CAMP (Clarkson University) and CMP Users (North America):
Date, Time & Location:
August 12-15, 2018
Crown Plaza Lake Placid
101 Olympic Drive
Lake Placid, NY 12946
Co-Chairs:
S. V. Babu, Clarkson University
Hirokumi Hiyama, EBARA
Ashwin Chockalingam, Applied Materials
Andrew Carswell, Micron
Matt Prince, Intel
Dinesh Koli, GLOBALFOUNDRIES and CMP Users Group
Har P. Amanapu, IMB
Taesung Kim, SKKU, Korea
Paul Feeney, Versum Materials and CMP Users Group
Michael Pevny, 3M and CMP Users Group
Arthur Chen, NTUST, Taiwan
General Information
Chemical-Mechanical Planarization has come to occupy a central role in many industrially important technologies. This workshop, to be held in a Gordon conference type format, will focus on several fundamental aspects of chemical-mechanical planarization including:
- particle and colloidal aspects
- polishing mechanisms
- pad/conditioning behavior
- flow characterization
- Cu/barrier film planarization
- STI, Nitride/Poly, etc. polishing
- defects and post-polish cleaning
- low-k films and integration issues
- 300 mm wafer issues
- MEMS/MOEMS
Invited Speakers from End users, Tool, Pad and Slurry manufacturers, and Universities will present their recent research results. As has been the practice in recent years, a poster session will be organized.
Details will be posted on the bulletin board at www.clarkson.edu/camp as soon as they are available.
For more information contact Leila Boyea, Clarkson University
Phone: 315-268-3750 or by Email: leila@clarkson.edu
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