CO-CHAIRS:
Scott Lawing, Kinik North America, slawing@kinikna.com
Jeff McKinnis, Fujimi Corporation, jmckinnis@fujimico.com
Abstracts are now being accepted for the Chemical Mechanical Planarization Users Group (CMPUG) October 21, 2021 Symposium on Advances in CMP Consumables, Materials and Tools. The symposium will provide an international forum for academic researchers, industrial practitioners and engineers from around the world for the exchange of information on state-of-the-art research in CMP semiconductor technology. The CMPUG promotes the exchange of opportunities, ideas, friendly relationships and research collaboration. The areas of focus for this meeting will be the following:
Abstract/Presentation Submissions
Please submit an abstract (less than 200 words) of your presentation by October 1, 2021 to the meeting Co-Chairs, Scott Lawing slawing@kinikna.com and Jeff McKinnis, jmckinnis@fujimico.com.
Authors will be notified of acceptance by return e-mail.
All accepted presenters are asked to submit their presentations in pdf or pptx format, approved by their respective organizations/employers for public release, by October 18, 2021.
All presentations will be posted on the CMPUG, PAG and TFUG Proceedings webpage within 2 weeks following the meeting.
