CMPUG Proceedings

2024

December Agenda – CMPUG 2024 Winter Symposium
CMP + Post-CMP Cleans: The Marriage, The Challenges, The Future

Session One

• The Inception of Chemical Mechanical Polishing for Device Applications, Dr. Klaus Beyer, IBM Fellow (Retired)
• How You Polish Determines How You Clean.  The Need for a Holistic Approach to Post-CMP Clean, Wei-Tsu Tseng, IBM Research Staff
• Spectroscopic Analysis and Machine Learning to Expedite Oxide Planarization Development, Shanmukh Kutagulla, Materials Engineering, INTEL Corporation
• Exploring the Effect of Molecular Structure Enhanced Post-CMP Cleaning Chemistries for SiC and Oxide Surfaces, Jason Keleher, Professor and Elizabeth M. McDonnell, Department of Chemistry, Lewis University
• OptiQuiver:  Novel Metrology Solution for in-situ Wafer Shape Measurements, Robert Shelby, Engineering Manager, Peter Pilarz, Engineering Manager, Quartus Engineering

Session Two

• Impact of Dissolved Oxygen on Metal Corrosion in Post-CMP Cleaning for Advanced Logic Structures,’ Katrina Mikhaylichenko, Senior Director Technical Staff, Applied Materials Corporation
• Development and Co-optimization of CMP Slurries and Cleans for Enhanced Performance, Kathryn Gramigna, Research Scientist, and Yi Guo, CMP Slurry Formulation Leader, Dupont Electronics and Industrial Company 
• The Critical Importance of CMP for Hybrid Bonding, Swetha Barkam, Product Manager, CMP Business Unit, Applied Materials Inc.
• How the Evolution of the Supply Chain for CMP + Post-CMP Cleans Consumables has Overcome Challenges, Mike Corbett, Linx Consulting
• Megasonically Activated Post-CMP Cleaning, Ara Philipossian, Founder, CEO Araca Inc.

Session Three

• The Early Adaptation of Double-Sided Brush Scrubbing in Post-CMP Cleaning, Jerry Cutini, Co-Founder OnTrak Systems
• Tailoring Cleaning Solutions for Advanced Packaging Needs, Volley Wang, Senior Scientist, Dupont Electronics and Industrial
• Process Issues in Micro via Fabrication and their Impact on CMP, Knut Gottfried, Managing Director, ErzM Technologies, Senior Scientist, Fraunhofer ENAS, and Chair European CMP and WET Users Group
• CMP Process Developments for Emerging Microelectronic Device Fabrication, Serge Ecoffey, Professor Electrical and Computer Engineering, Universite de Sherbrooke
• Investigating Ceria-Related Defects on SiO2 Films from Nanoparticle Remnants and Tribofilms, Van-Tuan Nguyen, Graduate Student, Clarkson University

Session Four

• Optimizing Wafer Polishing:  Innovation in CMP Techniques and Filtration,” Bradley Wood, Applications Engineering Manager, CMP Liquid Filtration, Entegris
• Influence of Electric Field and Hydrodynamic Interactions in Removal of Uniformly Charged Abrasive Particles in Post-CMP Cleaning, Abbas Khanmohammadi, PhD Candidate, Goodarz Ahmadi, Professor of Mechanical Engineering, Clarkson University
• Model Verification Techniques for Analysis of Edge Roll Off Effects During the CMP Process, Justin Isaacs, Engineering Manager, Kat Johnston, Technical Sales Engineer, Quartus Engineering
• A Tribo-Electrochemical Approach for Performance Differentiation of CMP Slurry Inhibitors and Post-CMP Cleaning Formulations, Temidayo Afekare, Lead R&D Scientist, DuPont Electronics and Industrial

August Agenda – Joint User Group Meeting (CMPUG, PAG, & TFUG)
Evolving Trends in Advanced Packaging (3D integration, memory modules, AI, chiplets, on-shoring, etc.)

• Improved CMP processes through architecture & design optimizations, Knut Gottfried, ErzM and Fraunhofer ENAS
• Atmospheric Plasma Simplifies Die-to-Wafer Bonding, Daniel Pascual, ONTOS
• Advanced X-Ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection, Jeff Gelb, Sigray Inc.
• Strategies for Probe to enable Advanced Packaging, Mike Slessor, FormFactor
• Chemical Mechanical Planarization (CMP) for hybrid bonding, Swetha Barkam, Applied Materials (N/A)

May Agenda – Advances in CMP Consumables, Materials, and Tools

• Welcome and Acknowledgment of Sponsors; Symposium Co-Chairs Michael Pevny, 3M, and Michael Wedlake and U.S. CMPUG Chair Bob Roberts, X-Trinsic
• Semi Americas Outlook Growth Opportunities (Keynote), Dr. Daniel Muscat, EMD Electronics (N/A)
• European CMP Users Group Activities and ICPT2024, Dr. Knut Gottfried and Imme Ellebrecht, Fraunhofer ENAS, ErzM-Technologies, European CMP & WET User Group (Remote)
• Advanced Semiconductor Technology Roadmaps and Implications to CMP Materials, Dr. Karey Holland and Diane Scott, Techcet

• Tailoring Molecular Structure for Defect Activated p-CMP Cleaning Processes, Dr Jason Keleher, Lewis University (N/A)
• Trends in CMP and Impact on Consumables, Mike Corbett, Linx Consulting
• Controlling the Coefficient of Friction in CMP, Len Borucki, Araca (ret.) (Remote)
• Environmentally Friendly Amino Acid-Based Polishing Slurry with Reduced Galvanic Corrosion at Copper/Cobalt Interface for Advanced Cu Interconnect Applications, Thi Thuy Hoang Tran (Senior PhD Student), Elizabeth J. Podlaha, and Jihoon Seo, Clarkson University
• SiC CMP – A Process Perspective, Rob Rhoades, X-Trinsic
• Electrochemical Innovation for Sustainable Copper Management in CuCMP Wastewater, Dr. Cameron Lippert, ElectraMet
• The Value of CMP Education, Dr. Andrew Mansson, Samsung Austin Semiconductor (N/A)
• Reducing CMP Process Mass Intensity, Steve Benner, Confluense, LLC
• Total Holographic Characterization of large particle contaminants in CMP slurries, Laura Philips, Spheryx (Remote) (N/A)
• Pad-Level Spent Slurry Extraction During Polish, Dr. Ara Philipposian, Araca Inc
• Closing Remarks, Co-chairs Michael Pevny, 3M, and Michael Wedlake
• Dinner Presentation, Co-chairs Michael Pevny, 3M, and Michael Wedlake

2023

September Agenda – Packaging Beyond the Mainstream
(Joint User Group Meeting: CMPUG, PAG, TFUG)

• Waferbonding and CMP – A Perfect Couple, Knut Gottfried, ErzM and Fraunhofer ENAS
• Pt / HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications, Liangyu Chen, NASA
• The CHIPS Act-related National Advanced Packaging Manufacturing Program, Scott Sikorski, IBM
• Hybrid Multiscale Manufacturing Technologies for Heterogeneous Package Integration, P M Raj, Florida International University (not available)
• A Review on CMP Challenges in HWB and Wafer Level Packaging, G. Bahar Basim, Intel

May Agenda – Advances in CMP Consumables, Materials and Tools

• CMPUG 2023 Report on US Activities and Program Status, Bob Roberts, X-trinSiC Inc (not available)
• Removal Rate Enhancement, Selectivity Modulation, and In-Line Monitoring During Draco^TM Hard-Mask Flucto-CMP®, Dr. Ara Philipposian, Araca Inc (not available) 
• Tuning Molecular Structure to Promote Surface Activation for Enhanced p-CMP Cleaning Processes,
  Dr. Jason Keleher, Lewis University Dept of Chemistry (not available)
• Towards Understanding Smaller Ceria Particles (<10nm For SiO₂  Removal Rates During CMP,
  Ravitej Venkataswamy, Clarkson University
• Advancements in Selective Mo CMP For Front End Applications, Dr. Christopher Newman, Research Scientist, Fujimi Corporation (not available)
• Overview of NY CREATES at Albany Nanotech, Lamar Hill, New York CREATES Samples and Simulations to Understand CMP Metrology, Benjamin Bunday, AMAG Nanometro (not available)
• Community Strengthening within CMPUG, Tricia Burroughs, Global Foundries (not available)

2022

June Agenda – Semiconductor Packaging Outside the Mainstream (Joint User Group Meeting: CMPUG, PAG, & TFUG)

• Die-attach Materials Empowering Power Devices: Removing Heat and Supplying Power, Andy Mackie, Ph.D., Indium Corporation (not available)
• Packaging Advances in the OSAT, Foundry, and MEMS Markets with a Highlight on Europe, Steffen Kroehnert, ESPAT Consulting
• AIM Photonics Electronic-Photonic Technologies and Packaging outside the Mainstream, David Harame, Ph.D., SUNY Polytechnic, Colin McDonough, AIM Photonics
• On-Shoring the Next Generation of Advanced Packaging, Charles Woychik, Ph.D., SkyWater Technology
• Packaging Methods for Flexible Hybrid Electronics, Melissa Grupen-Shemansky, Ph.D., SEMI
• Test and Measurement Challenges and Opportunities for Chiplet Heterogeneous Integration, Amy Leong, FormFactor

December Agenda – Advancements in CMP Applications and Research

• Semiconductors and the CHIPS act: What Happens Next?, Dr. Eric Breckenfeld, Semiconductor Industry Association
• Economic Trends Shaping Semiconductor Demand, Duncan Meldrum. PhD, CBE, Hilltop Economics LLC
• Trends with Sustainability and Emerging Developments in Wet and Dry Processes, Michael Corbett, Linx Consulting
• CMP Removal Rate Modeling with the Shear Force Law, Len Borucki, Y. Sampurno and A. Philipossian Araca, Inc.
• Quantitative Analysis of CMP Slurry Additives Using Raman Spectroscopy, Timothy Holt and Michelle Sestak, HORIBA Instruments Inc.
• Slurry Activation Through Flucto-CMP, A. Philipossian and Yasa Sampurno, Araca, Inc., Fritz Redeker, Kiana Cahue and Jason Keleher, Lewis University
• Advanced CMP Cleaning Solutions, Geoffrey Yuxin Hu, Brizon Inc.

2021

April Agenda – Advances in CMP Consumables, Materials and Tools

• Measuring Large Particle Contaminants in Cerium Oxide Chemical Mechanical Polishing,  (CMP) Slurries with Total Holographic Characterization, Laura A. Philips, Spheryx, Inc.
• Slurry Injection System (SIS) Implementation in Dielectric and Metal CMP for III-V Semiconductors, John Zabasajja, HRL Laboratories
• CMP Process Challenges for mmWave Si Technology, Hong Jin Kim, Global Foundries
• Mixing and Handling Challenges with Next Generation Slurries, Carlo Aparece, Mega Fluid Systems and Marc Maxim, CMC Materials
• Industry Standards: From Egyptian Royal Cubit to SEMI Guides for CMP Consumables, Alex Tregub, Intel
• Effect of Process Variables on CMP Process Temperature, Catherine Bullock, Axus Technology (Pending)
• A New Kinetic Removal Rate Model for Tungsten CMP, Ara Philipossian, Araca Inc. (Pending)
• Preventing Cross Contamination with MIID (Malema™ Interconnect Interlock Device), Jay Rajagopalan, Malema Sensors
• Effective Slurry Concentration Monitoring Using Refractive Index, Tracy Gast, Entegris
• Nanoparticle Characterization Introduction: DLS, Diffraction, and NTA, Dr. Jeff Bodycomb, HORIBA Scientific

June Agenda – Novel Applications of Advanced Semiconductor Device Packaging Technology (Joint User Group Meeting: CMPUG, PAG, & TFUG

• Higher Yield, Lower Cost Power Devices Through Plasma Dicing Process Integration, David Lishan, Ph.D., Plasma-Therm
• Advanced Packaging for Superconducting Quantum Processors, Joseph Suttle, Ph.D., IBM Quantum (Not Available)
• MEMS: Strategies for Codevelopment of the Electronics and the Package, Alissa Fitzgerald, Ph.D., A.M. Fitzgerald & Associates
• Unique Electronic Device Packaging Solutions for Rugged Environments, Matt Francis, Ozark Integrated Circuits (Not Available)
• Packaging of Micro- and Nano-Systems for Operation within Extreme Harsh Environments, Debbie Senesky, Professor, Stanford University (Not Available)

October Agenda – Advances in CMP Applications and Research

• Bringing Value to the Customer with Big Data, Andrea Oehler, PhD, Fujimi Corporation
• Exploiting Fluorescence for Enhanced Nanoparticle Tracking Analysis of CMP Slurries, Dr. Jeff Bodycomb and Carl Lundstedt, Horiba Scientific
• Modulating Interfacial Reactions to Develop “Soft” p-CMP Processes, Abigail L. Dudek, Kiana A. Cahue, Tatiana R. Cahue, Mantas M. Miliauskas, and Jason J. Keleher, Lewis University
• Advanced Point of Dispense Filtration for Recirculating Systems, Bradley Wood, Entegris
• Applications of AI, Machine Learning and Big Data in Chemical Mechanical Polishing, Scott Lawing, Kinik North America
• CMP Knowledge Foundry and Big Data Analytics, A. Philipossian, N. Monfared , Y. Sampurno, Araca, Inc., and J. J. Keleher, Lewis University

2020

February Agenda – NCCAVS User Group Joint Technical Symposium – The Quantum World
NCCAVS 2020 Poster Session – Results

• Modeling Systems with Quantum Computers, Rudy J. Wojtecki, IBM Research – Almaden (N/A)
• Optimizing Quantum Optimization Algorithms for Noisy Quantum Computers, Davide Venturelli, USRA Research Institute for Advanced Computer Science (Pending)
• Enterprise Software to accelerate the quantum revolution, Christopher T. Brown, Zapata Computing, Inc.
• Materials Engineering for Quantum Information Technology, Robert Jan Visser, Applied Materials (Pending)
• Introduction of a new technology platform to enable scalable fabrication of single silicon vacancy defect arrays, Andre Linden, Raith America, Inc.
• Thin Film Fabrication of Quantum Upconverting Sensors for Dark Matter Detection, Dale Li, SLAC National Accelerator Lab
• Quantum Measurement Protocols for Upconverting Sensors, Stephen Kuenstner, Stanford University
• Superconducting quantum coherent circuits: introduction, challenges, and near-term applications, John Mark Kreikebaum, Lawrence Berkeley National Laboratory & University of California, Berkeley

April Agenda – Advances in CMP Consumables, Materials and Tools

• Membrane Carrier Tuning for State of the Art CMP Process Development in R&D Environments, Knut Gottfried, Fraunhofer ENAS
• Holistic Approach to the Understanding CMP-Induced Defects, Hong Jin Kim, Global Foundries
• CMP – A Leap Forward; Capstone, Catherine Bullock, Axus Technology
• No Process Can Change Alone: An Integrated Approach to CMP Consumable Development and Manufacturing, Stephen Bottiglieri, Saint Gobain Abrasives
• Characterization of Large Particle Contaminants in CMP Slurries using Holographic Video Microscopy, Laura Philips, Spheryx, Inc. (Pending)
• Case Studies Involving the Use of a 300-mm Brush Scrubber and Tribometer to: (A) Evaluate the Role of Anionic Supramolecular Assemblies in Post-STI-CMP Cleaning, and (B) Determine the Effect of Brush Nodule Placement Density on Shear Force in Time and Frequency Domains in Post-W-CMP Cleaning, Ara Philipossian, Araca Inc.

June Agenda – Advanced Packaging Technology

• Plasma Dicing – The “Next Normal” Richard Barnett, Senior Product Manager, Etch Products (SPTS Technologies Ltd, Newport, UK)
• Heterogeneous Integration Roadmap and the Revolution Enabling Future Progress, Dr. Wilmer R. Bottoms, Chairman, Third Millennium Test Solutions
• Surviving the Heat Wave – A presentation on thermally induced failures and reliability risks created by advancements in electronics technologies…and How Modeling Early in the Design Process can Identify these Issues, Greg Caswell, ANSYS
• Heterogeneous Integration Competence Center – An Open Access Innovation Incubator, Garrett Oakes, EV Group (Pending)
• Solving the DataCenter Energy Crisis with Silicon Photonics and Overcoming Photonics Wafer-level Test Challenges, Dr. Choon Beng Sia, FormFactor

September Agenda – Advancements in CMP Applications and Research

• Ultra-rapid Bulk Polishing of 150mm Silicon Carbide Substrate with Single-wafer Chemical Mechanical Planarization (CMP), Donshan (Sean) Yu, Applied Materials (N/A)
• Computational modeling of CMP pads: a die-scale model incorporating measured surface roughness, Brian Salazar, University of California, Berkeley
• Enhanced Melt-blown Filtration For Next Generation CMP Slurries and Applications, Patrick Connor, Pall
• Surface and Electrochemical Evaluations for Barrier and Packaging level CMP Optimization, G Bahar Basim, University of Florida
• Copper Removal at Short Time with Implications for Polishing Mechanisms, Len Borucki, Araca
• CMP defects: Influence of CMP slurry, handling and delivery, Rahul Trivedi, GlobalFoundries
• CMP Pad Conditioning and Applications to Soft Pads, Scott Lawing, Kinik
• Effective Slurry Mixing and Handling and its Impact on CMP Slurry Particle Health, Carlo Aparece, Mega Fluids Systems
• Correlation between dishing/erosion and electrical properties in copper interconnects after chemical mechanical planarization, Shirley Lin, Versum Materials
• Correlating Shear Force and CoF to Platen Motor Current in Copper, Cobalt, Tungsten, STI and ILD CMP at Non-steady-state and Steady-state Conditions, Ara Philipossian, University of Arizona

2019

February Agenda-NCCAVS Users Group Joint Technical Symposium

• Next Generation Energy Storage Technologies, Subramanya (Subra) Herle, Applied Materials
• Solid-state Thin Film Batteries Take a Page Out of the 3D Transistor Play Books, J.R. Gaines, Kurt J. Lesker Company
• Advances and Challenges with Rechargeable Lithium-Air Batteries, Dave Sopchak, Coulombic, Inc.
• Peak Power Impact on Battery Cycle Life, Naoki Matsumura, Intel
• Directly Converting Heat to Electricity using Compact, Microfabricated Thermionic Devices, Jared Schwede, Spark Thermionics (N/A)
• AlN-based Piezoelectric Energy Harvesting, Mary Ann Maher, SoftMEMS (N/A)
• Tribute to John W. Coburn, David Graves, U.C. Berkeley
• How to Make Manufacturing of LEDs Truly Green, Prasad N. Gadgil, Atomic Precision Systems
• GaN HEMT Electronics for Extreme Environments, Saleh Kargarrazi, Stanford XLab
• Conversion Technologies for Generating, Transmitting, and Storing Energy, Joint Users Group Technical Symposium
• Selection of Battery and Charging Algorithm to Extend Battery and Cycle Life, Naoki Matsumura

April Agenda-Advances in CMP Consumables, Materials and Tools

• Keynote Talk, Suresh Ramarajan, Senior Director NVM Process Development Engineering, Micron Technology (Not Available)
• Method for Studying the Effect of Conditioner Design and Polisher Kinematics on Fluid Flow Characteristics during CMP, Juan Cristobal Mariscal, University of Arizona
• Low Particle Size Ceria STI Slurry Designed for High Performance Dishing and Nitride Loss, Edmund Chu, Ferro
• The Development of Post-CMP Cleans to Address New Challenges in Advanced Device Manufacturing, Paul Bernatis, DuPont EKC Technology (Not Available)
• Effect of Conditioner Wear on the Tribological, Thermal, Kinetic and Pad Microtextural Characteristics in ILD CMP, Hossein Dadashazar, University of Arizona
• Computer Simulation for Understanding of CMP Process, Akira Endou, Fujimi Incorporated
• High Quality Test Wafer and Analysis For CMP Process, Consumables and Materials, Yasuji Moriki, AMT
• Okamoto 300mm Final Polish System, Bob Pinto, Okamoto

2018

February Agenda-NCCAVS Joint Users Group Technical Symposium: Process, Materials, and Technology Innovation for Smart Devices, Displays, and Internet of Things

• Reliability for the 21^st Century: Meeting Challenges of New Technologies and New Markets, (Plenary Talk) Milena Vujosevic
• Development and R2R Scale up of a Hybrid Printed CMOS Silicon TFT Process, Patricia Beck, Thin Film Electronics
• Tool Design Considerations for Advanced Atomic Layer Deposition, Duane Bingaman, Kurt J. Lesker Company
• Electron Heating in Sputtering Magnetrons, Andre Anders, LBNL, Leibniz Institute of Surface Engineering
• Plasma-based Thin Film Depositions: Applications, Limitations, Our Improvements, and Case Studies in Battery, Photovoltaic, Non-volatile Memory, and Medical Devices Applications, George Guo, Ascentool Inc.
• Can a New Materials Innovation in Thin Film Optical Applications be Faster and Cheaper?, Guowen Ding, Labforinvention Corp.
• A Quantitative Approach to Optical Emission Spectroscopy, Frank Papa, Gencoa
• Thin Film Roadmap for Solid State Li Metal Batteries, Ernest Demaray, Demaray LLC
• Solid-state Thin Film Batteries in 3D, J.R. Gaines, Jr., Kurt J. Lesker Company

April Agenda-Advances in CMP Consumables, Materials, and Tools

• Outlook for CMP Consumables, Mike Corbett, Linx Consulting
• Recent Trend of CMP Equipment Platform and its Requirement of Process and Consumables: BEOL CMP, Sunghoon Lee, GlobalFoundries
• Particle Developments as an Enabler of Next Generation Ceria Slurries, Nate Urban, Ferro
• Almost Complete Removal of sub-90nm Ceria Particles from Silicon Dioxide Surfaces, Jihoon Seo, Clarkson University
• Studying Effects of Surfactants on CMP Slurries with Holographic Characterization, Laura Philips, Spheryx Inc.
• Reduced Cost of Ownership Oxide CMP Process using 300mm Consumables for 200mm Processing, Christopher Eric Brannon, Texas Instruments
• 3D Trajectories, Diffusion, and Interaction Energies of Ceria Particles on Glass Surfaces, Akshay Gowda, Clarkson University
• High Efficiency Post-CMP Cleans for Advanced FEOL and MOL Applications, Paul Bernatis, Dupont-EKC Technology (pdf N/A)
• Tuning Wear Rate and Surface Finish of CMP Pads via Precise Control of Pad Conditioner Features, Matthew Fritz, 3M Company
• Tribocorrosion Mechanism for Tungsten Void in CMP in-situ Cleaning, Hong Jin Kim, Global Foundries
• Assay Characterization of Industrial CMP Slurries Based on Densitometry, Refractive Index and Dynamic Light Scattering, Leticia Vázquez Bengochea, University of Arizona
• Advanced Cu CMP Slurries for Advances Node Cu CMP Applications, Tom Shi, Versum Materials
• Cobalt Buff Step CMP for Middle of the Line Applications and Reduction in Slurry Consumption Using a Novel Slurry Injection System, Calliandra Stuffle, University of Arizona

June Agenda-Joint User Group (CMP, PAG, & TFUG) Meeting: Advanced Packaging Technology

• Monolithic Integration of GaN Sensors and Electronics for Harsh Environments, Dr. Caitlin Chapin, XLab (Not Available)
• Equipment and Process Challenges for the Advanced Packaging Landscape, Laura Rothman Mauer, Veeco Instruments, Inc.
• Heterogeneous Integration Needs Heterogeneous Package Assembly, Annette Teng, Promex Industries
• Fan-out IC Packaging Trends and the Impact on Equipment Capital Structures (e.g., Wafer Processing Versus Traditional PCB Styles) Today and in the Future, Jon Woodyard, SiPAQ, LLC
• Low temperature, low damage plasma technologies for advanced packaging applications, David Lishan, Plasma-Therm, Inc.
• CMP and Current Trends Related to Advanced Packaging, Robert L. Rhoades, Ph.D., Entrepix

July Agenda-CMP Technology and Market Trends

• Global Manufacturing Update – Opportunities and Pitfalls for Manufacturers in 2^nd half of 2018 and beyond, Len Jelinek, IHS Insights
• Next Gen CMP Challenges for 3D Memory Architectures, Sai Vegunta, Micron
• Investigation of NMR-based Surface Area Measurement as a Quality Monitor for Nanoparticle Silica Abrasives, Olga Samsonenka, Andy Kim, University of Washington
• New Insights into the Tribological and Kinetic Attributes of Retaining Rings in Chemical Mechanical Planarization, Gabriela Diaz ^a, Lauren Peckler ^a, Yasa Sampurno ^a,b , Ara Philipossian ^a,b, ^a University of Arizona, ^b Araca Incorporated
• Molecular Design of CMP Consumables for Advanced (<10nm) Processing Technologies, Michael E. Mills, DOW Electronic Materials
• New Paradigms in CMP Consumables, Rajeev Bajaj, Applied Materials
• Developing Robust Quality Systems for CMP Solid Consumables, Alex Tregub, Intel
• Impact of Advanced Memory Technologies on CMP Industry, Mike Corbett, Linx Consulting
• Formulated Products for W CMP, Chun Lu, Versum Materials

2017

February Agenda-NCCAVS Joint Users Group Technical Symposium: Novel Materials, Processes, and Devices for Future Generation Electronics

• Mechanisms of Plasma Therapy (Plenary Talk), David Graves, UC Berkeley
• Large-Scale, Thin-Film Battery, Ernest Demaray, Demaray LLC
• Inkjet Printing for Manufacturing of Flexible and Large-Size OLEDs, Jeff Hebb, Kateeva
• Rapid Materials and Device Innovation for Non-Volatile Memory Applications, Larry Chen, Intermolecular
• BEOL Interconnect Innovations for Improving Performance, Paul Besser, Lam Research
• Nanoscale Chemical Imaging & Topography with Photo-induced Force Microscopy, Thomas R. Albrecht, Molecular Vista, Inc.
• Material Innovation for Non-Volatile Memory Selectors, Larry Chen, Mark Clark, Charlene Chen, Milind Weling, Intermolecular

April Agenda– Spring Meeting: Advances in CMP Consumables, Materials, and Tools

• High Rate Acidic Slurries, Julia Kozhukh, Dow
• Holographic Characterization of Agglomerates, Fook Cheong, Spheryx
• Stribeck Curve Improvements for Cu and WCMP on Soft Pads, Ara Philipossian, University of Arizona and Araca Inc.
• Enhanced Material Removal Rate for III/V Semiconductors, Bahar Basim, and Sebnem Ozbek, Ozyegin University
• CMP of Divinylsiloxane-bis-benzocylcobutene (DVS-BCB or BCB) low-k ILD Polymer, Zenon Carlos, Hughes Research Labs
• Bulk Cu CMP: Development and challenges of high removal rate, low topography slurries, James McDonough, Fujifilm Planar Solutions LLC
• High Performance Pad Conditioning (HPPC) Arm for Advanced Pad Conditioning, Raghava Kakireddy, Applied Materials
• The Impact of Sample Containers on Large Particle Count for CMP slurries, Brian Kim, Fujimi Corporation

June Agenda– Joint CMPUG/TFUG Meeting: 3D Packaging Technology

• Monolithic 3D Integration Using Standard Fab and Standard Transistors, Zvi Or-Bach, Monolithic 3D Inc.
• Reliability of ultra-fine RDL Structures in Advanced Packaging Patterned by Excimer Laser Ablation, Markus Arendt, SUSS MicroTec Photonic Systems, Inc.
• CMP and Current Trends Related to Advanced Packaging, Robert L. Rhoades, Entrepix, Inc.
• Fabrication and Reliability of Ultra-Fine RDL Structures in Advanced Packaging by Excimer Laser Ablation, Markus Arendt, SÜSS MicroTec Photonic Systems Inc.

July Agenda (SEMICON West) – CMP Technology & Market Trends

• Handset Demand Poised to Drive Second Half Surge in Semiconductors, Len Jelinek, IHS Insights
• Challenges in Cleaning Tungsten and Cobalt for advanced node Post CMP and Post Etch Residue Removal Applications, Michael White, Entegris
• Effect of Water Dilution and Method of Slurry Dispense on Silicon Dioxide Removal Rate for STI CMP using a Ceria Slurry, Matthew Bahr, Ara Philipossian, University of Arizona
• Status of CMP Materials, Marty DeGroot, DOW Electronic Materials
• CMP in Photonics Area, Frank Tolic, AIM Photonics
• Sub-Aperture Ion-Milling based Planarization, Allan Biegaj, SCIA Systems
• Developments in CMP and Impact on CMP Consumables, Mike Corbett, Linx Consulting
• New Regulatory Requirements for Nanoscale Materials Under the U.S. Toxic Substances Control Act (TSCA), Sanjay Baliga, SEMI

2016

February Agenda – Materials, Devices, and Systems for Intelligent Engineering Solutions

• NCCAVS Joint User Group Symposium Abstract Book and Exhibit Guide

April Agenda – Advances in CMP Consumables, Materials and Tools

• CMP Challenges in sub-14nm FinFET and RMG Technologies, Tae Hoon Lee of GLOBALFOUNDRIES
• The Test Vehicle for Standardized Characterization of CMP Consumables and Processes in the finFET Era, Jakub Nalaskowski of SUNY Polytechnic Institute
• Advanced CMP Pad Surface Texture Characterization and Its Impact on Polishing, Zhan (Jennifer) Liu of DOW
• High Selectivity Ceria Slurry for Next Generation STI CMP processes, Nate Urban of Ferro
• Engineering Performance with Microreplicated CMP Pad Conditioners, Charles Gould of 3M
• Three Complementary Strategies for Micro-scratch Reduction during Chemical Mechanical Polishing (CMP), Venugopal Govindarajulu of GLOBALFOUNDRIES
• OCD Measurement of Post Cu CMP Structures by Integrated Optical Metrology, Yongdong Liu of Nanometrics
• Advanced Optical Metrology Solutions to Enable APC for CMP, Charles Kang of Nova
• Ceria Slurry Reclamation and Recycling Systems Used in High Volume, Semiconductor Manufacturing, Scott Ray of HighQ
• Reducing CMP Variation – Measure What Matters, Steve Benner and Christopher C. Choffat of Confluense
• Integrated Metrology OCD for CMP Applications, Yongdong Liu, Zhefu Wang, Stephen Jew, Yongbin Qi, Bingqing Li, Moh Lung Ling, ChungHwa Wang, Applied Materials and Nanometrics

June Agenda – 3D Packaging

• Novel Process of RDL formation for Advanced Packaging by Excimer Laser Ablation, Markus Arendt, SUSS MicroTec Photonic Systems Inc.
• Optical Metrology and Inspection for Fan-Out Wafer Level Packaging (FOWLP), Ben Garland, Jim Xu, Ph.D., and Vamsi Velidandla , Zeta Instruments Inc.
• CMP for Advanced Packaging, Robert L. Rhoades, Entrepix, Inc.
• Between 2D and 3D: WLFO Packaging Technologies and Applications, Minghao Shen, Altera Corporation (now part of Intel)

July Agenda – CMP Technology and Market Dynamics

• Research Activities on Defect Improvement of CMP Process in 1x nm Foundry Device, Ji-Chul Yang, Global Foundries (GF)
• Nano-Capsule CMP Slurries: Enabling Localized Control of Chemical Exposure, Robin Ihnfeldt, General Engineering & Research, L.L.C. (GE&R)
• CMP’s Transition to 450mm Manufacturing: Current Status and Future Directions, Christopher Borst, SUNY Polytechnic Institute, assignee to Global 450mm Consortium; Daniel Franca, SUNY Polytechnic Institute, assignee to Global 450mm Consortium; Huey-Ming Wang, GLOBALFOUNDRIES, assignee to Global 450mm Consortium
• Strategic Evolution of CMP Supplier Base, Mike Corbett, Linx Consulting
• Novel Method to Measure the Sharpness of CMP Pad Conditioner Abrasive Tips, Charles Gould, 3M
• Advances in LPC Monitoring in CMP Slurries, Mark Bumiller, PSS
• Scratch Reduction through new CMP Slurry Technologies, Takafumi Sakurada, Hitachi Chemical Company, Japan
• Mechanistic Aspects of Wafer Cleaning After Chemical Mechanical Planarization, Michael White, Entegris
• Evolution of CMP and Future Outlook, Andy Tuan, LINX-Consulting

2015

February Agenda – Technology Innovation for Next Generation Materials and Manufacturing

• Message from Indium Corporation, Jacques Matteau, Indium Corporation
• Low Emissivity (Low-E) Coating Technologies for Energy Saving Window Applications, Guowen Ding, Intermolecular
• 40 Years of Magnetron Sputtering: Still an Exciting Field for Discovery, Andre Anders, Lawrence Berkeley National Laboratory
• New Applications of Chemical Mechanical Polishing, Rob Rhoades, Entrepix, Inc.

April Agenda– Advances in CMP Consumables, Materials and Tools

• Welcome from AVS Student Chapter @ CNSE and Hudson Mohawk Chapter of AVS, C. Ventrice, Associate Prof of CNSE
• FEOL CMP Process and Consumables Characterization Vehicle for 14nm Node and Beyond, J. Nalaskowski/T. Burroughs, SEMATECH/CNSE
• Process optimization in post W CMP in-situ cleaning, H. J. Kim, Global Foundries
• Effect of kinematics and abrasive particle dynamics on material removal rate uniformity during polishing, A.S. Vahdat
• Occupational Exposure to Nanomaterials: Assessing the Potential for Cutaneous Exposure to Metal Oxide Nanoparticles in a Semiconductor Facility, S. Brenner, CNSE
• CMP Cost Issues & Impact on Consumables for Memory and Logic, M. Corbett, Linx Consulting
• Advances in Ceria Slurries to Address Challenges in Fabricating Next Generation Devices, D. Dickmann, Ferro Corporation
• Development of a High Si3N4 Selective Slurry, H. Takeda, Fujimi Corporation
• Out-gassing from III-V Wafer Processing, H. A. Kwong, SEMATECH

June Agenda– 3D Packaging

• Electromigration Simulation Flow For Chip-Scale Parametric Failure Analysis, Jun-Ho Choy, Mentor Graphics Corp.

July Agenda – CMP Technology and Market Trends

• Trends in CMP and Impacts on CMP Slurries and Pads, Mike Corbett, Linx Consulting
• Integration of Cobalt in Next Generation Interconnects, Jim O’Neill Guthrie, Tom Baum, Entegris
• G450 Consortium Talk, Chris Borst, CNSE and Frank Tolic, International SEMATECH
• Immersion Metrology for CMP Pad Monitoring, Andres Arasanz, SENSOFAR and Terry Moore, TDK-Headway
• Techcet CMP Consumables 2015 Market Update, Sue Davis, Mike Fury, Karey Holland, Techcet Group
• Advances in CMP Pad Conditioning, Scott Lawing, Kinik NA and Elbert Chou, Kinik Company
• Hardware and Process Solutions in Evolving CMP Needs, Robert Rhodes, Entrepix
• Putting pieces together in the material space – Considerations for integrating Cobalt, James O’Neill, Ph.D., Entegris

2014

February Agenda – Nanomaterials for Energy, Biomedical, and Electronic Devices

• Nanoparticle generation using sputtering plasmas, André Anders and César Clavero, Lawrence Berkeley National Laboratory

March – Innovations in CMP Consumables

• Introducing a better CMP cleaning products: Brite Clean additives, Geoffrey Yuxin Hu, Brizon Inc. and Lily Yao, Western Digital (WD)
• Mechanism for LPC Pooling and Release in CMP Slurry Lines, Mike Fury, Vantage Tech
• Epic series soft polishing pads -CMC approach, Jay Nair, Cabot Microelectronics
• 2014 Critical Materials Report: CMP Consumables, Bob Roberts, TECHCET
• 3M Microreplicated Trizact (TM) Conditioning Disks for Front End Gate and Back End Bulk Tungsten Applications, John Zabasajja, 3M Company
• Improved Defect Performance and Reduced Slurry Consumption during CMP,  Christopher C. Choffat, IFS Services
  

June – 3D Packaging

• Monolithic 3D is now Practical, Zvi Or-Bach, MonolithIC 3D Inc.
• TCAD Modeling for Mechanical Stress Management in 3D IC Packages, Xiaopeng Xu, TCAD R&D, Synopsys, Inc.

July Agenda – Innovations in Chemical Mechanical Planarization Business & Technology

• Continued Progress on 450mm Development, Frank Robertson, VP/GM – Industry and Strategy, G450C
• Chemical Mechanical Polishing as Enabling Technology for Sub-14nm Logic Device, Yongsik Moon, Sr. Manager – Global Foundries
• CMP Present and Future Technical and Economic challenges, Frank Tolic, Assoc. Vice President for Business and Wafer Processing – CNSE
• CMP CONSUMABLES: Suppliers, Applications, Performance, and Growth, Bob Roberts, Axus Technology
• Field Validation of Sub-Micron Defect Correlation with ≥1 Micron Particle Behavior in Undiluted POU CMP Slurry, Michael A. Fury, Director of Market Development, Vantage Technology Corporation

2013

February Agenda – Technology for Clean Energy

• Challenges and Solutions for More Sustainable Energy Systems, Stacey F. Bent, Stanford University
• Novel Plasmonic Materials for Energy-Related Devices, César Clavero, Ph.D., Lawrence Berkeley National Laboratory
• Process Development for Advanced Generation Crystalline Silicon Solar Cells, James Gee, Applied Materials
• Depth Profiling of Organic Photovoltaic and OLED Materials by Cluster Ion Beams, J.S. Hammond¹, S. N. Raman¹, S. Alnabulsi¹, N. C. Erickson² and R. J. Holmes²;  ¹ Physical Electronics, ² University of Minnesota
• Thermoelectrics (TE) at the Nanometer and Sun to Fiber (S2F) at the Micrometer, Nobuhiko “Nobby” Kobayashi, University of Santa Cruz
• Measurement of CdTe Ratio for Composition Control, Gary Mount, Larry Wang and Wesley Nieveen, Evans Analytical Group
• Sunny Future for the Solar Industry, KRS Murthy, I3 Solar
• Nanostructured Energy Conversion for Low‐power Energy Harvesting Devices and Beyond for High-power ‘Sun‐to‐fiber’ Solar Devices, Michael Oye and Nobuhiko “Nobby” Kobayashi, University of California, Santa Cruz
• Advances in MOCVD Process and Equipment Technology Enabling Solid State Lighting, G.D. Papasouliotis and Wei Zhang, Veeco Instruments, Inc.
• Technology and Economic Considerations for High Volume HBLED Lithography Manufacturing, Manish Ranjan, Ultratech

May Agenda – Innovations in CMP Materials

• CMP’s Transition to 450mm Manufacturing: Engineering Consumables to Meet Process and Efficiency Targets, Christopher Borst, College of Nanoscale Science and Engineering
• Continued Growth and Benefits of CMP Process Development Through CNSE, Frank Tolic, College of Nanoscale Science and Engineering
• Achieving Process Stability on Soft Pads, Gregory T. Gaudet, Cabot Microelectronics
• Development of an Advanced Node High Selectivity Tungsten Slurry, James Schlueter, Blake Lew, Hongjun Zhou, and Tom Shi, Air Products and Chemicals Electronics Division, Planarization Platform
• Novel Approaches for FEOL Process Control: Recent Developments in PolySi Reactive Liquids, L. Cook¹, S. V. Babu², N. Penta¹, ¹Dow Electronic Materials ² Clarkson University
• Development of Post CMP Cleans for Advanced Node Challenges, Sun
• Trends in CMP Slurries and Pads for New Devices and Wafers, Michael Corbett, Linx Consulting
• High mobility channel materials: CMP challenges and opportunities, R. J. W. Hill, I. Ali C. Hobbs P.D. Kirsch – SEMATECH, G. Whitener, B. Ward, B. Fortino – Cabot
• Characteristics of a Novel CVD Diamond Pad Conditioner, R. K. Singh, P. Doering, A. Galpin, D. Wells and C. Vroman, Entegris, Inc.
• Slurries for selective and non–selective polishing of SiC films, Uma Ramesh K. Lagudu and S.V. Babu, Center for Advanced Materials Processing – Clarkson University
• III/V CMP Development, Yongqing Lan,  Ibrahim, Gillot, Ong, Proelss, BASF

June Agenda – 3D Packaging

• 3D Packaging for Memory Application, Ming Li, Ph.D., Rambus
• Considerations When Selecting A Wafer Level Bonding Process, Garrett Oakes, EV Group
• Overview of CMP for TSV Applications, Robert L. Rhoades, Ph.D., Entrepix
• Stress-induced Effects Caused by 3D IC TSV Packaging in Advanced Semiconductor Device Performance, V. Sukharev¹, A. Kteyan¹, J-H Choy¹, H. Hovsepyan¹, A. Markosian¹, E. Zschech², and R. Huebner²; ¹Mentor Graphics Corporation, ²Fraunhofer Institute for Non-Destructive Testing
• Cooling Three-Dimensional Integrated Circuits using Power Delivery Networks (PDNs), Hai Wei, Stanford University

July Agenda – CMP Market Trends and Technology Advances

• Impact of the Imminent Convergence of 450mm, Impact of the Imminent Convergence of 450mm, 22/14nm, and 3D (FinFET) Structures on CMP and 22/14nm, and 3D (FinFET) Structures on CMP and the Semi Industry the Semi Industry, Robert N. Castellano, The Information Network
• How to anticipate and prepare for the ongoing changes in the semiconductor device and manufacturing industries, Mehdi Hosseini, Susquehanna International Group, LLP (SIG)
• Nanoabrasive-based Slurries for Next Generation CMP Applications, Lukasz Hupka, Suresh Ramakrishnan, Zhiyong Suo, Kozaburo Sakai, Sri Sai Vegunta, Jack Archer, Gowri Damarla, Andrew Carswell, Shyam Ramalingam, Dave Fillmore, Shifeng Lu
• Future CMP Processing Requirements, Kyle Flanigan & Michael Corbett, Linx Consulting
• Protecting Against Cobalt Corrosion in Advanced CMP Slurries, James McDonough, Ph.D., Richard Wen, Ph.D., Luling Wang, Ph.D., Fujifilm Planar Solutions, LLC
• CMP: Where have we been and where are we headed next? Robert L. Rhoades, Ph.D., Entrepix
• A Test Methodology for Comparing the Performance of CMP Conditioners, David Slutz, Morgan Advanced Materials
• Techcet CMP Consumables 2013 Market Update, Michael A. Fury, Ph.D., Techcet Group LLC 

September – The Hard Disk Drive Industry: Market Analysis & CMP Processing Issues

• What a Difference a Year Makes, Dr. Robert Castellano, The Information Network
• Entegris-Jetalon Sales Channel Partner Training, Jetalon Solutions, Inc.
• NEOX Ex-Situ “Wet” CMP Pad, Niels Schwarz, Terry Moore, Sensofar & Headway Technologies
• Hard Material Thinning Process Development and Full Auto Thinning Machine (SGL6), Semiconductor Process Development Dept., Okamoto Corporation
• Chemical Mechanical Planarization (CMP) of Bit-Patterned Media, Kurt Rubin, San Jose Research Center
• Mechanistic Evaluation of Nickel-Phosphorous (NiP) CMP, Dr. Kenneth Rushing, Laboratory for Advanced Surface Planarization (LASP) – Clarkson University

2012

February – Technology for Clean Energy

• A Flow Battery for Grid-Scale Energy Storage, Vincent Battaglia, Lawrence Berkeley National Laboratory
• The Molecular Foundry at the Lawrence Berkeley National Laboratory: User Program: Statistics, Experiences, and Opportunities, David Bunzow
• Floating c-Si Thin Films for Solar Cells, U. Cohen and M. Roitberg, UC Consulting
• The Journey of SunPower to 20% Module Efficiency, Doug Kim, Gabriela Bunea, SunPower
• HB-LEDs and Solid State Lighting: Challenges and Opportunities, Tom Morrow, SEMI
• Characterization of Solar Grade Silicon Contaminants, Gary Mount, Evans Analytical Group
• Advances in ULTIMO™ Lithium Ion Capacitor (LIC) Technology, Jim Banas & Maria Peterson, JSR Micro & JM Energy
• Solar Technology; Crystalline Silicon PV Solar Cells, David Tanner, Applied Materials
• Correlation of Cell Efficiency with Photoluminescence Images, Bruce True, Intevac Corp.

February – Techcet Electronic Materials Webinar

May Agenda – Advances in CMP Consumables

• Tackling Critical Requirements for Advanced Post-CMP Cleans, Paul Bernatis, EKC Technology, DuPont Electronics & Communications
• The Sampling Statistics of Low Particle Counts in CMP Slurry, Michael A. Fury, Ph.D., Vantage Technology Corporation
• Advances in Optical Polishing, Floyd McClung, CV Nanotechnology Inc.
• Front-end, Back-end and Substrate Slurries: Key Process Data and Advantages, Asahi Glass Co.,Ltd.

June Agenda – 3D Packaging

• Mechanical Stresses and Reliability Study of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH using Synchrotron X-Ray Microdiffraction for 3-D Integration and Reliability, A.S. Budiman, Los Alamos National Laboratory (LANL)
• Challenges and Solutions in 3DIC Extractions, Dusan Petranovic, Mentor Graphics
• Process Integration for 2.5D/3D – A Few Steps from the Summit, Niranjan Kumar, Applied Materials
• TSV Reveal Using Low-Selectivity CMP, Robert L. Rhoades, Paul Lenkersdorfer, and Dean Malta, Entrepix

July Agenda – CMP Market Trends and Technology Advances

• CMP Cost Issues & Impact on Consumables for 450 MM, Corbett, Linx Consulting
• Back to the Future of CMP Non-Uniformity, Paul Feeney, Lynn Shumway, Dan Trojan, and John Brown – Axus Technology, Jamie Leighton – Applied Materials
• Techcet CMP Consumables 2012 Market Update, Michael A. Fury, Ph.D., Techcet Group LLC
• Game Change: Monitoring Large Particles in Undiluted Slurry, Michael A. Fury, Ph.D., Vantage Technology Corportation
• 450mm : A Wafer Manufacturer Perspective, Dr. Bruce Kellerman, Semiconductor Product Marketing

September Agenda – The Hard Disk Drive Industry: Market Analysis & CMP Processing Issues

• The Dynamics of the HDD Industry The Dynamics of the HDD Industry and its Impact on CMP and its Impact on CMP, Dr. Robert N. Castellano, The Information Network
• Filtration Solutions for Management of Defectivity Associated with Data Storage CMP, Patrick Levy, Lee Soon Swee, Sailani Moomin, Greg Daddazio and Patrick Connor, Pall Corporation
• The Influence of Pump Technology on Large Particle Count (LPC) of CMP Slurries in Hard Drive Industry,Juergen Hahn, Dieter Hudobnik, Levitronix Technologies LLC
• Analysis and Optimization of AlTiC CMP Using Advanced Heads, Brown, Feeney, Shumway, Axus Technology

2011

April –

• ICPT2011_Call4Papers1

May – Advances in CMP Consumables

• Reduced Cost of Ownership Copper CMP Process using Third Generation Low Abrasive Selective Slurry, Christopher Eric Brannon, Christopher Schutte, Brian Zinn, Texas Instruments, Semiconductor Manufacturing
• High Performance Pad Conditioning Arm for Improved CMP Process Monitoring and Control, Siva Dhandapani, G. Menk, C. Garretson, J. Fung, S.-S. Chang and S. Tsai, Applied Materials
• Recession Rewards for CMP Consumables: Techcet CMP Consumables 2011 Market Update, Michael A. Fury, Ph.D.,Techcet Group LLC
• Pad Surface Micro-Topography and Process Temperature Considerations in Planarization, Y. Jiao¹, X. Liao¹, Y. Sampurno¹,², Y. Zhuang¹,², L. Borucki², and A. Philipossian¹,², ¹University of Arizona, Tucson, AZ USA, ²Araca Incorporated, Tucson, AZ USA

June Agenda

• CMP for TSV’s, Robert L. Rhoades, Ph.D., Entrepix
• Monolithic 3D DRAM Technology, Deepak C. Sekar, Brian Cronquist, Israel Beinglass, Paul Lim, Zvi Or-Bach, MonolithIC 3D Inc. 
• Stress-induced Effects Caused by 3D IC TSV Packaging in Advanced Semiconductor Device Performance, V. Sukharev¹, A. Kteyan¹, J-H Choy¹, H. Hovsepyan¹, A. Markosian¹, E. Zschech², and R. Huebner²; ¹ Mentor Graphics Corporation, ²Fraunhofer Institute for Non-Destructive Testing

July – CMP Technology Trends and Market Dynamics

• Impact of 450MM on CMP, Michael Corbett, Linx Consulting, LLC
• The Ever Expanding Need for Planarization, Paul Feeney 
• Rebounds and Magic Triangles: Techcet CMP Consumables 2011 Market Update, Michael A. Fury, Ph.D., Techcet Group LLC
• Oxide Stop-in-Film CMP: New Challenges for the Next Generation Memory Devices, Andrey Zagrebelny, Sony Varghese, Andrew Carswell, Micron

September – CMP Issues Facing the Hard Disk Drive Industry 2011

• Integration of Advanced Carrier Head Technology for Established CMP Tools, Dan Trojan, Axus Technology

2010

April – CMP Consumables and Equipment

• Teaching Old CMP Equipment A Few New Tricks, Robert L. Rhoades, Ph.D., Entrepix
• Changing slurry formulations – Issues and Observations, Majid Milani, SVTC Technologies Inc.
• Molecular Diffusion under Nanometer Scale Confinement during CMP of Nanoporous Films, Taek-Soo Kim and Reinhold H. Dauskardt, Stanford University
• About the Dynamics of Defectivity Generation in CMP Technology, Yehiel Gotkis, KLA Tencor
• ICS-5000 – Capillary Ion Chromatograph, Bodsky, Dionex

July – New Frontiers for CMP

• BASF Soft Particles for Metal CMP, Vijay Raman, Claus Poppe, Bastian Noller, Michael Lauter, Yuzhuo Li
• Great Recession Legacy CMP Consumables New Playing Field, Karey Holland, Techcet Group, LLC.
• Urethane Phoenix Rising CMP Pads and Conditioners, Michael A. Fury, Techcet Group, LLC.
• CMP Industry Evolution, Michael Corbett, LINX Consulting, LLC.
• 450 mm Wafers – Solid Foundation or Loose Stones, Robert N. Castellano, Ph.D., The Information Network

September – Issues Facing the Hard Drive CMP Industry

• ICS-5000 Capillary Ion Chromatograph, Bodsky, Dionex
• Non-contact Sheet Resistance for Determining Polish Rates Determining Polish Rates, Walter Johnson, HaiJing Peng, KLA-Tencor
• Advances Advances in CMP Conditioner Conditioner and Pad Metrology Metrology Metrology For the Data Storage Industry, Robert Kertayasa, Vamsi Velidandla, Jim Xu, Zeta
• HDD Market Update: Changing Paradigms – New growth drivers and seasonality patterns emerging, Kim, TRENDFOCUS
• IC CMP and GMR Head CMP are Not the Same – Custom Solutions are Required, Okada, Strasbaugh
• Improved Embedded Alumina Defect Performance through a Multi Particle Slurry for Hard Disk Polishing, PC Selvaraj, Rujee Lorpitthaya, Denise Hunter, and Haresh Siriwardane, Cabot Microelectronics

December – Advanced Device Integration – FEOL/BEOL

• Process Technology Explosion: New Frontiers at Intersections of Semiconductor and Related Technologies, Brian Goodlin, Texas Instruments
• Developing a robust conditioning system in 300mm CuCMP – Better Ways to Build Better Wafers, John Zabasajja, Michael Pevny, Tammy Engfer and Doug Pysher, 3M Electronics
• FDSOI Metal Gate Transistors for Ultra Low Power Subthreshold Operation, S. A. Vitale, J. Kedzierski, P. W. Wyatt, M. Renzi, C. L. Keast, MIT Lincoln Laboratory

2009

May – CMP Consumables Development, Challenges & Fundamentals

• Effects of Ring Design on CMP Process Stability and Slurry Usage, Christopher Wargo, David Stockbower, Entegris
• The Design Features of Organic and Polycrystalline Metal Free Diamond Disks Advanced Diamond Solutions, Dr. Michael Sung, Kinik
• MIID: Preventing Contaminating Cross Connections in Semiconductor Process Tools in Semiconductor Process Tools – A presentation to the CMP Users Group, Peter M. Pozniak, Malema Sensors
• Fundamental Study of Interfacial Phenomena and Modeling for CMP Consumables Design, Kihyun Park, Boumyoung Park, Seungchoun Choi, Sungmin Park, and David Dornfeld, Pusan National University and LMAS
• Understanding Stress, Chemistry and Molecular Diffusion for Optimized CMP of ULK Dieletrics, Reinhold H. Dauskardt, Stanford University
• Opportunities and Challenges in Development of New CMP Pad Platform, Rajeev Bajaj, Steve Hymes, Naveen Vaduri, Steve Fisher, SemiQuest

July – Business Aspects of CMP/CMP-New Advances & Emerging Technology

• Effect of Pad Micro-Texture on Frictional Force, Removal Rate, and Wafer Topography during ILD/STI CMP Processes, Yun Zhuang, Xiaoyan Liao, Leonard Borucki, Jiang Cheng, Siannie Theng, Toranosuke Ashizawa and Ara Philipossian
• CMP Outsource Solutions: Fueling Customer Success, Tolic, Entrepix
• CMP Enables New TFT Architecture for 3D Monolithic Flash Memory, Robert L. Rhoades – Entrepix, Inc., Andrew J. Walker – Schiltron Corporation
• CMP Optimization and Control Through Real-Time Analysis of Process Effluents, S.J. Benner and D.W Peters, Confluense
• How Much Do We Really Know About the Chemical Reactions Occurred During Cu CMP?, Prof. Dr. Yuzhuo Li, BASF
• Addressing Pricing Pressure from a Filtration Company Perspective, Patrick Levy, and Vivien Krygier, Ph.D., Pall Corporation
• 2009 Market Slurries and Particles in CMP & a Bit Beyond, Karey Holland, Ph.D., Techcet Group, LLC.
• Impact of the Downturn on CMP, Mike Corbett, LINX Consulting
• CMP Process Monitoring and System Interoperability using Acoustic Emission, Joshua Chien, Moneer Helu, David Dornfeld, DE Lee, LMAS and UC Berkeley

2008

January –

• TSV-3D Integration, Ismail Emesh, ASM

April – CMP Challenges & CMP Solutions-Focus on Consumables

• The Dressing of Pads for CMP of Next-Generation Wafers, Dr. James C. Sung, Dr. Michael Sung
• Presentation on SemiNeedle ™, Robert Petrossian, InfoNeedle, Inc.
• Consumable Technologies to Cover a Wide Variety of CMP Applications, Paul Feeney, Cabot Microelectronics Corporation
• CMP Conditioner and CMP Conditioner and Pad Characterization, Len Borucki, Araca Incorporated

July – Business Aspects of CMP/CMP-New Advances & Emerging Technology

• Still Planar After All These Years, Techcet CMP Consumables Market Update, Michael A. Fury, Techcet Group LLC
• Examples of CMP Processes for the Manufacturing of MEMS Devices, Gerfried Zwicker, Fraunhofer Institute for Silicon Technology
• Analyses of Diamond Disc Substrate Wear and Diamond Micro-Wear in Copper Chemical Mechanical Planarization Process, Y. Zhuang, A. Meled, X. Wei, J. Cheng, Y. Sampurno, L. Borucki, A., Philipossian, M. Moinpour, D. Hooper
• The Effect of Conditioner Design on Pad Texture, Morgan Advanced Ceramics, David Slutz
• An Alternate Definition of CMP – Cost Managed Processes, Robert L. Rhoades, Ph.D, Entrepix
• Novel Particles and Matching Chemistry in CMP Slurries for 22 nm Technology Node, Yuzhuo Li, BASF
• CMPlicity ™ Displacing Cost and Complexity with Efficiency and Simplicity in CMP, John Hughes, Product Manager, ATMI
• The History & Future of CMP, Karey Holland, Ph.D. – NexPlanar, and Ken Cadien, Ph.D. – University of Alberta
• Consolidation Trends in the CMP Consumable Supply Base, Michael Corbett, LINX Consulting

September – CMP Infrastructure and Support Systems

• Facilities Recommendations: Liquid Supply Systems Some Recommendations from Sub Fab Experiences, Jeff Wilmer, Brian Orzechowski, Zeke Pietsch, DivInd, LLC
• Weighing Options for CMP Wastewater Treatment, Brian V. Jenkins, Craig W. Myers, PhD, Kevin S. Olson, Nalco Company
• Developing Filtration Solutions for Advanced Technology Nodes, Levy, Pall Corporation

November –

• Paper Format Guidelines
• ICPT Call for Papers

December – Advanced BEOL Integration

2007

April – CMP Challenges & CMP Solutions-Focus on Consumables

• Advances in CMP Fundamental Understanding and Applications to Consumable and Process Design, Gregory P. Muldowney, Carolina L. Elmufdi, A. Scott Lawing, Rohm and Haas
• Challenges for CMP Consumable Suppliers, Khan, Cabot Microelectronics
• Optimizing Solution Chemistry for Reduced Damage during CMP, Taek-Soo Kim, Qiping Zhong, Maria Peterson, Halbert Tam, Tomohisa Konno, and Reinhold H. Dauskardt, Stanford University and JSR
• A Couple Of Considerations on the Dynamics of Defectivity Generation in CMP Technology, Yehiel Gotkis, KLA Tencor

July – Emerging Developments in CMP

• Characterization and Performance of PVA Brushes for Post-CMP Cleaning of Cu Low-k Films, Rakesh K. Singh, Christopher R. Wargo, David W. Stockbower, Entegris Inc.
• Semiconductor Industry Trends and What They Mean to CMP, Robert L. Rhoades, Ph.D. – Entrepix, Inc., Karey Holland, Ph.D. – Techcet Group, LLC
• Challenges and Opportunities in CMP Consumables – A Chemist’s View, Yuzhuo Li, Clarkson University
• Role of Stress and Solution Chemistry for Reduced Damage During CMP of Ultra-Low-k Materials, Taek-Soo Kim¹, Katherine Mackie², Qiping Zhong², Maria Peterson², Halbert Tam², Tomohisa Konno², and Reinhold H. Dauskardt¹, ¹Stanford University, and ²JSR
• Advancements For Sub 45nm Advancements For Sub 45nm Fixed Abrasive STI CMP, John Gagliardi Andre Zagrebeln John Gagliardi, Andrey Zagrebelny, Bill Joseph, Larry Zazzera, 3M Company
• CMP Markets & Value Chain Perspectives, Michael Corbett, LINX Consulting

November – Intellectual Property in Nano & Semiconductor Technology

December

2006

April

• CMP nHancement Applications Using ViPRR Carrier Technology, Lily Yao, Bill Kalenian, Larry Spiegel, Bryan Sennett, Mike Kirkpatrick, Strasbaugh
• PolyCrystalline Diamond Conditioners for Dressing CMP Pads: An Enabling Technology for Manufacturing Future Semiconductor Devices, James C. Sung, Cheng-Shiang Chou, Barnas G. Monteith, Michael Sung, Advanced Diamond Solutions
• What Does The Future Hold? Dean Freeman, Gartner

June

• Removal Rate Controlled Ceria Slurries for Low Defectivity and High Planarity in DSTI CMP, and Tunable Polysilicon Polishing Slurry Platforms Information, James Shen, Cabot
• The Next Generation of Direct STI slurry, Lower COO, Improved Process Window, Reduced Defects, and Improved Stability, Jim Rothenberger, Dupont
• Modeling Layout Dependant Within die Non Modeling Layout Dependant Within die Non-uniformity uniformity In High Selectivity STI CMP In High Selectivity STI CMP, Jihong Choi¹, David Dornfeld¹ and David Hansen²;  ¹University of California at Berkeley, ²Cypress Semiconductor Corp.
• Direct-Polish STI CMP Process For Next Generation Gap Fill Technologies, A. Iyer, G. Leung, G. Menk, B. Zhang, G. Prabhu, N. Ingle, T. Winson, Z. Yuan, V. Banthia, Applied Materials

2005

June

• Process Characterization of CMP Consumables, Robert L. Rhoades, Ph.D., Total Fab Solutions
• Advanced Barrier Slurry Development for 65nm and Beyond, Ken Delbridge, Gert Moyaerts, Gerome Sayles, Saeed Mohseni, & Deepak Mahulikar, Planar Solutions L.L.C.
• Fixed Abrasive Pad Development Fixed Abrasive Pad Development for Future CMP Process, Dr. T. V. (Jay) Jayaraman, MIPOX International Corporation
• Advances in STI Process and Consumable Design, A. Scott Lawing, Rohm and Haas
• Innovation in ILD Polishing: Ultra-Low Defects and Reduced CoO, Cabot Microelectronics
• Evolution of CMP Pad Conditioners & Abrasive Technology’s Leadership Role, Abrasive Technology

December

2004

February

• The Orientation Effects in Shape Evolution in CMP, Edward Hwang, Prof. David Dornfeld, University of California, Berkeley
• Role of Glycine-H₂O₂ in Chemical Mechanical Polishing of Copper, V. R. Gorantla, Z. Lu, S. Hegde, E. Matijevi, and S. V. Babu, Center for Advanced Material Processing

April

May

• Polishing Pad Impact on the Yield on W CMP, Guangwei Wu, Long Nguyen, Steve Kirtley, and Thomas West, Thomas West, Inc.
• Advanced Tungsten CMP with No Pad Conditioning Presentation to the NCCAVS CMP Users Group, Robert Rhoades (Polishing Solutions International, LLC), Anthony Clark (psiloQuest, Inc.), John Bare (psiloQuest, Inc.)
• Pad Conditioning Effects in Chemical Mechanical Polishing, A. Scott Lawing, Rohm and Haas
• Advanced Slurry/Pad Technologies for Cu/Low-K CMP Process, JSR Micro
• Methods Of Defect Inspection and Detection For Copper CMP, Christopher Hawes and Shumin Wang (Cabot Microelectronics), Ray Campbell (KLA-Tencor)
• Development of a Planarized 3-Level Interconnect Module for Medical Devices with Resistor Films, Ralph Danzl (Medtronic, Inc.), Robert L. Rhoades, Ph.D. (Polishing Solutions International, LLC.)

December

2003

May

• Characterization of Planarization Capability of Polishing Pad, Guangwei Wu, Thomas West, Inc.

June

• Full Wafer-Scale Solution to Thin-film Metrology for CMP, Scanning Thickness Mapper (STMapper), Sangbong Lee, Filmetrics, Inc.
• Cu-Based Interconnect Post-CMP Cleaning, E.S.C., Inc.
• Minimizing Particles During the Post CMP Cleaning Process, David J. Albrecht, Entegris

December

• Integration Issues with Cu CMP, Michael R. Oliver, Rodel, Inc.
• Equipment & Materials Integration Challenges, Lubab Sheet, SEMI
• Modeling of Pattern Dependent Pressure Non-uniformity at Die-scale for an Integrated CMP model, Jihong Choi, University of California, Berkeley
• Effect of Aqueous Solution Chemistry on the Accelerated Cracking of Nanoporous Thin-Films, Eric P. Guyer and Reinhold H. Dauskardt, Stanford University

2002

March –

• Outlook for CMP Consumables, Gil Yang, Salomon Smith Barney 
• Analysis and Prediction of Polish Profiling, Manabu Tsujimura, David Watts, Ebara Corporation
• CMP Outlook: Looking for a Better 2002, Robert Castellano, The Information Network
• Advanced in-situ end-point control system for CMP applications, Charlie Shin, KLA-Tencor
• Cu CMP Cleaning Aqueous, Alkaline Chemistry, ESC, Inc.

April –

• High Power Megasonic Cleaning in the CMP Application, Doug Swanson, Product Systems, Inc.
• Post-CMP Cleaning Mechanisms – An Experiment-Combined-Numerical Analysis Approach, T. Zhang, K. Bahten, E. Estragnat, H. Liang, J. Lee, Rippey and Universitry of Alaska, Fairbanks
• New Processing Foams, BPT one Process Technologies, Berkshire Holding Corporation
• Post CMP Cleaning for STI Ceria Slurries, Robert Small, Ph.D., Brandon Scott, EKC Technology, Inc.

June –

• Copper and Low-k: Consumables Outlook, Kline
• Nitrogen-Based Slurry Development for Copper/Low-k (SiLK™) Integration, Lily Yao, Bob Small, Ph.D, KZ Kadowaki, Srini Raghavan, EKC Technology, Inc.
• Development of Copper Slurries for Advanced Technologies, Jeff Chamberlain, Shumin Wang, Maria Peterson, Cabot Microelectronics

August –

• The Changing Needs of CMP: How to Design for Technology Shifts, B. Small, L. Yao, R. Jee, H. Tran, B. Scott, C. Shang, M. Yu, P. Chelle, D. Frey, F. McClung, EKC Technology, Inc.
• Integrated Copper CMP Barrier Slurry Development to Achieve Adjustable Rates and Selectivities, Heather Rayle, Rodel, Inc.
• Hitachi Chemical Metal CMP Slurry and Low-K Material, Shigeru Nobe, Matthew Tsai, Larry Inouye, H. Sakurai, J. Amanokura, Hitachi Chemical

September –

• Polishing Pad Characterization with an In-situ Metrology Instrument, Tuyen Vo, Thuann Q.Khuu, Tessellation Inc.
• AccuSizer FX – Online Monitoring of Particle Size in CMP Slurries by SPOS, Requiring Little or no Dilution, David Nicoli, Kerry Hasapidis, Paul Toumbas, Particle Sizing Systems, Inc.
• LuminaCU Reverse Linear CMP (RL-CMP™) Technology for <100nm Interconnect Applications, Mukesh Desai, Steven C. Chen, Yuchun Wang, Tuan Truong, NuTool® 
• Advanced Techniques for Post-CMP Inspection: An Evolutionary Approach, K. Greissinger, Inspex
• Padprobe™ for Quantitative Control of Pad Surface Conditions and Wear, Norm Gitis, Mike Vinogradov, Alex Meyman, Jun Xiao, Center for Tribology, Inc.

October –

• Low-k Dielectrics, Gil Yang, Salomon Smith Barney
• Hard Porous Pad™ for Copper Low K CMP, Guangwei Wu, Long Nguyen, Galvez Pepito, and Tom West, Thomas West Inc.
• Copper CMP Challenges, Ingrid Vos, Imec
• CMP Market And Technology Status – 2002, Tom Tucker, Laredo Technologies
• Tuning Hydroxylamine Slurries for Copper Barrier Polishing for (SiLK™) Low-k Integration, Lily Yao, Bob Small, KZ Kadowaki (EKC Technology, Inc.); Ketan Itchaporia and Micheal Simmons (Dow Chemical, Inc.)
• Copper/Low k CMP Gains Momentum™, Sanjay Basak, Jim Schlueter, and Saket Chadda, Speed-Fam Ipec
• The Removal of Micro and The Removal of Micro and Nanoscale Particulate Defects Nanoscale Particulate Defects, A. A. Busnaina, J. Park, A. A. Busnaina, J. Park, W. L. Smith, Northeastern University