The Chemical Mechanical Planarization Users Group (CMPUG) Symposium on Advances in CMP Consumables, Materials and Tools commences on April 22, 2021. The symposium will provide an international forum for academic researchers, industrial practitioners and engineers from around the world for the exchange of information on state-of-the-art research in CMP semiconductor technology. The CMPUG promotes the exchange of opportunities, ideas, friendly relationships and research collaboration. The areas of focus for this meeting will be the following:
- CMP Consumables and Materials
- CMP Polishing and Metrology Tools
- CMP Process Integration
1:10 p.m. Measuring Large Particle Contaminants in Cerium Oxide Chemical Mechanical Polishing, (CMP) Slurries with Total Holographic Characterization, Laura A. Philips, Spheryx, Inc
1:35 p.m. Slurry Injection System (SIS) Implementation in Dielectric and Metal CMP for III-V Semiconductors, John Zabasajja, HRL Laboratories
2:00 p.m. CMP Process Challenges for mmWave Si Technology, Hong Jin Kim, Global Foundries
2:25 p.m. Mixing and Handling Challenges with Next Generation Slurries, Carlo Aparece, Mega Fluid Systems
2:50 p.m. Announcements
3:00 p.m. Effect of Process Variables on CMP Process Temperature, Catherine Bullock, Axus Technology
3:25 p.m. A New Kinetic Removal Rate Model for Tungsten CMP, Ara Philipossian, Araca Inc.
3:50 p.m. Preventing Cross Contamination with MIID (Malema™ Interconnect Interlock Device), Rahul Malani, Malema Sensors
4:15 p.m. Effective Slurry Concentration Monitoring Using Refractive Index, Tracy Gast, Entegris
4:40 p.m. Nanoparticle Characterization Introduction: DLS, Diffraction, and NTA, Dr. Jeff Bodycomb, HORIBA Scientific
All presentations will be posted on the CMPUG Proceedings webpage within 2 weeks following the meeting.