MEETING DATE: Wednesday, June 29, 2022
TIME: 1:00-4:30 p.m. (PDT) TIMEZONE CONVERTER
LOCATION: Zoom Platform
TIME: 1:00-4:30 p.m. (PDT) TIMEZONE CONVERTER
LOCATION: Zoom Platform
FREE TO ALL ATTENDEES
Access to the Zoom login for this meeting will be posted the day prior (June 28, 2022) on all 3 User Group Announcement pages (CMPUG, PAG, and TFUG) here:
https://nccavs-usergroups.avs.org/
2022/02/17 09:00:00
Co-Chairs:
Robert Rhoades, X-trinsic Inc., zestrion@gmail.com
Jeffrey Shields, Renesas Electronics, jeffrey.shields@att.net
Paul Werbaneth, Ichor Systems, pfwerbaneth@gmail.com
Robert Rhoades, X-trinsic Inc., zestrion@gmail.com
Jeffrey Shields, Renesas Electronics, jeffrey.shields@att.net
Paul Werbaneth, Ichor Systems, pfwerbaneth@gmail.com
Agenda –
1:00 p.m. Welcome and Acknowledgement of Meeting Sponsors, Joint User Group Meeting Co-Chairs: Rob Rhoades, Jeff Shields, Paul Werbaneth
1:15 p.m. Andy Mackie, Ph.D., Indium Corporation, “Die-attach Materials Empowering Power Devices: Removing Heat and Supplying Power”
1:45 p.m. Steffen Kroehnert, ESPAT Consulting, “Packaging Advances in the OSAT, Foundry, and MEMS Markets with a Highlight on Europe”
2:15 p.m. David Harame, Ph.D., SUNY Polytechnic, Colin McDonough, AIM Photonics, “AIM Photonics Electronic-Photonic Technologies and Packaging outside the Mainstream”
2:45 p.m. Charles Woychik, Ph.D., SkyWater Technology, “On-Shoring the Next Generation of Advanced Packaging”
3:15 p.m. Melissa Grupen-Shemansky, Ph.D., SEMI, “Packaging Methods for Flexible Hybrid Electronics”
3:45 p.m. Amy Leong, FormFactor, ”Test and Measurement Challenges and Opportunities for Chiplet Heterogeneous Integration”
4:15 p.m. ADJOURN
Sponsorship
If you would like to sponsor a meeting or list a banner ad on the User Group website, please check out our “NCCAVS Marketing/Sponsorship” opportunities at: