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CMPUG Announcements

CMPUG Spring Meeting – Call for Papers
“Advances in CMP Consumables, Materials and Tools”

ABSTRACT DEADLINE: MARCH 27, 2019

Date, Time & Location:

April 11, 2019
Times: TBD (full day)

Micron Technology Boise (Idaho)
8000 S. Federal Way
Boise, ID 83707

PARKING: Available in Building 37 parking lot. Directions and more detailed info. to follow.

FREE ONLINE REGISTRATION*
*Advance registration required for security approval
REGISTER HERE

Platinum Sponsors (Technical Symposium)

Co-Chairs:
Michael Pevny, 3M, mpevny@mmm.com
Andrew Carswell, Micron Technology, acarswell@micron.com

Abstracts are now being accepted for the Chemical Mechanical Planarization Users Group (CMPUG) April 11, 2019 Symposium on Advances in CMP Consumables, Materials and Tools. The symposium will provide an international forum for academic researchers, industrial practitioners and engineers from around the world for the exchange of information on state-of-the-art research in CMP semiconductor technology. The CMPUG promotes the exchange of opportunities, ideas, friendly relationships and research collaboration. The areas of focus for this meeting will be the following:

  • CMP consumables and materials
  • CMP Polishing and Metrology Tools
  • CMP Process Integration

Abstract/Presentation Submissions
Please submit an abstract (less than 200 words) of your presentation by March 27, 2019 to the meeting Co-Chairs,  Andy Carswell,  acarswell@micron.com and Michael Pevny, mpevny@mmm.com.

Authors will be notified of acceptance by return e-mail.

All accepted presenters are required to submit their presentations in pdf or pptx format, approved by their respective organizations/employers for public release, by April 8, 2019.

All presentations will be posted on the CMPUG Proceedings webpage within 2 weeks following the meeting.

Hotel Information