2022
June Agenda – Semiconductor Packagin Outside the Mainstream (Joint User Group Meeting: CMPUG, PAG, & TFUG)
- Die-attach Materials Empowering Power Devices: Removing Heat and Supplying Power, Andy Mackie, Ph.D., Indium Corporation (not available)
- Packaging Advances in the OSAT, Foundry, and MEMS Markets with a Highlight on Europe, Steffen Kroehnert, ESPAT Consulting
- AIM Photonics Electronic-Photonic Technologies and Packaging outside the Mainstream, David Harame, Ph.D., SUNY Polytechnic, Colin McDonough, AIM Photonics
- On-Shoring the Next Generation of Advanced Packaging, Charles Woychik, Ph.D., SkyWater Technology
- Packaging Methods for Flexible Hybrid Electronics, Melissa Grupen-Shemansky, Ph.D., SEMI
- Test and Measurement Challenges and Opportunities for Chiplet Heterogeneous Integration, Amy Leong, FormFactor
April Agenda – Plasma Applications for the Developement, Modification and Implementation of Carbon Allotropes
- Plasma-functionalization of MWCNTs for Energy Storage, Conversion and Ttransport, Dr. Sylvain Coulombe, McGill University
- New Opportunities for Plasma-based Approaches to Diamond Synthesis, Dr. Mohan Sankaran, University of Illinois, Urbana-Champaign (not available)
- Approaches for the Modification of Macroscopic Carbon Nanotube Assemblies with Atmospheric-Pressure Plasma, Dr. Ruairi McGlynn, Ulster University
- Graphene Transducer Manufacturing, Lonnie Wilson, GraphAudio (not available)
- Electron Beam Generated Plasma as an Ultra-low Te Approach to Processing Graphene, Dr. Scott Walton, US Naval Research Laboratory (not available)