CMPUG Announcements

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Abstracts are now being accepted for the Chemical Mechanical Planarization Users Group (CMPUG) December 4, 2024 Symposium on Advances in CMP and Post-CMP Cleans (related to integrated cleaning systems) plus related upstream and downstream technologies.  The symposium will provide an international forum for academic researchers, industrial practitioners, and engineers from around the world for the exchange of information on state-of-the-art research in CMP and Post-CMP Cleans in the semiconductor, MEMS, and nanotechnology industries.  The North America CMP User Group promotes the exchange of opportunities, ideas, friendly relationships and research collaboration. The areas of focus for this meeting will be the interplay of the following (Collaboration Encouraged):

• CMP and Post-CMP Consumables and Materials
• CMP and Post-CMP Polishing/Cleaning Systems and Metrology Tools
• CMP and Post-CMP Process Integration

PLEASE NOTE: The papers will not be limited to the CMP of thin films; new and unique substrate materials are being encouraged, especially WBG materials such as SiC, GaN, GaOx, AlN, CVD diamond, and others. While we strive to keep these technical meetings “technical” in format, in their overall nature, and in the specific message, presenters of course put their logos and their company names on their presentation slides and receive very good and effective recognition in that manner.

Abstract/Presentation Submissions
Please submit an abstract (less than 200 words) of your presentation no later than Thursday October 31, 2024, to the meeting Co-Chairs, Bob, Katrina, Nagella, or Richard.

Authors will be notified of acceptance by return e-mail.