2023/12/07 10:00:00
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AGENDA
10:00 – 10:10 am Opening Remarks, Tricia Burroughs, Global Foundries
Session 1 Chair: Bob Roberts
10:10 – 10:35 am Subsurface Damage Characterization using surface Photovoltage Spectroscopy,
Knut Gottfried, ErzM-Technologies Company
10:25 – 11:00 am Using Aerosol Metrology to Deliver Discrete, Nanometer-Scale Particle Size Measurement for CMP Slurry, Andrea Tiwari, TSI Incorporated
11:00 – 11:25 am Mathematical Modeling of CMP Selectivity for Heterogeneous Material Films,
Onemoon Chang, Clarkson University
11:25 – 11:50 am Quantitative measurement of pad debris in CMP slurries with Total Holographic Characterization, Laura Philips, Spheryx
11:50 am – 12:00 pm BREAK
Session 2 Chair: Richard Vreeland
12:00 – 12:25 pm Importance of PSD and LPC Measurement, Rob Rhoades, X-Trinsic
12:25 – 12:50 pm The Influence of Pad Micro-Features on Chemical Mechanical Polishing (CMP) Performance: Insights from Computational Fluid Dynamics (CFD), Atefeh Sadrimofakham, Clarkson University
12:50 – 1:15 pm Silicon Carbide CMP Process Technologies, Ian Currier, X-Trinsic
1:15 – 1:40 pm Advanced Corrosion Mitigation Strategies in Cu CMP, SeokGyu Ryu, Clarkson University
1:40 – 1:45 pm Closing remarks – Bob Roberts, X-Trinsic
All presentations from this meeting will be posted on the CMP Users Group Proceedings webpage ~2 weeks following the meeting.
CO-CHAIRS:
Tricia Burroughs, Global Foundries, Tricia.Burroughs@globalfoundries.com
Katrina Mikhaylich, Applied Materials, Ekaterina_Mikhaylichenko@amat.com
Richard Vreeland, Intel, richard.f.vreeland@intel.com
Sponsorship
If you would like to sponsor a 2024* User Group (CMPUG, JTG, PAG, or TFUG) meeting please check out opportunities at:
NCCAVS User Groups Marketing Opportunities
*2024 Schedules are TBD