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NCCAVS User Groups
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TFUG Announcements

NCCAVS Joint User Group Virtual Meeting (CMPUG, PAG, & TFUG)

TOPIC: Novel Applications of Advanced Semiconductor Device Packaging Technology
MEETING DATE: June 24, 2021
TIME: 12:45 p.m. – 3:30 p.m. (PDT) TIMEZONE CONVERTER
PLATFORM: Zoom

CO-CHAIRS:
Rob Rhoades, Revasum, rob.rhoades@revasum.com
Jeff Sheilds, Adesto Technology, jeffrey.shields@att.net
Paul Werbaneth, Ichor Systems, pfwerbaneth@gmail.com

FREE REGISTRATION – Advance Registration Required to Receive Login Details!
(After registering, you will receive a confirmation email containing information about joining the webinar.)
REGISTER

Platinum Sponsors

Gold Sponsors

AGENDA

12:45 p.m.  Welcome and Acknowledgement of Meeting Sponsors, Joint User Group Meeting Co-Chairs Rob Rhoades, Jeff Shields, Paul Werbaneth

1:00 p.m.  David Lishan, Ph.D., Plasma-Therm, Higher Yield, Lower Cost Power Devices Through Plasma Dicing Process Integration

1:30 p.m.  Joseph Suttle, Ph.D., IBM Quantum, Advanced Packaging for Superconducting Quantum Processors

2:00 p.m.  Alissa Fitzgerald, Ph.D., A.M. Fitzgerald & Associates, MEMS: Strategies for Co-development of the Electronics and the Package

2:30 p.m.  Matt Francis, Ozark Integrated Circuits, Unique Electronic Device Packaging Solutions for Rugged Environments

3:00 p.m.  Debbie Senesky, Professor, Stanford University, Packaging of Micro- and Nano-Systems for Operation within Extreme Harsh Environments

3:30pm ADJOURN


All presentations will be posted on the CMPUG, PAG and TFUG Proceedings webpage within 2 weeks following the meeting.