CO-CHAIRS:
Michael Oye, UC Santa Cruz, moye@ucsc.edu
Deepak Kamalanathan, Applied Materials
Paul Werbaneth, 3D In Cites
Charita Perera, Applied Materials
Maya Yamamura, Applied Materials
AGENDA:
1:00 p.m. SoC Design with ReRAM for Analog In-Memory Computing, Fuxi Cai, Applied Materials
With the massive demand of Deep Learning and Big Data applications, it has been a growing trend to design an AI accelerator using analog in-memory computing with emerging nonvolatile memory array. A key reason for using analog in-memory computing in AI application is due to its high performance in acceleration of Multiply-and-Accumulation (MAC) operation. In this work, we designed a custom-designed System-on-Chip (SoC) in Applied Materials targeting AI applications with analog in-memory computing on ReRAM tiles. Our first silicon achieved high energy efficiency in MAC operations. This chip was implemented with LeNet neural network on ReRAM tiles and demonstrated MNIST classification with accuracy matching simulation.
1:30 p.m. A Memristor-based Hybrid Analog-Digital Computing Platform for Mobile Robotics, Wei Wu, University of Southern California
We implemented a cerebellum (sensor fusion + motion control) of a mobile robotic system using a hybrid analog-digital computing system. The analog circuits are based on memristor. Both the sensor fusion algorithm and the motion control algorithm are running using this platform with low latency. In addition, the robot can learn to balance itself with the modified optimization algorithm. We also showed that the robot using the hybrid analog-digital platform has a better performance than using traditional digital circuits.
Speaker Biographies
Dr. Fuxi Cai received his B.Eng degree in Electronics and Communications Engineering from the University of Hong Kong in 2013, and M.S and Ph.D. degrees in Electrical Engineering from University of Michigan, Ann Arbor in 2015 and 2019, respectively. His Ph.D. research was focused on resistive random-access memory (RRAM) crossbar array and its applications in neuromorphic computing, and he has published several highly-cited papers in influential Nature-branded journals. His work on the integrated RRAM-CMOS reprogrammable neuromorphic chip has been chosen as the cover article of Nature Electronic, July 2019 issue. Fuxi joined Applied Materials DT group in late Jan 2019 and has been working on the RRAM tile project since then. He is the recipient of the New Market & Alliance (NMA) 2019 Q4 Employee Excellence Award. He was also granted Design Technology Covid-19 Related award for his outstanding contributions during the pandemic.
Wei Wu graduated from Peking University with a B.S. in Physics in 1996 and received a Ph.D. in Electrical Engineering from Princeton University in 2003. He is an Associate Professor at the Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California. Before joining USC in 2012, he had worked as Research Associate, Scientist and Senior Scientist at HP labs. His work includes nanoimprint lithography and applications in nano-electronics, nano-photonics, plasmonics, chemical sensing and nano-electrochemical cells. He coauthored 111 peer-reviewed scientific journal papers with 10,521 citations, 2 book chapters and more than 100 conference presentations, including 16 keynote and invited presentations. He has 118 granted US. Half of them were also filed internationally. His H-index is 49. He is a Co-Editor of Applied Physics A and an Associate Editor of IEEE Transactions on Nanotechnology. He was also an IEEE Nanotechnology Council 2015 and 2016 Distinguished Lecturer, and a recipient of the 2020 USC Stevens Center for Innovation Commercialization Award. He is currently the Chair of the Nanofabrication Technical Committee (TC3), IEEE Nanotechnology Council.
All approved presentations will be posted on the TFUG Proceedings webpage within 1-2 weeks following the meeting.
MEETING DATE: February 17, 2022
TIME: 9:00 a.m. – 5:00 p.m. (PST) TIMEZONE CONVERTER
LOCATION: Fremont Marriott Silicon Valley
46100 Landing Pkwy.
Fremont, CA 94538
FREE TO ATTEND!
The Northern California Chapter of the AVS will convene its 2022 Technical Symposium around the topical theme of “Novel Materials, Processes, and Devices for a Green Future” The Symposium will be held in person at the Fremont Marriott Silicon Valley, and focus on technologies that include, but are not limited to these areas:
We encourage scientific and engineering professionals, and students, from academia, government labs, OEMs, end-users, and materials suppliers to provide contributed talks to the Symposium.
The symposium will provide an international forum for academic researchers, industrial practitioners and engineers from around the world for the exchange of information on state-of-the-art research. The NCCAVS promotes the exchange of opportunities, ideas, friendly relationships and research collaboration.
Abstract/Presentation Submissions
Please submit an abstract (less than 200 words) of your presentation to the Technical Symposium and Exhibition Chair, Chris Malocsay, chris_malocsay@avs.org
Abstract Submission Deadline: November 1, 2021
Authors will be notified of acceptance by return e-mail.
Held in Conjunction with
42nd Annual NCCAVS Equipment Exhibition – Exhibitor Registration
10th Annual Student Poster Session
NCCAVS 2022 Technical Symposium – Program Committee
Chris Malocsay (Equipment Exhibition Chair and Technical Symposium Chair, chris_malocsay@avs.org)
Zoran Misetic (Past-Chair)
Mehmet Baykara
Cesar Clavero
Michael Current (JTG)
Susan Felch (JTG)
David Hansen (CMPUG)
Michael Oye (TFUG)
Daphne Pappas (PAG)
Paul Werbaneth (TFUG)
Mayu Yamamura (TFUG)
If you would like to sponsor the NCCAVS 2022 Technical Symposium or any other 2022 User Group meeting, please check out our “NCCAVS Marketing/Sponsorship” opportunities at:
