CMPUG Announcements

Ashwani Rawat, Intel Corp., ashwani.k.rawat@intel.com
Todd Buley, Dow Electronic Materials, tbuley@dow.com
Dinesh Koli, Global Foundries, dinesh.koli@globalfoundries.com

12:30 – 12:35 PM Ashwani Rawat/Todd Buley/Dinesh Koli, Opening Remarks/Introductions

12:35 – 1:05 PM  Len Jelinek, IHS Insights, “Global Manufacturing Update – Opportunities and Pitfalls for Manufacturers in 2^nd half of 2018 and beyond”

1:05 – 1:35 PM Sai Vegunta, Micron, “Next Gen CMP Challenges for 3D Memory Architectures”

1:35 – 2:00 PM Olga Samsonenka, Andy Kim, University of Washington, “Investigation of NMR-based Surface Area Measurement as a Quality Monitor for Nanoparticle Silica Abrasives”

2:00 – 2:25 PM  Gabriela Diaz ^a, Lauren Peckler ^a, Yasa Sampurno ^a,b , Ara Philipossian ^a,b,  ^a University of Arizona, ^b Araca Incorporated, Tucson, AZ, “New Insights into the Tribological and Kinetic Attributes of Retaining Rings in Chemical Mechanical Planarization”

2:25 – 2:40 PM Coffee/Networking Break 

2:40 – 3:10 PM  Michael E. Mills, DOW Electronic Materials, “Molecular Design of CMP Consumables for Advanced (<10nm) Processing Technologies”

3:10 – 3:35 PM Rajeev Bajaj, Applied Materials, “New Paradigms in CMP Consumables”

3:35 – 4:00PM Alex Tregub, Intel, “Developing Robust Quality Systems for CMP Solid Consumables”

4:00PM-4:25PM  Mike Corbett, Linx Consulting, “Impact of Advanced Memory Technologies on CMP Industry”

4:25PM-4:50PM Chun Lu, Versum Materials, “Formulated Products for W CMP”

4:50PM – 5:00PM Ashwani Rawat/Todd Buley/Dinesh Koli, Concluding Remarks/Wrap-up

All presentations will be requested to be posted on the CMPUG Proceedings webpage approximately 1-2 weeks following the meeting.

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