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TFUG Announcements

NCCAVS – CMPUG, PAG, TFUG Joint Users Group Meeting

TOPIC: Semiconductor Packaging Outside the Mainstream

MEETING DATE: Wednesday, June 29, 2022
TIME:  1:00-4:30 p.m. (PDT)
 TIMEZONE CONVERTER
LOCATION:  Zoom Platform

FREE TO ALL ATTENDEES
Access to the Zoom login for this meeting will be posted the day prior (June 28, 2022) on all 3 User Group Announcement pages (CMPUG, PAG, and TFUG) here:
https://nccavs-usergroups.avs.org/

2022/02/17 09:00:00
Co-Chairs:
Robert Rhoades, X-trinsic Inc., zestrion@gmail.com
Jeffrey Shields, Renesas Electronics, jeffrey.shields@att.net
Paul Werbaneth, Ichor Systems, pfwerbaneth@gmail.com

Agenda –  

1:00 p.m.  Welcome and Acknowledgement of Meeting Sponsors, Joint User Group Meeting Co-Chairs: Rob Rhoades, Jeff Shields, Paul Werbaneth

1:15 p.m.  Andy Mackie, Ph.D., Indium Corporation, “Die-attach Materials Empowering Power Devices: Removing Heat and Supplying Power”

1:45 p.m.  Steffen Kroehnert, ESPAT Consulting, “Packaging Advances in the OSAT, Foundry, and MEMS Markets with a Highlight on Europe”

2:15 p.m.  David Harame, Ph.D., SUNY Polytechnic, Colin McDonough, AIM Photonics, “AIM Photonics Electronic-Photonic Technologies and Packaging outside the Mainstream”

2:45 p.m.  Charles Woychik, Ph.D., SkyWater Technology, “On-Shoring the Next Generation of Advanced Packaging”

3:15 p.m.  Melissa Grupen-Shemansky, Ph.D., SEMI, “Packaging Methods for Flexible Hybrid Electronics”

3:45 p.m.  Amy Leong, FormFactor, ”Test and Measurement Challenges and Opportunities for Chiplet Heterogeneous Integration”

4:15 p.m.  ADJOURN

Sponsorship

If you would like to sponsor a meeting or list a banner ad on the User Group website, please check out our “NCCAVS Marketing/Sponsorship” opportunities at:

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