz (mp4 file)
- Cellular Nanosponges for the Treatment of Viral Infection, Liangfang Zhang, PhD, Professor of Nanoengineering, Bioengineering, and Chemical Engineering, University of California, San Diego (N/A)
- Plasma Decontamination of Surfaces, Daphne Pappas, PhD, Manager, Applications/R&D, Plasmatreat USA, Inc. (mp4 file)