TOPIC: Novel Applications of Advanced Semiconductor Device Packaging Technology
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12:45 p.m. Welcome and Acknowledgement of Meeting Sponsors, Joint User Group Meeting Co-Chairs Rob Rhoades, Jeff Shields, Paul Werbaneth
1:00 p.m. David Lishan, Ph.D., Plasma-Therm, Higher Yield, Lower Cost Power Devices Through Plasma Dicing Process Integration
1:30 p.m. Joseph Suttle, Ph.D., IBM Quantum, Advanced Packaging for Superconducting Quantum Processors
2:00 p.m. Alissa Fitzgerald, Ph.D., A.M. Fitzgerald & Associates, MEMS: Strategies for Co-development of the Electronics and the Package
2:30 p.m. Matt Francis, Ozark Integrated Circuits, Unique Electronic Device Packaging Solutions for Rugged Environments
3:00 p.m. Debbie Senesky, Professor, Stanford University, Packaging of Micro- and Nano-Systems for Operation within Extreme Harsh Environments
All presentations will be posted on the CMPUG, PAG and TFUG Proceedings webpage within 2 weeks following the meeting.