CMPUG Announcements

NCCAVS Virtual Technical Symposium

MEMS and Sensors: Driving Innovation

MEETING DATE: February 24, 2021
TIME: 12:30 – 4:00 p.m. (PST) TIMEZONE CONVERTER
PLATFORM: Zoom

CO-CHAIRS: Jacques Matteau, Michael Oye, Paul Werbaneth, Susan Felch, and Zoran Misetic

Join us for the Northern California Chapter of the AVS (NCCAVS) Virtual Technical Symposium on MEMS and Sensors: Driving Innovation

Typically, every February, the Technical Symposium is held in conjunction with the NCCAVS Annual Equipment Exhibition and Student Poster session. Due to the current pandemic, the NCCAVS Annual Equipment Exhibition and Student Posters have been cancelled, however, we’ll be continuing with the Technical Symposium via the Zoom platform.

This year’s Technical Symposium features topics including: RF MEMS, Microscopic Robots, and an open discussion about how AVS can help support you. Agendas, abstracts, and speaker bios are forthcoming, but the confirmed speakers are:

• Paul McEuen, PhD, John A. Newman Professor of Physical Sciences, College of Arts and Sciences, Cornell University, Director, Kavli Institute at Cornell for Nanoscale Science
• Mary Ann Maher, PhD, CEO and Founder, SoftMEMS
• Bruce Lunceford, MS, MBA, President of Memstronics

The meeting is FREE (although limited to 500 attendees). Advance registration is required to receive Zoom login details prior to the symposium:

REGISTER BY: February 23, 2021

Advances in CMP Consumables, Materials & Tools

CALL FOR PAPERS!
ABSTRACT DEADLINE: APRIL 1, 2021

MEETING DATE: April 22, 2021
TIME: 1:00 – 6:00 p.m. (CST) TIMEZONE CONVERTER
PLATFORM: Zoom

CO-CHAIRS: Michael Pevny, 3M, mpevny@mmm.com and Gene Davis, Texas Instruments, g-davis2@ti.com 

ABSTRACT SUBMISSION

Abstracts are now being accepted for the Chemical Mechanical Planarization Users Group (CMPUG) April 22, 2021 Symposium on Advances in CMP Consumables, Materials and Tools. The symposium will provide an international forum for academic researchers, industrial practitioners and engineers from around the world for the exchange of information on state-of-the-art research in CMP semiconductor technology. The CMPUG promotes the exchange of opportunities, ideas, friendly relationships and research collaboration. The areas of focus for this meeting will be the following:

• CMP consumables and materials
• CMP Polishing and Metrology Tools
• CMP Process Integration

Please submit an abstract (less than 200 words) of your presentation by April 1, 2021 to the meeting Co-Chairs,  Michael Pevny  mpevny@mmm.com and Gene Davis, g-davis2@ti.com.

Authors will be notified of acceptance by return e-mail.

All accepted presenters are asked to submit their presentations in pdf or pptx format, approved by their respective organizations/employers for public release, by April 25, 2021.