CMP User Group Meeting:
Date, Location & Registration:
April 12, 2018
1:00 – 6:00 p.m. (Badge pick up @ 12:30 p.m.)
Nanofab South Auditorium
SUNY Polytechnic Institute/CNSE
University of Albany
255 Fuller Road
Albany, NY 12203
FREE PARKING: Follow the event parking sign (to be posted by security prior to the event)
FREE ONLINE REGISTRATION*:
NEED TO REGISTER IN ADVANCE FOR SECURITY APPROVAL!
*You will need to bring your passport if you are not a U.S. Citizen
12:30 pm Registration/Badge Pick up at the security desk.
12:50 pm Welcome and Acknowledgment of sponsors by Michael Pevny, 3M and Dinesh Koli, GlobalFoundries
1:00 pm Outlook for CMP Consumables, Mike Corbett, Linx Consulting
1:20pm Recent Trend of CMP Equipment Platform and its Requirement of Process and Consumables: BEOL CMP, Sunghoon Lee, GlobalFoundries
1:40 pm Particle Developments as an Enabler of Next Generation Ceria Slurries, Nate Urban, Ferro
2:00 pm Almost Complete Removal of sub-90nm Ceria Particles from Silicon Dioxide Surfaces, Jihoon Seo, Clarkson University
2:15 pm Studying Effects of Surfactants on CMP Slurries with Holographic Characterization, Laura Philips, Spheryx Inc.
2:35 pm Reduced Cost of Ownership Oxide CMP Process using 300mm Consumables for 200mm Processing, Christopher Eric Brannon, Texas Instruments
2:55 pm 3D Trajectories, Diffusion, and Interaction Energies of Ceria Particles on Glass Surfaces, Akshay Gowda, Clarkson University
3:10 pm Coffee Break – Networking
3:40 pm High Efficiency Post-CMP Cleans for Advanced FEOL and MOL Applications, Paul Bernatis, Dupont-EKC Technology
4:00 pm Tuning Wear Rate and Surface Finish of CMP Pads via Precise Control of Pad Conditioner Features, Matthew Fritz, 3M Company
4:20pm Tribocorrosion Mechanism for Tungsten Void in CMP in-situ Cleaning, Hong Jin Kim, Global Foundries
4:40 pm Assay Characterization of Industrial CMP Slurries Based on Densitometry, Refractive Index and Dynamic Light Scattering, Leticia Vázquez Bengochea, University of Arizona
4:55 pm Advanced Cu CMP Slurries for Advances Node Cu CMP Applications, Tom Shi, Versum Materials
5:15 pm Cobalt Buff Step CMP for Middle of the Line Applications and Reduction in Slurry Consumption Using a Novel Slurry Injection System, Calliandra Stuffle, University of Arizona
5:30 pm ICPT Announcement and concluding remarks by Michael Pevny, 3M and Dinesh Koli, GlobalFoundries
5:40 pm Meeting adjourn
6:00 pm Gratis Dinner served following the conclusion of the talks just outside of the meeting room.
All presentations will be posted on the CMPUG Proceedings webpage and will be live via webcast.
If you would like to sponsor a user group meeting please check out the
NCCAVS User Groups Marketing Opportunities