PAG Proceedings

2019

February Agenda-NCCAVS Users Group Joint Technical Symposium

• Next Generation Energy Storage Technologies, Subramanya (Subra) Herle, Applied Materials
• Solid-state Thin Film Batteries Take a Page Out of the 3D Transistor Play Books, J.R. Gaines, Kurt J. Lesker Company
• Advances and Challenges with Rechargeable Lithium-Air Batteries, Dave Sopchak, Coulombic, Inc.
• Peak Power Impact on Battery Cycle Life, Naoki Matsumura, Intel
• Directly Converting Heat to Electricity using Compact, Microfabricated Thermionic Devices, Jared Schwede, Spark Thermionics (N/A)
• AlN-based Piezoelectric Energy Harvesting, Mary Ann Maher, SoftMEMS (N/A)
• Tribute to John W. Coburn, David Graves, U.C. Berkeley
• How to Make Manufacturing of LEDs Truly Green, Prasad N. Gadgil, Atomic Precision Systems
• GaN HEMT Electronics for Extreme Environments, Saleh Kargarrazi, Stanford XLab
• Conversion Technologies for Generating, Transmitting, and Storing Energy, Joint Users Group Technical Symposium
• Selection of Battery and Charging Algorithm to Extend Battery and Cycle Life, Naoki Matsumura

April Agenda-Advances in CMP Consumables, Materials and Tools

• Keynote Talk, Suresh Ramarajan, Senior Director NVM Process Development Engineering, Micron Technology (Not Available)
• Method for Studying the Effect of Conditioner Design and Polisher Kinematics on Fluid Flow Characteristics during CMP, Juan Cristobal Mariscal, University of Arizona
• Low Particle Size Ceria STI Slurry Designed for High Performance Dishing and Nitride Loss, Edmund Chu, Ferro
• The Development of Post-CMP Cleans to Address New Challenges in Advanced Device Manufacturing, Paul Bernatis, DuPont EKC Technology (Not Available)
• Effect of Conditioner Wear on the Tribological, Thermal, Kinetic and Pad Microtextural Characteristics in ILD CMP, Hossein Dadashazar, University of Arizona
• Computer Simulation for Understanding of CMP Process, Akira Endou, Fujimi Incorporated
• High Quality Test Wafer and Analysis For CMP Process, Consumables and Materials, Yasuji Moriki, AMT
• Okamoto 300mm Final Polish System, Bob Pinto, Okamoto

2017

February Agenda-NCCAVS Joint Users Group Technical Symposium: Novel Materials, Processes, and Devices for Future Generation Electronics

• Mechanisms of Plasma Therapy (Plenary Talk), David Graves, UC Berkeley
• Large-Scale, Thin-Film Battery, Ernest Demaray, Demaray LLC
• Inkjet Printing for Manufacturing of Flexible and Large-Size OLEDs, Jeff Hebb, Kateeva
• Rapid Materials and Device Innovation for Non-Volatile Memory Applications, Larry Chen, Intermolecular
• BEOL Interconnect Innovations for Improving Performance, Paul Besser, Lam Research
• Nanoscale Chemical Imaging & Topography with Photo-induced Force Microscopy, Thomas R. Albrecht, Molecular Vista, Inc.
• Material Innovation for Non-Volatile Memory Selectors, Larry Chen, Mark Clark, Charlene Chen, Milind Weling, Intermolecular

September Agenda: Advances in Atomic Layer Deposition (ALD)

• Use of Plasmas in Atomic Layer Deposition Processes, Mark J. Sowa, Veeco – CNT
• Atomic Layer Deposition of Ferroelectric and Threshold Switching Materials for Next Generation Nonvolatile Memory, Karl Littau, Intermolecular Inc.
• Dopant-Rich Films on Si: A New Frontier For Thermal ALD Processes, Michael I. Current, Current Scientific
• Atomic Layer Deposition with Activated Species: Applications in Gallium Nitride Power Devices and Silicon-Based Artificial Photosynthesis, Professor Paul C. McIntyre, Department of Materials Science and Engineering, Stanford University (presentation N/A)

November Agenda: Patent Strategy and Mechanics, and What Comes Afterward

• • Nuts and Bolts of Getting a Patent, Dan Flamm, Microtechnology Law & Analysis
  • Alice in Wonderland Patentland, Richard T. Ogawa, Ogawa, P.C.
  • Developing an International Patent Portfolio, Will Chen, Sheppard Mullin Richter & Hampton LLP
  • Monetizing Your Patent Assets: Turning Paper into Gold, Duane Mathiowetz, Foley & Lardner, LLP

2016

February Agenda – Materials, Devices, and Systems for Intelligent Engineering Solutions

• NCCAVS Joint User Group Symposium Abstract Book and Exhibit Guide

2015

February Agenda – Technology Innovation for Next Generation Materials and Manufacturing

• Message from Indium Corporation, Jacques Matteau, Indium Corporation
• Low Emissivity (Low-E) Coating Technologies for Energy Saving Window Applications, Guowen Ding, Intermolecular
• 40 Years of Magnetron Sputtering: Still an Exciting Field for Discovery, Andre Anders, Lawrence Berkeley National Laboratory
• New Applications of Chemical Mechanical Polishing, Rob Rhoades, Entrepix, Inc.

May Agenda – Atmospheric Plasmas and Applications

• Atmospheric Plasma Applications in Electronic Packaging, Demetris Chrysostomou, PVA Tepla America
• Plasma CVD passivation; Key to high efficiency silicon solar cells, David Tanner, GT Advanced Technologies

June Agenda– 3D Packaging

• Electromigration Simulation Flow For Chip-Scale Parametric Failure Analysis, Jun-Ho Choy, Mentor Graphics Corp.

September Agenda– Semiconductor Technology Beyond 7nm

• Carbon-based Materials for Flexible Electronics, Nan Liu; Zhenan Bao, Stanford University
• Zeiss Process Gas Analyzer based on Ion Trap Technology, Outstanding Performances as In-line, Real Time Gas Analyzer, Michel Aliman, Hin Yiu Anthony Chung , Martin Antoni, Gennady Fedosenko, Alexander Laue, Rüdiger Reuter, Valerie Derpmann, Leonid Gorkhover, Andreas Gorus, Andreas Pecher Carl Zeiss SMT GmbH, Rudolf-Eber-Str. 22, 73447 Oberkochen, Germany
• Energy-efficient Design for Emerging NVM Technology: Enabled by Carbon Nano-materials, Ethan C. Ahn, Ph.D., Department of Electrical Engineering, Stanford Nanoelectronics Lab., Stanford University
• Limitations and Challenges to Meet Moore’s Law, Sung Kim, Sr. Director of Maydan Technology Center; Advanced Products Technology Development, Applied Materials
• Sub-5 nm Patterning and Applications by Nanoimprint Lithography and Helium Ion Beam Lithography, Yuanrui Li, Ahmed Abbas, Yuhan Yao, Yifei Wang, Wen-Di Li, Chongwu Zhou, and Wei Wu

2014

February – Nanomaterials for Energy, Biomedical, and Electronic Devices

• Biomedical Devices: Engineering’s Contributions to Improving Quality of Life, Guna Selveduray, San Jose State University
• Metal-Carbon Nanotube Contacts, Patrick Wilhite and Cary Yang, Santa Clara University
• Efficient Electromagnetic and Multiphysics Simulation – from Nanomaterials to Macro Devices, Mike Hook, Cobham Technical Services
• Controlled Nanoparticle Generation by Terminated Cluster Growth in a Sputtering Chamber, Andre Anders and Cesar Clavero, Lawrence Berkeley National Laboratory
• Implement Smell and Taste with Nano-sensor, Zhiyong Li, HP Labs

June – 3D Packaging

• Monolithic 3D is now Practical, Zvi Or-Bach, MonolithIC 3D Inc.
• TCAD Modeling for Mechanical Stress Management in 3D IC Packages, Xiaopeng Xu, TCAD R&D, Synopsys, Inc.

September Agenda– Semiconductor Technology Beyond 7nm

• Material Challenges for EUV, Patrick Naulleau, Lawrence Berkeley National Laboratory
• Tuning the threshold voltage of carbon nanotube transistors for flexible, CMOS circuit, Evan Wang, PhD, Department of Materials Science and Engineering at Stanford University
• Low-Power Resistive Memory with 1D and 2D Electrodes, Feng Xiong, Ph.D. Stanford Pop Lab (EE) and Cui Lab (MSE)
• Carbon Nanotube Vias for End-of-Roadmap On-chip Interconnects, Cary Y. Yang, Professor, Electrical Engineering Department, Center for Nanostructures, Santa Clara University
• Advantages and Challenges of FinFET Devices and Technologies, Jack C. Lee, Professor of the Electrical and Computer Engineering Department, The University of Texas at Austin
• Fabrication and Characterization of Sub-100 nm Carbon Nanotube Vias, Changjian Zhou, Mansun Chan (Hong Kong University of Science and Technology); Anshul Vyas, Patrick Wilhite , Cary Y. Yang (Santa Clara University); Phillip Wang (Applied Materials)

November Agenda– Medical Applications of Plasma Processing

• Non-Thermal Plasmas for Biomedicine: A New Frontier in Plasma Processing, David B Graves, University of California Berkeley, Department of Chemical Engineering
• Investigating the Interface Between Plasmas and Aqueous Solutions, Alex Lindsay, North Carolina State University, Department of Nuclear Engineering

2013

February Agenda – Technology for Clean Energy

• Challenges and Solutions for More Sustainable Energy Systems, Stacey F. Bent, Stanford University
• Novel Plasmonic Materials for Energy-Related Devices, César Clavero, Ph.D., Lawrence Berkeley National Laboratory
• Process Development for Advanced Generation Crystalline Silicon Solar Cells, James Gee, Applied Materials
• Depth Profiling of Organic Photovoltaic and OLED Materials by Cluster Ion Beams, J.S. Hammond¹, S. N. Raman¹, S. Alnabulsi¹, N. C. Erickson² and R. J. Holmes²; ¹Physical Electronics, ²University of Minnesota
• Thermoelectrics (TE) at the Nanometer and Sun to Fiber (S2F) at the Micrometer, Nobuhiko “Nobby” Kobayashi, University of Santa Cruz
• Measurement of CdTe Ratio for Composition Control, Gary Mount, Larry Wang and Wesley Nieveen, Evans Analytical Group, 
• Sunny Future for the Solar Industry, KRS Murthy, I3 Solar
• Nanostructured Energy Conversion for Low‐power Energy Harvesting Devices and Beyond for High-power ‘Sun‐to‐fiber’ Solar Devices, Michael Oye and Nobuhiko “Nobby” Kobayashi, University of California, Santa Cruz
• Advances in MOCVD Process and Equipment Technology Enabling Solid State Lighting, G.D. Papasouliotis and Wei Zhang, Veeco Instruments, Inc.
• Technology and Economic Considerations for High Volume HBLED Lithography Manufacturing, Manish Ranjan, Ultratech

April – Plasma Processing for Novel Materials

• RIE / ICP ETCHING OF SiC using PLASMA-THERM VLR-700 ETCH TOOLS, by Necmi Bilir
• Real-Time Determination of Compositional Profiles in Structured Materials Using Laser Ablation and LA-ICPMS, Alexander A. Boľshakov, Jong H. Yoo, Jhanis J. González, and Richard E. Russo, Applied Spectra
• Integration of Disruptive Materials for SOLAR Advanced Non-Volatile Memories, Wilbur Catabay, Telefunken
• Introduction to Plasmas & Chemistries for Etching Novel Materials, Daniel L. Flamm, Microtechnology Law & Analysis
• Thin Film Application in Magnetic Recording, Zheng Gao, Hitachi Global Storage Technology
• Evolving Large Scale Quantum Computers, Travis Oh, D-Wave Systems Inc

June – 3D Packaging

• 3D Packaging for Memory Application, Ming Li, Ph.D., Rambus
• Considerations When Selecting A Wafer Level Bonding Process, Garrett Oakes, EV Group
• Overview of CMP for TSV Applications, Robert L. Rhoades, Ph.D., Entrepix
• Stress-induced Effects Caused by 3D IC TSV Packaging in Advanced Semiconductor Device Performance, V. Sukharev¹, A. Kteyan¹, J-H Choy¹, H. Hovsepyan¹, A. Markosian¹, E. Zschech², and R. Huebner²; ¹Mentor Graphics Corporation, ²Fraunhofer Institute for Non-Destructive Testing
• Cooling Three-Dimensional Integrated Circuits using Power Delivery Networks (PDNs), Hai Wei, Stanford University

November – Plasma Metrology and Applications

• Water Based Temperature Metrology, Dinh Chu, Giampietro Bieli, Youxian Wen, GEM/SensArray
• Evolution of RFEA Measurements at the Substrate, Hopkins, Impedan
• The Future of Your Career and Company: Avoiding the “Kodak Moment,” David Frigstad, Frost & Sullivan
• A CCP-Plasma Source with Operation in the High VHF to UHF Frequencies and Scalability to 450mm Substrates, A.R. Ellingboe, Dublin City University

2012

February – Technology for Clean Energy

• A Flow Battery for Grid-Scale Energy Storage, Vincent Battaglia, Lawrence Berkeley National Laboratory
• The Molecular Foundry at the Lawrence Berkeley National Laboratory: User Program: Statistics, Experiences, and Opportunities, David Bunzow
• Floating c-Si Thin Films for Solar Cells, U. Cohen and M. Roitberg, UC Consulting
• The Journey of SunPower to 20% Module Efficiency, Doug Kim, Gabriela Bunea, SunPower
• HB-LEDs and Solid State Lighting: Challenges and Opportunities, Tom Morrow, SEMI
• Characterization of Solar Grade Silicon Contaminants, Gary Mount, Evans Analytical Group
• Advances in ULTIMO™ Lithium Ion Capacitor (LIC) Technology, Jim Banas & Maria Peterson, JSR Micro & JM Energy
• Solar Technology; Crystalline Silicon PV Solar Cells, David Tanner, Applied Materials
• Correlation of Cell Efficiency with Photoluminescence Images, Bruce True, Intevac Corp.

May Agenda – Greenhouse Gas Emissions Management and Climate Protection

• Update on the Implementation of AB 32 Including the Cap-and-Trade Regulation, Brian Bateman, Bay Area Air Quality Management District
• Solar in the Future Energy Mix, Paula Mints, Navigant Energy

June Agenda – 3D Packaging

• Mechanical Stresses and Reliability Study of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH using Synchrotron X-Ray Microdiffraction for 3-D Integration and Reliability, A.S. Budiman (Los Alamos National Laboratory); H.-A. Shin, B.-J. Kim, S.-H. Hwang, Y.-C. Joo (Seoul National University); H.-Y. Son, M.-S. Suh, Q.-H. Chung, K.-Y. Byun (PKG Development Group); R. Caramto, L. Smith (SEMATECH); M. Kunz, N. Tamura (Lawrence Berkeley National Laboratory)
• Challenges and Solutions in 3DIC Extractions, Dusan Petranovic, Mentor Graphics
• Process Integration for 2.5D/3D – A Few Steps from the Summit, Niranjan Kumar, Applied Materials
• TSV Reveal Using Low-Selectivity CMP, Robert L. Rhoades, Paul Lenkersdorfer, and Dean Malta, Entrepix

September – Protecting Your Intellectual Property in a Changing Environment: Patent Strategies, Enforcement, & New U.S. Patent Law

• Tortoise and Hare, Lu Yin, Ogawa
• America Invents Act Patent Enforcement Before and After, Monroe, Christie, Parker, & Hale LLP
• Do’s and Don’ts of Patent Enforcement: Optimizing IP Value in Trying Times, Duane Mathiowetz, Pillsbury Winthrop Shaw Pittman LLP
• Do Sweat the Little Things, Joseph Bach, Nixon Peabody LLP

2011

February Agenda – NCCAVS Joint User Group Topical Conference on Photovoltaic Technology

• Trends in Photovoltaics, Dr. Peter Borden, Jasper Ridge LLC
• Kerf-Free Wafering: Technology Overview, Adam A. Brailove, Ph.D., Silicon Genesis Corporation
• Precision Process Power and Controls for Photovoltaic Manufacturing, Randy Heckman, Advanced Energy
• Modeling and Optimization of Silicon Solar Cells, Victor Moroz, Synopsys
• Characterization of Contamination in PV Materials, Ian Mowat, Karol Putyera, Larry Wang, Temel Buyuklimanli and Gary Mount, Evans Analytical Group
• The Flip Side of Technology: how plasma systems must evolve for solar PV applications, E. Ryabova, A. Skumanich, SolarVision Consulting
• The State of the PV Industry – An Association Perspective, Karen Savala, SEMI Americas
• For a Sunny Future, Roth & Rau

May – New Plasma Technology

• High Power Impulse Magnetron Sputtering: A journey from early research to advanced processing, André Anders, Lawrence Berkeley National Laboratory
• Atmospheric pressure gas plasmas for biomedical applications, Yuki Sakiyama and David Graves, Department of Chemical and Biomolecular Engineering University of California, Berkeley
• Improving the Quality of PVD Cu seed layer for Interconnect Metallization, A. Dulkin, E. Ko, A. Dulkin, E. Ko, L. Wu, I. Karim, K. Leeser, and K.J. Park, Novellus Systems, Inc., and L. Meng, D.N. L. Meng, D.N. Ruzic, Center for Plasma Center for Plasma-Material Interactions, University of Illinois

June Agenda

• CMP for TSV’s, Robert L. Rhoades, Ph.D., Entrepix
• Monolithic 3D DRAM Technology, Deepak C. Sekar, Brian Cronquist, Israel Beinglass, Paul Lim, Zvi Or-Bach, MonolithIC 3D Inc. 
• Stress-induced Effects Caused by 3D IC TSV Packaging in Advanced Semiconductor Device Performance, V. Sukharev¹, A. Kteyan¹, J-H Choy¹, H. Hovsepyan¹, A. Markosian¹, E. Zschech², and R. Huebner²; ¹Mentor Graphics Corporation, ²Fraunhofer Institute for Non-Destructive Testing

July – Advanced Plasma Technology for Semiconductor, Thin Film, & Solar Processing

• Capacitive and Inductive RF Plasma Sources for Industrial Applications, Valery Godyak, RF Plasma Consulting
• Nanofabrication for Patterned Magnetic Media, Dan Kercher, San Jose Research Center
• Towards Adaptive Kinetic-Fluid Simulations of Weakly Ionized Plasmas, Vladimir Kolobov and Robert Arslanbekov, CFDRC

November – Metrology for Plasma Applications

• Mass and Energy Spectrometry of Processing Plasmas, J.A. Rees, P. Hatton, D.S. Seymour, C.L. Greenwood, and D. Lundie, Hiden Analytical
• Retarding field analysis of the time averaged and time resolved ion energy distribution in RF and pulsed plasmas, David Gahan, Paul Scullin, Boris Dolinaj, Donal O’Sullivan and M.B. Hopkins, Plasma Research Group, Impedans Ltd
• EtchTemp Silicon Etch (ET-SE), Giampietro Bieli, KLA Tencor
• Geometry considerations for EEDF measurements using Langmuir probes, Steven Shannon, NCSU Nuclear Engineering

2010

February – Plasma Applications

• ICP-RIE of Ultrananocrystalline Diamond, N. Moldovan, H. Zeng, J. A. Carlisle, Advanced Diamond Technologies, Inc.
• Scaling Laws and Peculiarities of Micro and Macro Plasmas, Vladimir Kolobov & Robert Arslanbekov, CFDRC
• VUV Photons and Synergistic Roughening Mechanisms of 193 nm Photoresist in Inductively Coupled Plasmas, M. J. Titus, D. Nest, T.-Y. Chung, D. B. Graves, University of California, Berkeley
• Uniform Growth of Large Area a-Si/µc-Si Tandem Junction Thin Film Solar Cells by Capacitive Coupled PECVD, Yi Zheng, Alan Tso, Fan Yang, Rongping Wang, Tom Tanaka, Ned Hammond, Lin Zhang, Zheng Yuan and Brian Shieh, Applied Materials

April – Deposition

• Low Temperature Deposition of PECVD Dielectric Films, Jason Taylor, SVTC Technologies Inc.

June – Career Development and Networking Workshop

July – Advances in Plasma Technology

• Design specific variation in pattern transfer by via/contact etch process: full-chip analysis, Sukharev, Mentor Graphics
• Plasma Activation – An Enabling Technology for Wafer Bonding, Eric F. Pabo, EV Group
• Trends in Plasma Etching and Deposition for LED Fabrication, David Lishan, Plasma-Therm
• Monolayer Etching with Soft Plasmas, Ed Korczynski, BetaSights
• Insights into c-Si Processing for Photovoltaic Applications, Ismail Kashkoush and David Jimenez, Akrion Systems LLC
• Plasma diagnostics using harmonics analysis in processing plasmas, ChinWook Chung, Hanyang University
• Niche Market Opportunities for Small and Mid-sized Companies, Dr. Robert Castellano, The Information Network

August – Inspection and Metrology

• Semion, Impedans
• Specialty Techniques for Monitoring Process Temperature & Gas Concentrations: Phosphorescent Decay, Infrared Radiation, Photoacoustic Spectroscopy, Joe Sharp, LumaSense Technologies
• Improving Etch Tool Performance Using an In Situ Gas Flow Monitoring (GFM) & Control System, Kelly McDonough, Pivotal Systems
• Secondary electron excitation source for plasma optical emission spectroscopy diagnostics, Frank Mendoza , P.L. Stephan Thamban², J. Hosch¹, G. Padron-Wells², A. Kueny¹, K. Harvey¹, M. Whelan¹, M.J. Goeckner², ¹Verity Instruments, Inc., ²University of Texas at Dallas

October – Building Intellectual Property for the 21st Century

• Building a Patent: Drafting & What Can Happen Afterward, Daniel L. Flamm, Microtechnology Law & Analysis
• A Patent Owner’s Forum of Choice – The Rise of the International Trade Commission, Robert B. Morrill, Sidley Austin

December – Advanced Device Integration – FEOL/BEOL

• Process Technology Explosion: New Frontiers at Intersections of Semiconductor and Related Technologies, Brian Goodlin, Texas Instruments
• Developing a robust conditioning system in 300mm CuCMP – Better Ways to Build Better Wafers, John Zabasajja, Michael Pevny, Tammy Engfer and Doug Pysher, 3M Electronics
• FDSOI Metal Gate Transistors for Ultra Low Power Subthreshold Operation, S. A. Vitale, J. Kedzierski, P. W. Wyatt, M. Renzi, C. L. Keast, MIT Lincoln Laboratory

2009

February – MEMS Applications and Processing
June – BEOL Dielectric Etching
August – Instrumentation and Metrology for Plasma Processing

• Mid Infrared Absorption Spectroscopy System for Plasma Monitoring, Q-MACS Team, Neoplascontrol
• Chemical and Remote Plasma Clean Impedance Endpoint Detection, Turner, Forth-Rite Technologies LLC
• Electrical Non-contact Characterization of Plasma Processing Induced Damage on Blanket Oxides and Patterned Low-k Dielectrics, Laurent Kitzinger, Andrew Findlay, John D’Amico, Nikos Jaeger, Vladimir Talanov, Semilab

October – Plasma-Assisted Surface Modification Processes

2008

March – Front End Plasma Etch Applications

• Shrink and Control Critical Dimension Using Dielectric Etch Chamber for 45nm Technology and Beyond, Judy Wang, Shing-Li Sung, Zhifeng Sui, Eda Tencel, Ajey Joshi, Peter Hsieh, Shawming Ma, Jingbao Liu, Subhash Deshmukh, Applied Materials
• Striation Free Etch Technology, Fujino, Philtech Inc.

May – Greenhouse Gas Reduction Efforts in the Semiconductor Industry

• Fluorine : Optimised and sustainable cleaning agent for CVD processes, Shuttleworth, The Linde Group
• Greenhouse Gas Reduction and Energy Efficiency – Opportunities for Equipment Suppliers, Stanley Hughes, Applied Materials

June – Backend Dual Damascene Etch

• In-Situ Measurement of the Relative Thermal Contributions of Chemical Reactions and Ions During Plasma Etching, M.R. Tesauro (Qimonda Dresden GmbH & Co.), G.A. Roche (KLA-Tencor)

August – Plasma Etch Related Metrology and Diagnostics

• SD1024FH Super High Performance Imaging Spectrometer Imaging Spectrometer With SD1024FL Appendix, Mendoza, Verity Instruments, Inc.
• Precision Wireless Metrology Applications for Improved Productivity and Process Control, Hannaford, WaferSense™ CyberOptics Semiconductor, Inc. 
• Microplasma Optical Emission Sensors for Process Chemistry Analysis, Chris Doughty, Verionix, Incorporated

September –

• New Applications for Optical Emission Spectroscopy, Powell, Litvak, Lightwind OES Solutions
• …rethink your Metrology, Cunnane, Metryx

December – Advanced BEOL Integration

2007

May – BEOL Dielectric Etching

• Wafer Based Diagnostic for Dielectric Etching Plasmas, Greg Roche, Paul Arleo, Paul MacDonald, KT Promesys, KLA-Tencor
• Ion Beam Interactions with Advanced Photoresist Polymers, D.G. Nest, M. Goldman, D.B. Graves (University of California, Berkeley); S. Engelmann, R.L. Bruce, B.F. Smith, T. Kwon, R. Phaneuf, G.S. Oehrlein (University of Maryland, College Park); C. Andes (Rohm and Haas Electronic Materials); E.A. Hudson (Lam Research Corp.); P. Lazzeri and M. Anderle (ITC-Irst)
• Tutorial on Using RF to Control DC Bias, Jim McVittie, Stanford University
• New Challenges in Etching Ultra Low-k Dielectrics, A. Li, K. Zhou, Y. Zhou, R. Cheung, S. Parikh and M. Armacost, Applied Materials

November – Intellectual Property in Nano & Semiconductor Technology

• The Process of Creating Patented Inventions, Daniel L. Flamm, Buchanan, Ingersoll & Rooney LLP
• Intellectual Property and Counterfeits in China, Joseph Bach, Sughrue Mion PLLC

December

2006

January –

• In-band Spurs for a V-I probe caused by multi-frequency plasma effect, Yufeng Han, Aaron Radomski,Yogi Chawla and Brent Irvine, MKS
• Dual Frequency Dry Etching for Dual Frequency Dry Etching for Advanced Memory Applications Advanced Memory Applications, Robert Ditizio, Tegal Corporation

March –

• Synergistic Effects of Gas Mixtures in a transformer-coupled toroidal plasma source for remote chamber cleaning, Herb Sawin, MIT Plasma Processing Group

May –

• Study and Reduction of Plasma Damage of Porous Ultra Low-k Dielectrics during Photoresist Stripping, Songlin Xu, Mattson
• Effect of Species Density and Ion Scattering During Ashing on Ultra Low-κ Inter-Level-Dielectric (ILD) Materials, M.A. Worsley, S.F. Bent (Stanford University); N.C.M. Fuller,  J. Doyle, M. Rothwell, T.J. Dalton (IBM Research Division); T.L. Tai (Hopewell Junction)
• Surface Texturing of 193 nm Photoresist under Ar+ Bombardment: Effect of Ion Energy, Angle of Incidence and Substrate Temperature, D. Nest, E. Pargon and D. Graves (University of California, Berkeley); S. Engelmann and G. S. Oehrlein (University of Maryland); C. Andes (Rohm and Haas Electronic Materials); E. A. Hudson (Lam Research Corp)
• The Transition from Saturated (c-C4F8) to Unsaturated (1,3-C4F6) Perfluorocarbons: Effects on Selectivity and ARDE in Via-hole Plasma Etch Applications, Teressa L. Anglinmatumona, Intel Corporation

July –

• Integrated CD Shrink Methodologies for Contact Etch, Scott Allen, Rich Wise, and Nikki Edleman (IBM); Judy Wang, Melody Chang, Shawming Ma, and Kang-lie Chiang (Applied Materials); TjinTjin Tjoa (Hopewell Junction)
• Control of Contact Hole Distortion by Using Polymer Deposition Process (PDP) for sub-65nm Technology and Beyond, Judy Wang, Applied Materials
• Etch Processes for Nano-scale Vertical MOS Devices, Hoon Cho, Pawan Kapur and Krishna C. Saraswat, Stanford University

October –

• MEMS Development at Maxim Using STS VPX, Yaqiang Wang, Quanbo Zou, Dino Lei, Uppili Sridhar, and Tito Chowdhury, Dallas Semiconductor-Maxim
• Enabling DRIE processes for high potential MEMS products, Michel Puech, Alcatel 
• Optical MEMS platform for low cost on-chip integration of planar light circuits and optical switching, J. Kubby, UC Santa Cruz

2005

January –

• Lithographically Generated Line Edge Roughness in Photoresist, Adam R. Pawloski, Alden Acheta, Bruno La Fontaine, Scott Bell, Harry J. Levinson, Advanced Micro Devices
• Line Edge Roughness Reduction at the 90nm Technology Node for Contact and Trench Etched Features, David Farber, Bill Dostalik, Brian Goodlin, Robert Kraft, Tom Lii, Texas Instruments
• Line Edge Roughness Reduction for Advanced Metal Gate Etch with 193nm Lithography in a Silicon Decoupled Plasma Source Etcher (DPSII), Tito Chowdhury, Hean-Cheal Lee, A Renaldo, K Ikeuchi, B Bruggermann (Cypress Semiconductor R&D); Yan Du, Meihua Shen, Jinhan Choi, and Shashank Deshmukh (Applied Materials)
• Roughness Metrology The next Dimension, Yogev Barak, Applied Materials

March –

• Effects of Dual Bias Frequency on SiO2 Contact Hole Etching in Very High Frequency Fluorocarbon Plasmas, Wonseok Lee, Shawming Ma, Jang Gyoo Yang, Daniel Hoffman and Yan Ye, Applied Materials

April –

• Automated CD-SEM Recipe Generation Utilizing Design Pattern Layout, Brandon Ward, Lorena Page, Hitachi High Technologies America, Inc.

June –

• The control of Electrode Impedance, GasInjection and Wafer-Temperature Radial Profile and their Effects on Poly-Gate Etching, Lee Chen, Yuji Tsukamoto, Fumihiko Higuchi, and Masaaki Hagihara (Tokyo Electron Massachusetts, LLC); Yohei Yamazawa (Tokyo Electron AT.LTD ); Tetsuya Tatsumi, and Atsushi Kawashima (Sony Corporation)
• Unraveling the Complex Processes in a Fluorocarbon Plasma, Matthew Goeckner, University of Texas at Dallas

July –

• A 300mm test wafer to evaluate charging damage, Fumio Otoi, Yuji Furumura, Philtech Inc.
• Minimizing Plasma-Induced Charging Damage during Multi-Step Etching of Dual-Damascene Trench and Via Structures with Process Optimization, M. Kutney, S. Ma, D. Buchberger, A. Zhao, G. Delgadino, D. Hoffman, and K. Horioka, Applied Materials

September –

• Chamber Wall Effects on Polycrystalline-Si Reactive Ion Etching in Cl2: A Multiple RealTime Sensors Study, Fred L. Terry, Jr., University of Michigan
• Consumables Erosion and Temperature Effects on Dielectric Etch Rates, Russell Ethridge, Tim Nguyen, Steve Lum, Tito Chowdhury, David Muise, Dallas Semiconductor

December

2004

February –

• In-Situ Production Process Detection and Chamber Matching Using Temperature Metrology Sensors and Diagnostics, Paul MacDonald, OnWafer Technologies

March –

• Self-aligned Contact Etch Development for 90 nm Technology Node, Mehran Sedigh, Jie Zhang, and Harry Lee (Cypress Semiconductor); James Stinnett, and Ajey Joshi (Applied Materials)
• Advance Gate CD Control by Gate Dielectric Hard Mask Open Process Optimization, Gerardo Delgadino, Yasush Takakura, Shawming Ma, and Yan Ye, Applied Materials
• Deposition and Patterning of Zirconium and Hafnium Oxide as High-k Gate Dielectrics, Jane P. Chang, University of California, Los Angeles

April –

• Multivarible vs. Univariable APC, Kamyar Faron, Mark Freeland, Ole Krogh, Sukesh Patel, and Gayathri Raghavendra, Blue Control Technologies

May –

• Integrated Dual Damascene Etching for 65nm Technology and Beyond, Yan Ye, Ph.D., Applied Materials
• Dual Damascene Etch; Challenges at the 65nm Node and Beyond, Makarem Hussein, Intel Corporation
• Repairing Process-Induced Damage to Porous Low-k ILDs by Post-Ash Treatment, Anil Bhanap, Teresa Ramos, Anna Camarena and Ananth Naman, Honeywell Electronic Materials

July –

• Chamber Pressure Control, Martin Tollner, BOC Edwards (UK)
• “Electron Shading”: Inevitable … or Not ?, Wes Lukaszek, Wafer Charging Monitors, Inc.
• Plasma Induced Charging Damage: From An Semiconductor Equipment Vendor Point of View, Shawming Ma, Applied Materials

August –

• RF Metrology – Tools and Process Capability, Philip Schmitt, and Mark Rousavy, MKS Confidential
• Component Health Monitoring and Diagnostics in Plasma Etch Chambers using In-Situ Temperature Metrology, Paul MacDonald, and Michiel Krüger, OnWafer Technologies, Inc.

September –

• Deep Reactive Ion Etch Process Development for MEMS Rotary Engine Power System, Ning Chen, University of California, Berkeley
• MEMS Etching Technology, T.-K. Allen Chou, Intel Corp.

December

2003

January –

• Line Edge Roughness Reduction for Advanced Metal Gate Etch with 193nm Lithography in a Silicon Decoupled Plasma Source Etcher (DPS II), T. Chowdhury, H. Lee, R. Khen, and H. Bamnolker (Cypress Semiconductor); Y. Du, M. Shen, S. Deshmukh, and J. Choi (Silicon Etch)
• Plasma Etching of Cobalt Silicide, S. Marks, and G. Beique, Tegal Corporation

March –

• PFC’s in a Baker’s Dozen -a Retrospective on the Technical and Non-Technological Issues, Mike Mocella, DuPont Electronic Gases
• Exhaust Management of Etch Processes, Joe Van Gompel, BOC Edwards
• Semiconductor Manufacturers Leading the Way for Climate Protection, Scott C. Bartos, U .S. Environmental Protection Agency

April –

• Measuring and Minimizing Line Edge Roughness in BEOL Damascene Dielectric Patterning, Calvin Gabriel, Bryan Choo, Carmen Morales, and Bhanwar Singh, AMD

May –

• Improved Control of Chamber condition through new Waferless Auto Clean, S. Ullal, S. Gangadharan, E. Edelberg, J. Daughtery, H. Singh, and V. Vahedi (Lam Research Corporation); A. Godfrey, and E. Aydil (University of California, Santa Barbara)
• Modeling and Diagnostics Studies of Si Plasma Etch and Etch By-Products, David B. Graves, University of California, Berkeley

June –

• Manufacturing Qualification of Plasma Wafer Cleaning Processes for FEOL and BEOL Applications, Han Xu, ULVAC Technologies, Inc
• The Effect of Ash Processes on Inorganic Porous Low-k Materials, Lei Jin, Anil Bhanap, Anna Camarena, Ananth Naman, Honeywell Electronic Materials
• Photo resist Strip Capabilities at 90nm and below, J. Devrajan, Ph.D, Novellus

August –

• The Chip Insider’s Graphics File, VLSI Research Inc.
• The Dark Side of Moore’s Law: Threats and Opportunities in an Era of Rapid Technology Commoditization, Mitchell Halpern Ph.D., SRI Consulting
• Trade Secrets: The Fundamental IP Right, James Pooley, Milbank, Tweed, Hadley & McCloy

September –

• A Highly Symmetrical Capacitively Coupled High Density Plasma Reactor with Agile Wafer Heating for Ferroelectric Stack Etch, Geneviève Béïque, Steven Marks, John Almerico, Paul Werbaneth, Tegal
• New ICP Technology for Semiconductor Material Processing, V. A. Godyak, RF Plasma Consulting

October –

• Patterning Magnetic Recording Media by Patterning Magnetic Recording Media by Deposition on Imprinted, Etched, Pillars, Gary McClelland, Mark Hart, Charles Rettner, and M. Sanchez (IBM Research Division); Margaret Best, Bruce Terris, and Manfred Albrecht (Hitachi San Jose Research Center)
• Turning the Evil into Good: Plasma Synthesis of Silicon Nanoparticles and Potential Applications, U. Kortshagen, University of Minnesota
• Plasma Aided CVD of Carbon Nanotubes, Brett A. Cruden, NASA Ames Research Center
• Plasma Diagnostics for Nanoscale Fabrication, Alexander A. Boľshakov, Brett A. Cruden, Surendra P. Sharma, NASA Ames Research Center

December –

• Integration of Modeling and Simulation into Process Development, P.L.G. Ventzek, S. Rauf, P.J. Stout, Motorola and Digital DNA
• Modeling in FaST Division, G. Janik, KLA-Tencor
• Gas Surface Interaction Modeling for Carbon Nanotube Deposition, D. B. Hash, T.R. Govindon, and M. Meyyappan (NASA Ames Research Center); D. Bose, B. Cruden (ELORET Corp.); K.B.K. Teo, R.G. Lacerda, N.L. Rupesinghe, G.A.J. Amaratunga, W.I. Milne (University of Cambridge)

2002

January –

• Sidewall Passivation Mechanism of CHxFy Added Polysilicon Gate Etch Processes, Th. Lill, F. Ameri, S. Deshmukh, Songlin Xu, D. Podlesnik, and J. Holland (Applied Materials); L. Vallier, O. and Joubert (CNRS/LTM)
• Integrated CD Metrology for Poly Si Etching, G.P. Kota, V.Venugopal and R.A. Gottscho (Lam Research Corporation); T.G. Dziura, U.Whitney and A. Levy (KLA-Tencor)
• Sub 0.1um Gate Etch Challenges for Memory Applications, T. Chowdhury, K. Ikeuchi, Cypress Semiconductor

April –

• Etching on SiLK an Organic Low-k Material, Cecilia Quinteros, Ph.D., Helen Zhu, LAM Research 
• In-Situ Etch Depth Monitoring for Low-± Damascene Trench Etch, Dimitris Lymberopoulos, Ph.D, Applied Materials

May
June Agenda –

• Tapered Trenches for Microelectromechanical Systems, M. Rattner, B. Cooper, R. Guenther, J. Chinn, AKT/Applied Materials
• Optimization of Deep Hole Etching in Silicon for 3-D X-ray Detectors, E. Peroziello, J. Hasi, S. Parker, C. Kenney, S. Beckwith, N. Latta, Stanford University
• Impact of SiOC Low K Materials on Dual Damascene Patterning, Gary Ray, Ph.D (Novellus Systems Inc.); Steve Lassig (LAM Research, Inc.)
• Plasma Etching for Optical MEMS: Scanning Micromirrors Based on Self-Aligned Vertical Combdrive Actuators, Stefan Zappe, Uma Krishnamoorthy, Daesung Lee and Olav Solgaard, Stanford Microphotonics Laboratory

August –

• What Goes on Behind Open Doors: Fabrication Capabilities at UC Berkeley Microfabrication Laboratory, Tsu-Jae King, Katalin Voros, Dr. Bill Flounders, University of California, Berkeley and Berkeley Sensor and Actuator Center

October –

• Material Issues and Impact on Reliability of Cu/Low k Interconnects, Paul S. Ho, University of Texas at Austin
• Etch Challenges in Low k Integration, Raymond Hung, Process Module Group 

December –

• The PE-ALD of Ta Based Metals/Nitrides: The Growth, Materials ALD of Ta Based Metals/Nitrides: The Growth, Materials Properties, and Applications Properties, and Applications to Future Device Fabrications, Hyungjun Kim and Steve M. Rossnagel, IBM Research Center
• Fundamental Vacuum Beam Studies of Radical Enhanced Atomic Layer Chemical Vapor Deposition (REAL-CVD) of TiN, Dr. Frank Greer,Dr. D. Fraser, Dr. J.W. Coburn, and Professor David B. Graves, University of California, Berkeley