TFUG Announcements

NCCAVS – CMPUG, PAG, TFUG Joint Users Group Meeting

TOPIC: Semiconductor Packaging Outside the Mainstream

Co-Chairs:
Robert Rhoades, X-trinsic Inc., zestrion@gmail.com
Jeffrey Shields, Renesas Electronics, jeffrey.shields@att.net
Paul Werbaneth, Ichor Systems, pfwerbaneth@gmail.com

Agenda – Coming Soon 

Invited talks from packaging experts across a wide range of applications.

Sponsorship

If you would like to sponsor the NCCAVS 2022 Technical Symposium or any other 2022 User Group meeting, please check out our “NCCAVS Marketing/Sponsorship” opportunities at:

NCCAVS User Groups Marketing Opportunities