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Date, Location & Registration:
July 12, 2017
12:30 pm – 4:00 pm
PARC 55 Hotel
55 Cyril Magnin Street., San Francisco, CA 94102 (public parking nearby)
FREE REGISTRATION – Click here
Chairs:
- Ashwani Rawat, Intel, ashwani.k.rawat@intel.com
- Todd Buley, Dow Electronic Materials, tbuley@dow.com
Agenda & Speakers:
12:30 – 12:40 PM Ashwani Rawat/Todd Buley, Opening Remarks/Introductions
12:40 – 1:10 PM Len Jelinek, IHS Insights, “Global Manufacturing Update – Opportunities and Pitfalls for Manufacturers in 2nd half of 2017 and beyond”
1:10 – 1:30 PM Michael White, Entegris, “Challenges in Cleaning Tungsten and Cobalt for advanced node Post CMP and Post Etch Residue Removal Applications”
1:30 – 1:50 PM Matthew Bahr, Ara Philipossian, University of Arizona, “Effect of Water Dilution and Method of Slurry Dispense on Silicon Dioxide Removal Rate for STI CMP using a Ceria Slurry”
1:50 – 2:10 PM Marty DeGroot, DOW Electronic Materials, “Status of CMP Materials”
2:10 – 2:30 PM Coffee/Networking Break
2:30 – 2:50 PM Frank Tolic, AIM Photonics, “CMP in Photonics Area”
2:50 – 3:10 PM Allan Biegaj, SCIA Systems, “Sub-Aperture Ion-Milling based Planarization”
3:10 – 3:30 PM Mike Corbett, Linx Consulting, “Developments in CMP and Impact on CMP Consumables”
3:30 – 3:50 PM Sanjay Baliga, SEMI, “Environmental Challenges”
3:50 – 4:00 PM Ashwani Rawat/Todd Buley, Concluding Remarks/Wrap-up
All presentations will be requested to be posted on the CMPUG Proceedings webpage approximately 1-2 weeks following the meeting.