Question? Call 530-896-0477
avs_grayscale
NCCAVS User Groups
NCCAVS
AVS
  • Overview
  • CMPUG
    • About
    • Announcements
    • Committee
    • Proceedings
      • ICPT 2022 Proceedings
    • Schedule
  • JTG
    • About
    • Announcements
    • Committee
    • Proceedings
    • Schedule
  • PAG
    • About
    • Announcements
    • Committee
    • Proceedings
    • Schedule
  • TFUG
    • About
    • Announcements
    • Committee
    • Proceedings
    • Schedule
  • Join

CMPUG Announcements

NCCAVS Joint User Group Meeting (CMPUG, PAG & TFUG)

TOPIC: Packaging Beyond the Mainstream

MEETING DATE: Wednesday, September 13, 2023
TIME: 
12:30 p.m.-3:20 p.m. (PT) TIMEZONE CONVERTER
Platform: Zoom Platform

FREE TO ATTEND! ADVANCE REGISTRATION REQUIRED – Zoom login details provided upon registration!

 

REGISTER FREE
2023/09/13 10:00:00

Platinum Sponsors

Gold Sponsors

Silver Sponsors

The Northern California Chapter of the American Vacuum Society invites you to participate in a Joint User Group Meeting on Wednesday, September 13, 2023. The meeting is being hosted by NCCAVS via the CMP Users Group, the Plasma Applications Group, and the Thin Film Users Group.

AGENDA

12:30 p.m.  Welcome and Acknowledgement of Meeting Sponsors
Co-Chairs: Rob Rhoades, Jeff Shields, Paul Werbaneth

12:40 p.m.  Knut Gottfried, ErzM and Fraunhofer ENAS, “Waferbonding and CMP – A Perfect Couple”

1:10 p.m.  Liangyu Chen, NASA, “Pt / HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications”

1:40 p.m.  Scott Sikorski, IBM, “The CHIPS Act-related National Advanced Packaging Manufacturing Program”

2:10 p.m.  P M Raj, Florida International University, ”Hybrid Multiscale Manufacturing Technologies for Heterogeneous Package Integration”

2:40 p.m.  G. Bahar Basim, Intel, “A Review on CMP Challenges in HWB and Wafer Level Packaging”

3:10 p.m.  Thank you and adjournment

View Abstracts & Bios
All presentations from the joint meeting will be posted on the CMPUG, PAG, and TFUG Users Group Proceedings webpage ~2 weeks following the meeting.

CO-CHAIRS:

Rob Rhoades, X-trinsic, zestrion@gmail.com
Jeff Shields, GlobalFoundries, jeffrey.shields@att.net
Paul Werbaneth, Independent Consultant, pfwerbaneth@gmail.com

Sponsorship

If you would like to sponsor a 2023 or 2024* User Group (CMPUG, JTG, PAG, or TFUG) meeting please check out opportunities at:

NCCAVS User Groups Marketing Opportunities

*2024 Schedule is TBD

International Conference on Planarization Technology (ICPT 2023)
Kanazawa, Japan
October 30-November 2, 2023

One of the enabling technologies that makes possible digital devices like cell phones, tablets, computers, new automobiles, and a myriad of other devices we use every day, is Chemical Mechanical Polishing. This year, the ICPT will be held at the Kanazawa Tokyu Hotel in Kanazawa, Japan, October 30-November 2, 2023. Details describing the registration process, the hotel venue, and the technical program  are available at: https://www.icpt2023.org. This is the world’s largest and most important gathering of international CMP scientists,  research engineers, and technologists. This conference rotates once each year through six international venues. Invited speakers include CMP technology leaders from companies such as Samsung, Micron, Applied Materials, Texas Instruments, Ebara, and Kioxia. Leading edge presentations will include a full-day technology tutorial on October 30, and then three days of research related presentations from multiple speakers representing commercial entities, colleges, universities and research organizations. After-hours entertainment will include a visit to the Japanese Gold Leaf Decoration Experience, and also presentations by Japan’s leading swordsmiths and sword craftsmen.

Bob Roberts
Chair, United States CMP User Group

CMPUG

  • About
  • Announcements
  • Committee
  • Proceedings
    • ICPT 2022 Proceedings
  • Schedule
  • Join

Featured Sponsor

SPONSOR FORM
OverviewCMPUGJTGPAGTFUGJoin
© 2017-18 AVS. All Rights Reserved.