PAG Proceedings

2024

August Agenda – Joint User Group Meeting (CMPUG, PAG, & TFUG)
Evolving Trends in Advanced Packaging (3D integration, memory modules, AI, chiplets, on-shoring, etc.)

• Improved CMP processes through architecture & design optimizations, Knut Gottfried, ErzM and Fraunhofer ENAS
• Atmospheric Plasma Simplifies Die-to-Wafer Bonding, Daniel Pascual, ONTOS
• Advanced X-Ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection, Jeff Gelb, Sigray Inc.
• Strategies for Probe to enable Advanced Packaging, Mike Slessor, FormFactor
• Chemical Mechanical Planarization (CMP) for hybrid bonding, Swetha Barkam, Applied Materials (N/A)

2023

October Agenda – New Frontiers in the Future of Plasma Processing: Where We Are and What Lies Ahead

PAG Panelists: 

Richard A. Gottscho, Executive Vice President, Lam Research Corporation, USA
Vincent M. Donnelly, Professor, Dept. of Chemical and Biomolecular Engineering, University of Houston, USA
W.M.M. (Erwin) Kessels, Professor, Dept. of Applied Physics, Eindhoven University of Technology,
The Netherlands
Jianping Zhao, Technical Director, Tokyo Electron, USA

Video Recording: https://drive.google.com/file/d/1ZPzpksy5HDRinxDKM0-WBGC9y_2jh6xH/view

September Agenda – Packaging Beyond the Mainstream
(Joint User Group Meeting: CMPUG, PAG, TFUG)

• Waferbonding and CMP – A Perfect Couple, Knut Gottfried, ErzM and Fraunhofer ENAS
• Pt / HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications, Liangyu Chen, NASA
• The CHIPS Act-related National Advanced Packaging Manufacturing Program, Scott Sikorski, IBM
• Hybrid Multiscale Manufacturing Technologies for Heterogeneous Package Integration, P M Raj, Florida International University (not available)
• A Review on CMP Challenges in HWB and Wafer Level Packaging, G. Bahar Basim, Intel

2022

June Agenda – Semiconductor Packagin Outside the Mainstream (Joint User Group Meeting: CMPUG, PAG, & TFUG)

• Die-attach Materials Empowering Power Devices: Removing Heat and Supplying Power, Andy Mackie, Ph.D., Indium Corporation (not available)
• Packaging Advances in the OSAT, Foundry, and MEMS Markets with a Highlight on Europe, Steffen Kroehnert, ESPAT Consulting
• AIM Photonics Electronic-Photonic Technologies and Packaging outside the Mainstream, David Harame, Ph.D., SUNY Polytechnic, Colin McDonough, AIM Photonics
• On-Shoring the Next Generation of Advanced Packaging, Charles Woychik, Ph.D., SkyWater Technology
• Packaging Methods for Flexible Hybrid Electronics, Melissa Grupen-Shemansky, Ph.D., SEMI
• Test and Measurement Challenges and Opportunities for Chiplet Heterogeneous Integration, Amy Leong, FormFactor

April Agenda – Plasma Applications for the Developement, Modification and Implementation of Carbon Allotropes

• Plasma-functionalization of MWCNTs for Energy Storage, Conversion and Ttransport, Dr. Sylvain Coulombe, McGill University
• New Opportunities for Plasma-based Approaches to Diamond Synthesis, Dr. Mohan Sankaran, University of Illinois, Urbana-Champaign (not available)
• Approaches for the Modification of Macroscopic Carbon Nanotube Assemblies with Atmospheric-Pressure Plasma, Dr. Ruairi McGlynn, Ulster University
• Graphene Transducer Manufacturing, Lonnie Wilson, GraphAudio (not available)
• Electron Beam Generated Plasma as an Ultra-low Te Approach to Processing Graphene, Dr. Scott Walton, US Naval Research Laboratory (not available)

2021

April Agenda – Advances in CMP Consumables, Materials and Tools

• Measuring Large Particle Contaminants in Cerium Oxide Chemical Mechanical Polishing,  (CMP) Slurries with Total Holographic Characterization, Laura A. Philips, Spheryx, Inc.
• Slurry Injection System (SIS) Implementation in Dielectric and Metal CMP for III-V Semiconductors, John Zabasajja, HRL Laboratories
• CMP Process Challenges for mmWave Si Technology, Hong Jin Kim, Global Foundries
• Mixing and Handling Challenges with Next Generation Slurries, Carlo Aparece, Mega Fluid Systems and Marc Maxim, CMC Materials
• Industry Standards: From Egyptian Royal Cubit to SEMI Guides for CMP Consumables, Alex Tregub, Intel
• Effect of Process Variables on CMP Process Temperature, Catherine Bullock, Axus Technology (Pending)
• A New Kinetic Removal Rate Model for Tungsten CMP, Ara Philipossian, Araca Inc. (Pending)
• Preventing Cross Contamination with MIID (Malema™ Interconnect Interlock Device), Jay Rajagopalan, Malema Sensors
• Effective Slurry Concentration Monitoring Using Refractive Index, Tracy Gast, Entegris
• Nanoparticle Characterization Introduction: DLS, Diffraction, and NTA, Dr. Jeff Bodycomb, HORIBA Scientific

June Agenda – Novel Applications of Advanced Semiconductor Device Packaging Technology (Joint User Group Meeting: CMPUG, PAG, & TFUG

• Higher Yield, Lower Cost Power Devices Through Plasma Dicing Process Integration, David Lishan, Ph.D., Plasma-Therm
• Advanced Packaging for Superconducting Quantum Processors, Joseph Suttle, Ph.D., IBM Quantum (Not Available)
• MEMS: Strategies for Codevelopment of the Electronics and the Package, Alissa Fitzgerald, Ph.D., A.M. Fitzgerald & Associates
• Unique Electronic Device Packaging Solutions for Rugged Environments, Matt Francis, Ozark Integrated Circuits (Not Available)
• Packaging of Micro- and Nano-Systems for Operation within Extreme Harsh Environments, Debbie Senesky, Professor, Stanford University (Not Available)

October Agenda – Advances in CMP Applications and Research

• • Bringing Value to the Customer with Big Data, Andrea Oehler, PhD, Fujimi Corporation
  • Exploiting Fluorescence for Enhanced Nanoparticle Tracking Analysis of CMP Slurries, Dr. Jeff Bodycomb and Carl Lundstedt, Horiba Scientific
  • Modulating Interfacial Reactions to Develop “Soft” p-CMP Processes, Abigail L. Dudek, Kiana A. Cahue, Tatiana R. Cahue, Mantas M. Miliauskas, and Jason J. Keleher, Lewis University
  • Advanced Point of Dispense Filtration for Recirculating Systems, Bradley Wood, Entegris
  • Applications of AI, Machine Learning and Big Data in Chemical Mechanical Polishing, Scott Lawing, Kinik North America
  • CMP Knowledge Foundry and Big Data Analytics, A. Philipossian, N. Monfared , Y. Sampurno, Araca, Inc., and J. J. Keleher, Lewis University

2020

February Agenda – NCCAVS User Group Joint Technical Symposium – The Quantum World
NCCAVS 2020 Poster Session – Results

• Modeling Systems with Quantum Computers, Rudy J. Wojtecki, IBM Research – Almaden (N/A)
• Optimizing Quantum Optimization Algorithms for Noisy Quantum Computers, Davide Venturelli, USRA Research Institute for Advanced Computer Science (Pending)
• Enterprise Software to accelerate the quantum revolution, Christopher T. Brown, Zapata Computing, Inc.
• Materials Engineering for Quantum Information Technology, Robert Jan Visser, Applied Materials (Pending)
• Introduction of a new technology platform to enable scalable fabrication of single silicon vacancy defect arrays, Andre Linden, Raith America, Inc.
• Thin Film Fabrication of Quantum Upconverting Sensors for Dark Matter Detection, Dale Li, SLAC National Accelerator Lab
• Quantum Measurement Protocols for Upconverting Sensors, Stephen Kuenstner, Stanford University
• Superconducting quantum coherent circuits: introduction, challenges, and near-term applications, John Mark Kreikebaum, Lawrence Berkeley National Laboratory & University of California, Berkeley

April Agenda – Advances in CMP Consumables, Materials and Tools

• Membrane Carrier Tuning for State of the Art CMP Process Development in R&D Environments, Knut Gottfried, Fraunhofer ENAS
• Holistic Approach to the Understanding CMP-Induced Defects, Hong Jin Kim, Global Foundries
• CMP – A Leap Forward; Capstone, Catherine Bullock, Axus Technology
• No Process Can Change Alone: An Integrated Approach to CMP Consumable Development and Manufacturing, Stephen Bottiglieri, Saint Gobain Abrasives
• Characterization of Large Particle Contaminants in CMP Slurries using Holographic Video Microscopy, Laura Philips, Spheryx, Inc. (Pending)
• Case Studies Involving the Use of a 300-mm Brush Scrubber and Tribometer to: (A) Evaluate the Role of Anionic Supramolecular Assemblies in Post-STI-CMP Cleaning, and (B) Determine the Effect of Brush Nodule Placement Density on Shear Force in Time and Frequency Domains in Post-W-CMP Cleaning, Ara Philipossian, Araca Inc.

June Agenda – Advanced Packaging Technology

• Plasma Dicing – The “Next Normal” Richard Barnett, Senior Product Manager, Etch Products (SPTS Technologies Ltd, Newport, UK)
• Heterogeneous Integration Roadmap and the Revolution Enabling Future Progress, Dr. Wilmer R. Bottoms, Chairman, Third Millennium Test Solutions
• Surviving the Heat Wave – A presentation on thermally induced failures and reliability risks created by advancements in electronics technologies…and How Modeling Early in the Design Process can Identify these Issues, Greg Caswell, ANSYS
• Heterogeneous Integration Competence Center – An Open Access Innovation Incubator, Garrett Oakes, EV Group (Pending)
• Solving the DataCenter Energy Crisis with Silicon Photonics and Overcoming Photonics Wafer-level Test Challenges, Dr. Choon Beng Sia, FormFactor

September Agenda – Advancements in CMP Applications and Research

• • Ultra-rapid Bulk Polishing of 150mm Silicon Carbide Substrate with Single-wafer Chemical Mechanical Planarization (CMP), Donshan (Sean) Yu, Applied Materials (N/A)
  • Computational modeling of CMP pads: a die-scale model incorporating measured surface roughness, Brian Salazar, University of California, Berkeley
  • Enhanced Melt-blown Filtration For Next Generation CMP Slurries and Applications, Patrick Connor, Pall
  • Surface and Electrochemical Evaluations for Barrier and Packaging level CMP Optimization, G Bahar Basim, University of Florida
  • Copper Removal at Short Time with Implications for Polishing Mechanisms, Len Borucki, Araca
  • CMP defects: Influence of CMP slurry, handling and delivery, Rahul Trivedi, GlobalFoundries
  • CMP Pad Conditioning and Applications to Soft Pads, Scott Lawing, Kinik
  • Effective Slurry Mixing and Handling and its Impact on CMP Slurry Particle Health, Carlo Aparece, Mega Fluids Systems
  • Correlation between dishing/erosion and electrical properties in copper interconnects after chemical mechanical planarization, Shirley Lin, Versum Materials
  • Correlating Shear Force and CoF to Platen Motor Current in Copper, Cobalt, Tungsten, STI and ILD CMP at Non-steady-state and Steady-state Conditions, Ara Philipossian, University of Arizona

2018

February Agenda-NCCAVS Joint Users Group Technical Symposium: Process, Materials, and Technology Innovation for Smart Devices, Displays, and Internet of Things

• Reliability for the 21^st Century: Meeting Challenges of New Technologies and New Markets, (Plenary Talk) Milena Vujosevic
• Development and R2R Scale up of a Hybrid Printed CMOS Silicon TFT Process, Patricia Beck, Thin Film Electronics
• Tool Design Considerations for Advanced Atomic Layer Deposition, Duane Bingaman, Kurt J. Lesker Company
• Electron Heating in Sputtering Magnetrons, Andre Anders, LBNL, Leibniz Institute of Surface Engineering
• Plasma-based Thin Film Depositions: Applications, Limitations, Our Improvements, and Case Studies in Battery, Photovoltaic, Non-volatile Memory, and Medical Devices Applications, George Guo, Ascentool Inc.
• Can a New Materials Innovation in Thin Film Optical Applications be Faster and Cheaper?, Guowen Ding, Labforinvention Corp.
• A Quantitative Approach to Optical Emission Spectroscopy, Frank Papa, Gencoa
• Thin Film Roadmap for Solid State Li Metal Batteries, Ernest Demaray, Demaray LLC
• Solid-state Thin Film Batteries in 3D, J.R. Gaines, Jr., Kurt J. Lesker Company

April Agenda-Advances in CMP Consumables, Materials, and Tools

• Outlook for CMP Consumables, Mike Corbett, Linx Consulting
• Recent Trend of CMP Equipment Platform and its Requirement of Process and Consumables: BEOL CMP, Sunghoon Lee, GlobalFoundries
• Particle Developments as an Enabler of Next Generation Ceria Slurries, Nate Urban, Ferro
• Almost Complete Removal of sub-90nm Ceria Particles from Silicon Dioxide Surfaces, Jihoon Seo, Clarkson University
• Studying Effects of Surfactants on CMP Slurries with Holographic Characterization, Laura Philips, Spheryx Inc.
• Reduced Cost of Ownership Oxide CMP Process using 300mm Consumables for 200mm Processing, Christopher Eric Brannon, Texas Instruments
• 3D Trajectories, Diffusion, and Interaction Energies of Ceria Particles on Glass Surfaces, Akshay Gowda, Clarkson University
• High Efficiency Post-CMP Cleans for Advanced FEOL and MOL Applications, Paul Bernatis, Dupont-EKC Technology (pdf N/A)
• Tuning Wear Rate and Surface Finish of CMP Pads via Precise Control of Pad Conditioner Features, Matthew Fritz, 3M Company
• Tribocorrosion Mechanism for Tungsten Void in CMP in-situ Cleaning, Hong Jin Kim, Global Foundries
• Assay Characterization of Industrial CMP Slurries Based on Densitometry, Refractive Index and Dynamic Light Scattering, Leticia Vázquez Bengochea, University of Arizona
• Advanced Cu CMP Slurries for Advances Node Cu CMP Applications, Tom Shi, Versum Materials
• Cobalt Buff Step CMP for Middle of the Line Applications and Reduction in Slurry Consumption Using a Novel Slurry Injection System, Calliandra Stuffle, University of Arizona

June Agenda-Joint User Group (CMP, PAG, & TFUG) Meeting: Advanced Packaging Technology

• Monolithic Integration of GaN Sensors and Electronics for Harsh Environments, Dr. Caitlin Chapin, XLab (Not Available)
• Equipment and Process Challenges for the Advanced Packaging Landscape, Laura Rothman Mauer, Veeco Instruments, Inc.
• Heterogeneous Integration Needs Heterogeneous Package Assembly, Annette Teng, Promex Industries
• Fan-out IC Packaging Trends and the Impact on Equipment Capital Structures (e.g., Wafer Processing Versus Traditional PCB Styles) Today and in the Future, Jon Woodyard, SiPAQ, LLC
• Low temperature, low damage plasma technologies for advanced packaging applications, David Lishan, Plasma-Therm, Inc.
• CMP and Current Trends Related to Advanced Packaging, Robert L. Rhoades, Ph.D., Entrepix

July Agenda-CMP Technology and Market Trends

• Global Manufacturing Update – Opportunities and Pitfalls for Manufacturers in 2^nd half of 2018 and beyond, Len Jelinek, IHS Insights
• Next Gen CMP Challenges for 3D Memory Architectures, Sai Vegunta, Micron
• Investigation of NMR-based Surface Area Measurement as a Quality Monitor for Nanoparticle Silica Abrasives, Olga Samsonenka, Andy Kim, University of Washington
• New Insights into the Tribological and Kinetic Attributes of Retaining Rings in Chemical Mechanical Planarization, Gabriela Diaz ^a, Lauren Peckler ^a, Yasa Sampurno ^a,b , Ara Philipossian ^a,b, ^a University of Arizona, ^b Araca Incorporated
• Molecular Design of CMP Consumables for Advanced (<10nm) Processing Technologies, Michael E. Mills, DOW Electronic Materials
• New Paradigms in CMP Consumables, Rajeev Bajaj, Applied Materials
• Developing Robust Quality Systems for CMP Solid Consumables, Alex Tregub, Intel
• Impact of Advanced Memory Technologies on CMP Industry, Mike Corbett, Linx Consulting
• Formulated Products for W CMP, Chun Lu, Versum Materials