TFUG Proceedings

2024

August Agenda – Joint User Group Meeting (CMPUG, PAG, & TFUG)
Evolving Trends in Advanced Packaging (3D integration, memory modules, AI, chiplets, on-shoring, etc.)

• Improved CMP processes through architecture & design optimizations, Knut Gottfried, ErzM and Fraunhofer ENAS
• Atmospheric Plasma Simplifies Die-to-Wafer Bonding, Daniel Pascual, ONTOS
• Advanced X-Ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection, Jeff Gelb, Sigray Inc.
• Strategies for Probe to enable Advanced Packaging, Mike Slessor, FormFactor
• Chemical Mechanical Planarization (CMP) for hybrid bonding, Swetha Barkam, Applied Materials (N/A)

2023

September Agenda – Packaging Beyond the Mainstream
(Joint User Group Meeting: CMPUG, PAG, TFUG)

• Waferbonding and CMP – A Perfect Couple, Knut Gottfried, ErzM and Fraunhofer ENAS
• Pt / HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications, Liangyu Chen, NASA
• The CHIPS Act-related National Advanced Packaging Manufacturing Program, Scott Sikorski, IBM
• Hybrid Multiscale Manufacturing Technologies for Heterogeneous Package Integration, P M Raj, Florida International University (not available)
• A Review on CMP Challenges in HWB and Wafer Level Packaging, G. Bahar Basim, Intel

2022

June Agenda – Semiconductor Packagin Outside the Mainstream (Joint User Group Meeting: CMPUG, PAG, & TFUG)

• Die-attach Materials Empowering Power Devices: Removing Heat and Supplying Power, Andy Mackie, Ph.D., Indium Corporation (not available)
• Packaging Advances in the OSAT, Foundry, and MEMS Markets with a Highlight on Europe, Steffen Kroehnert, ESPAT Consulting
• AIM Photonics Electronic-Photonic Technologies and Packaging outside the Mainstream, David Harame, Ph.D., SUNY Polytechnic, Colin McDonough, AIM Photonics
• On-Shoring the Next Generation of Advanced Packaging, Charles Woychik, Ph.D., SkyWater Technology
• Packaging Methods for Flexible Hybrid Electronics, Melissa Grupen-Shemansky, Ph.D., SEMI
• Test and Measurement Challenges and Opportunities for Chiplet Heterogeneous Integration, Amy Leong, FormFactor

2021

May Agenda – Advances in Energy Storage, Conversion, and Harvesting

(MP4 video links available)

• Metal Organic Framework for Water Extraction from Air, David Kuo, Waha Inc.
• Tailoring Interfaces for Superior Next-generation Batteries, Mark Huijben, University of Twente, Netherlands (file N/A)
• Energy Storage and Thermal Harvesting with Hybrid Materials, Jeffrey Urban, Lawrence Berkeley National Lab
• An Overview of Solid-State Lithium Battery Development, James Kaschmitter, SpectraPower, LLC (file N/A)
• Atomic/Nano-scale Surface Engineering for Electrochemical Energy Conversions, Min Hwan Lee, UC Merced

June Agenda – Novel Applications of Advanced Semiconductor Device Packaging Technology (Joint User Group Meeting: CMPUG, PAG, & TFUG

• Higher Yield, Lower Cost Power Devices Through Plasma Dicing Process Integration, David Lishan, Ph.D., Plasma-Therm
• Advanced Packaging for Superconducting Quantum Processors, Joseph Suttle, Ph.D., IBM Quantum (Not Available)
• MEMS: Strategies for Codevelopment of the Electronics and the Package, Alissa Fitzgerald, Ph.D., A.M. Fitzgerald & Associates
• Unique Electronic Device Packaging Solutions for Rugged Environments, Matt Francis, Ozark Integrated Circuits (Not Available)
• Packaging of Micro- and Nano-Systems for Operation within Extreme Harsh Environments, Debbie Senesky, Professor, Stanford University (Not Available)

July Agenda – Advances in Metrology

(MP4 video and PDF links available)

• • Zeta Potential as an Indicator of Solid Surface Chemical Properties, Vidumin Dahanayake, Anton Paar (PDF available)
  • Molecular Analysis of Nanoscale Defects and Residue, Sung Park, Molecular Vista (PDF available)
  • Contamination on Transparent and Opaque Materials, Steven W. Meeks, Lumina Instruments (PDF available)
  • Surface Contaminant Analysis by TOF-SIMS and SEM/EDX, Dan Sullivan, EAG Laboratories (PDF available)

2020

February Agenda – NCCAVS User Group Joint Technical Symposium – The Quantum World
NCCAVS 2020 Poster Session – Results

• Modeling Systems with Quantum Computers, Rudy J. Wojtecki, IBM Research – Almaden (N/A)
• Optimizing Quantum Optimization Algorithms for Noisy Quantum Computers, Davide Venturelli, USRA Research Institute for Advanced Computer Science (Pending)
• Enterprise Software to accelerate the quantum revolution, Christopher T. Brown, Zapata Computing, Inc.
• Materials Engineering for Quantum Information Technology, Robert Jan Visser, Applied Materials (Pending)
• Introduction of a new technology platform to enable scalable fabrication of single silicon vacancy defect arrays, Andre Linden, Raith America, Inc.
• Thin Film Fabrication of Quantum Upconverting Sensors for Dark Matter Detection, Dale Li, SLAC National Accelerator Lab
• Quantum Measurement Protocols for Upconverting Sensors, Stephen Kuenstner, Stanford University
• Superconducting quantum coherent circuits: introduction, challenges, and near-term applications, John Mark Kreikebaum, Lawrence Berkeley National Laboratory & University of California, Berkeley

May Agenda – Metrology

• Advanced film adhesion characterization by scratch testing, Pierre Morel, VP for applications at Rtec Instruments (n/a)
• Golden Eye for the IoT Age – Industrial Applications of Transmission Electron Microscopy, Dr. Peng Zhang, EAG Laboratories (n/a)
• X-Ray Diffraction From the Easy to the Hard, Chris Moore, VP Technology, Covalent Metrology
• Thin Film Measurements by Multi-Wavelength Ellipsometry, Blaine Johs, Filmsense LLC (n/a)

June Agenda – Advanced Packaging Technology

• Plasma Dicing – The “Next Normal” Richard Barnett, Senior Product Manager, Etch Products (SPTS Technologies Ltd, Newport, UK)
• Heterogeneous Integration Roadmap and the Revolution Enabling Future Progress, Dr. Wilmer R. Bottoms, Chairman, Third Millennium Test Solutions 
• Surviving the Heat Wave – A presentation on thermally induced failures and reliability risks created by advancements in electronics technologies…and How Modeling Early in the Design Process can Identify these Issues, Greg Caswell, ANSYS
• Heterogeneous Integration Competence Center – An Open Acces
• s Innovation Incubator, Garrett Oakes, EV Group (Pending)
• Solving the DataCenter Energy Crisis with Silicon Photonics and Overcoming Photonics Wafer-level Test Challenges, Dr. Choon Beng Sia, FormFactor

September Agenda – Plasma and Thin Film Technology Helping in the Fight Against COVID-19

• Point-of-Care Molecular Detection for Pathogen Testing, Nader Pourmand PhD, Professor of Biomolecular Engineering, University of California, Santa Cruz (mp4 file)
• Cellular Nanosponges for the Treatment of Viral Infection, Liangfang Zhang, PhD, Professor of Nanoengineering, Bioengineering, and Chemical Engineering, University of California, San Diego (N/A)
• Plasma Decontamination of Surfaces, Daphne Pappas, PhD, Manager, Applications/R&D, Plasmatreat USA, Inc. (mp4 file)

2019

February Agenda-NCCAVS Users Group Joint Technical Symposium

• Next Generation Energy Storage Technologies, Subramanya (Subra) Herle, Applied Materials
• Solid-state Thin Film Batteries Take a Page Out of the 3D Transistor Play Books, J.R. Gaines, Kurt J. Lesker Company
• Advances and Challenges with Rechargeable Lithium-Air Batteries, Dave Sopchak, Coulombic, Inc.
• Peak Power Impact on Battery Cycle Life, Naoki Matsumura, Intel
• Directly Converting Heat to Electricity using Compact, Microfabricated Thermionic Devices, Jared Schwede, Spark Thermionics (N/A)
• AlN-based Piezoelectric Energy Harvesting, Mary Ann Maher, SoftMEMS (N/A)
• Tribute to John W. Coburn, David Graves, U.C. Berkeley
• How to Make Manufacturing of LEDs Truly Green, Prasad N. Gadgil, Atomic Precision Systems
• GaN HEMT Electronics for Extreme Environments, Saleh Kargarrazi, Stanford XLab
• Conversion Technologies for Generating, Transmitting, and Storing Energy, Joint Users Group Technical Symposium
• Selection of Battery and Charging Algorithm to Extend Battery and Cycle Life, Naoki Matsumura

October Agenda-Metrology: Overview and Advances

• Hyperspectral Infrared Characterization of Extremely Thin Films with 10nm Spatial Resolution, Sung Park, Molecular Vista
• Optical Inspection of Transparent Materials, Steven Meeks, Lumina Instruments
• Accelerating Materials Discovery Through Advanced Metrology and Machine Learning, Cesar Clavero, EMD Performance Materials
• Use of Secondary Ion Mass Spectrometry as a Thin Film Characterization Tool, Jeff Mayer, Eurofins EAG

November Agenda-Advanced Memory

• Semiconductor Memory: Opportunities and Challenges, Bob Gleixner, Micron
• ALD Chalcogenide: A Key Player for Next Generation Crosspoint Memory, Mario Laudato, EMD Performance Materials
• RERAM Engineering for Neuromorphic Computing, Siddarth Krishnan, Applied Materials (N/A)
• New PVD Systems for Advanced Memory Applications, Wei Chen, Applied Materials
• Materials Metrology for Advanced Memory, Srini Rangarajan, Nova Measuring Instruments (N/A)

2018

February Agenda-NCCAVS Joint Users Group Technical Symposium: Process, Materials, and Technology Innovation for Smart Devices, Displays, and Internet of Things

• Reliability for the 21^st Century: Meeting Challenges of New Technologies and New Markets, (Plenary Talk) Milena Vujosevic
• Development and R2R Scale up of a Hybrid Printed CMOS Silicon TFT Process, Patricia Beck, Thin Film Electronics
• Tool Design Considerations for Advanced Atomic Layer Deposition, Duane Bingaman, Kurt J. Lesker Company
• Electron Heating in Sputtering Magnetrons, Andre Anders, LBNL, Leibniz Institute of Surface Engineering
• Plasma-based Thin Film Depositions: Applications, Limitations, Our Improvements, and Case Studies in Battery, Photovoltaic, Non-volatile Memory, and Medical Devices Applications, George Guo, Ascentool Inc.
• Can a New Materials Innovation in Thin Film Optical Applications be Faster and Cheaper?, Guowen Ding, Labforinvention Corp.
• A Quantitative Approach to Optical Emission Spectroscopy, Frank Papa, Gencoa
• Thin Film Roadmap for Solid State Li Metal Batteries, Ernest Demaray, Demaray LLC
• Solid-state Thin Film Batteries in 3D, J.R. Gaines, Jr., Kurt J. Lesker Company

June Agenda-Joint User Group (CMP, PAG, & TFUG) Meeting: Advanced Packaging Technology

• Monolithic Integration of GaN Sensors and Electronics for Harsh Environments, Dr. Caitlin Chapin, XLab (Not Available)
• Equipment and Process Challenges for the Advanced Packaging Landscape, Laura Rothman Mauer, Veeco Instruments, Inc.
• Heterogeneous Integration Needs Heterogeneous Package Assembly, Annette Teng, Promex Industries
• Fan-out IC Packaging Trends and the Impact on Equipment Capital Structures (e.g., Wafer Processing Versus Traditional PCB Styles) Today and in the Future, Jon Woodyard, SiPAQ, LLC
• Low temperature, low damage plasma technologies for advanced packaging applications, David Lishan, Plasma-Therm, Inc.
• CMP and Current Trends Related to Advanced Packaging, Robert L. Rhoades, Entrepix, Inc.

October Agenda – Advances in Display Technology

• High yield equipment enables profitable OLED manufacturing, Dr. Xuena Zhang, Applied Materials
• Reliability Assessment of Rotary Sputter Targets in PV Manufacturing, Dr. Venkata Bheemreddy, MiaSole Hi-Tech Corp.
• Large Area Magnetron Sputtering, Ready and Waiting for Gen 10 and Beyond, Peter Sieck (Not Available)

November Agenda-PAG & TFUG Student Symposium

• Using Paschen curves to determine DC plasma sputtering conditions, Calvin Chen, Dirar Mashaleh, Corey Abraham, Abdul Kikhia
• Achieving high aspect ratio deep trench etching, Dylan Benjamin, Aditya Dhaketa, Alexander Cress, Briana Fees, Gautam Pisharody
• Managing particle formation in plasmas, Curtis Ma, Samuel Yeung, Simran Singh, Michael Walker, Muhammad Tariq, Charleston Chua
• Ensuring substrate uniformity at the edges of the substrate in large diameter processing tools, Zachary Rayha, Harjeet Hansi, Stephanie Villavicencio, Yanghyeon Kim
• Designing gas injection systems and showerhead design for uniform plasma deposition, Andy Giang, Raul Gonzalez, Yifu Chen
• Using diagnostic instruments to develop the next generation of plasma etch/dep tools, Artem Biryukov, Riley Foss, John Scheckel, Janaye Marshall, Crystal Pereira, Zhe Mi

2017

February Agenda – NCCAVS Joint Users Group Technical Symposium: Novel Materials, Processes, and Devices for Future Generation Electronics

• Mechanisms of Plasma Therapy (Plenary Talk), David Graves, UC Berkeley
• Large-Scale, Thin-Film Battery, Ernest Demaray, Demaray LLC
• Inkjet Printing for Manufacturing of Flexible and Large-Size OLEDs, Jeff Hebb, Kateeva
• Rapid Materials and Device Innovation for Non-Volatile Memory Applications, Larry Chen, Intermolecular
• BEOL Interconnect Innovations for Improving Performance, Paul Besser, Lam Research
• Nanoscale Chemical Imaging & Topography with Photo-induced Force Microscopy, Thomas R. Albrecht, Molecular Vista, Inc.
• Material Innovation for Non-Volatile Memory Selectors, Larry Chen, Mark Clark, Charlene Chen, Milind Weling, Intermolecular

June Agenda – Joint CMPUG/TFUG Meeting: 3D Packaging Technology

• Monolithic 3D Integration Using Standard Fab and Standard Transistors, Zvi Or-Bach, Monolithic 3D Inc.
• Reliability of ultra-fine RDL Structures in Advanced Packaging Patterned by Excimer Laser Ablation, Markus Arendt, SUSS MicroTec Photonic Systems, Inc.
• CMP and Current Trends Related to Advanced Packaging, Robert L. Rhoades, Entrepix, Inc.
• Fabrication and Reliability of Ultra-Fine RDL Structures in Advanced Packaging by Excimer Laser Ablation, Markus Arendt, SÜSS MicroTec Photonic Systems Inc.

September Agenda – Advances in Display Technology

• • Quantum Dots’ Next Act: Moving to the Mainstream, Jason Hartlove, Nanosys
  • Advanced Display Manufacturing Technology, John D. Busch, Applied Materials
  • Advanced inkjet printing: Enabling the OLED display revolution, Jeff Hebb, Kateeva

2016

February Agenda – Materials, Devices, and Systems for Intelligent Engineering Solutions

• NCCAVS Joint User Group Symposium Abstract Book and Exhibit Guide

April Agenda– Advanced Memory

• NAND Flash: Where are we, where are we going?, Pranav Kalavade, Intel
• Emerging Memory: From Technology to Applications, Dave Eggleston, GLOBALFOUNDRIES
• STT MRAM Technology and Productization, Jing Zhang, Ph.D., Avalanche Technology

June Agenda – 3D Packaging

• Novel Process of RDL formation for Advanced Packaging by Excimer Laser Ablation, Markus Arendt, SUSS MicroTec Photonic Systems Inc.
• Optical Metrology and Inspection for Fan-Out Wafer Level Packaging (FOWLP), Ben Garland, Jim Xu, Ph.D., and Vamsi Velidandla , Zeta Instruments Inc.
• CMP for Advanced Packaging, Robert L. Rhoades, Entrepix, Inc.
• Between 2D and 3D: WLFO Packaging Technologies and Applications, Minghao Shen, Altera Corporation (now part of Intel)

November Agenda- Energy Storage & Conversion

• An Advanced Bipolar Silicon-Lead Technology for Renewable Energy Applications, Collin Mui, Gridtential
• The Future of Solid State Batteries for Electric Vehicles, Marca M. Doeff, Lawrence Berkeley National Laboratory

2015

February Agenda – Technology Innovation for Next Generation Materials and Manufacturing

• Message from Indium Corporation, Jacques Matteau, Indium Corporation
• Low Emissivity (Low-E) Coating Technologies for Energy Saving Window Applications, Guowen Ding, Intermolecular
• 40 Years of Magnetron Sputtering: Still an Exciting Field for Discovery, Andre Anders, Lawrence Berkeley National Laboratory
• New Applications of Chemical Mechanical Polishing, Rob Rhoades, Entrepix, Inc.

June Agenda– 3D Packaging

• Electromigration Simulation Flow For Chip-Scale Parametric Failure Analysis, Jun-Ho Choy, Mentor Graphics Corp.

July Agenda – Biomedical Applications

• Novel Use Of Reactive Multilayer Foil For Mars Planetary Exploration, Jacques Matteau, Indium Corporation
• Atmospheric Pressure Plasma Based Fabrication of Low Cost Paper Biosensors, Ramprasad Gandhiraman, NASA Ames Research Center (USRA)

September Agenda– Semiconductor Technology Beyond 7nm

• Carbon-based Materials for Flexible Electronics, Nan Liu; Zhenan Bao, Stanford University
• Zeiss Process Gas Analyzer based on Ion Trap Technology, Outstanding Performances as In-line, Real Time Gas Analyzer, Michel Aliman, Hin Yiu Anthony Chung , Martin Antoni, Gennady Fedosenko, Alexander Laue, Rüdiger Reuter, Valerie Derpmann, Leonid Gorkhover, Andreas Gorus, Andreas Pecher Carl Zeiss SMT GmbH, Rudolf-Eber-Str. 22, 73447 Oberkochen, Germany
• Energy-efficient Design for Emerging NVM Technology: Enabled by Carbon Nano-materials, Ethan C. Ahn, Ph.D., Department of Electrical Engineering, Stanford Nanoelectronics Lab., Stanford University
• Limitations and Challenges to Meet Moore’s Law, Sung Kim, Sr. Director of Maydan Technology Center; Advanced Products Technology Development, Applied Materials
• Sub-5 nm Patterning and Applications by Nanoimprint Lithography and Helium Ion Beam Lithography, Yuanrui Li, Ahmed Abbas, Yuhan Yao, Yifei Wang, Wen-Di Li, Chongwu Zhou, and Wei Wu

November – Energy Storage & Conversion

• The Future of Energy Storage, Venkat Srinivasan, Lawrence Berkeley National Lab

2014

February – Nanomaterials for Energy, Biomedical, and Electronic Devices

• Biomedical Devices: Engineering’s Contributions to Improving Quality of Life, Guna Selveduray, San Jose State University
• Metal-Carbon Nanotube Contacts, Patrick Wilhite and Cary Yang, Santa Clara University
• Efficient Electromagnetic and Multiphysics Simulation – from Nanomaterials to Macro Devices, Mike Hook, Cobham Technical Services
• Controlled Nanoparticle Generation by Terminated Cluster Growth in a Sputtering Chamber, Andre Anders and Cesar Clavero, Lawrence Berkeley National Laboratory
• Implement Smell and Taste with Nano-sensor, Zhiyong Li, HP Labs

June – 3D Packaging

• Monolithic 3D is now Practical, Zvi Or-Bach, MonolithIC 3D Inc.
• TCAD Modeling for Mechanical Stress Management in 3D IC Packages, Xiaopeng Xu, TCAD R&D, Synopsys, Inc.

July – Display and Lighting

• High efficiency LCDs using Quantum Dot Enhancement Film, Jian Chen, Nanosys, Inc.
• A novel method of managing joint stress, in a metallic bond made using reactive multilayer foils, at a user selected temperature (for applications of bonding LEDs to heat sinks), Jacques Matteau, Indium Corporation
• Reinventing Memory for Things (TM) – Application specific memory solutions for integrated, connected, and high-temperature applications, Bard Pedersen, Adesto Technologies
• High power radio-frequency plasma light sources for industrial applications,Lars Dugaiczyk, Luxim Corp.

August Agenda – Biomaterials Applications

• Sterilization of Biomedical Devices, Jeff Sauter, NUTEK Corporation

September Agenda – Energy Storage

• Fueling the future: Safe, Dense, Reversible Hydrogen Storage in Hybrid Nanomaterials, Jeffrey Urban, Lawrence Berkeley National Laboratory
• Graphene-based Electrodes for Electrochemical Energy Conversion and Storage, Min Hwan Lee, University of California Merced
• Sun to Fiber: a thin film optical funnel for broadband transport and conversion, Matthew Garrett, University of California Santa Cruz

December Agenda – Advanced Memory

• The Internet of Things…, Lucian Shifren, ARM
• Memory Selector Devices, An Chen, Global Foundries
• Perpendicular MTJ Stack Development for STT MRAM, Mahendra Pakala, Applied Materials
• Perpendicular Magnetic Multilayers, Sangmun Oh, HGST
• NEMS Memory for Low Power Application, Jin-Woo Han, NASA Ames Center for Nanotechnology

2013

February Agenda – Technology for Clean Energy

• Challenges and Solutions for More Sustainable Energy Systems, Stacey F. Bent, Stanford University
• Novel Plasmonic Materials for Energy-Related Devices, César Clavero, Ph.D., Lawrence Berkeley National Laboratory
• Process Development for Advanced Generation Crystalline Silicon Solar Cells, James Gee, Applied Materials
• Depth Profiling of Organic Photovoltaic and OLED Materials by Cluster Ion Beams, J.S. Hammond¹, S. N. Raman¹, S. Alnabulsi¹, N. C. Erickson² and R. J. Holmes²;  ¹Physical Electronics, ²University of Minnesota
• Thermoelectrics (TE) at the Nanometer and Sun to Fiber (S2F) at the Micrometer, Nobuhiko “Nobby” Kobayashi, University of Santa Cruz
• Measurement of CdTe Ratio for Composition Control, Gary Mount, Larry Wang and Wesley Nieveen, Evans Analytical Group
• Sunny Future for the Solar Industry, KRS Murthy, I3 Solar
• Nanostructured Energy Conversion for Low‐power Energy Harvesting Devices and Beyond for High-power ‘Sun‐to‐fiber’ Solar Devices, Michael Oye and Nobuhiko “Nobby” Kobayashi, University of California, Santa Cruz
• Advances in MOCVD Process and Equipment Technology Enabling Solid State Lighting, G.D. Papasouliotis and Wei Zhang, Veeco Instruments, Inc.
• Technology and Economic Considerations for High Volume HBLED Lithography Manufacturing, Manish Ranjan, Ultratech

June Agenda – 3D Packaging

• 3D Packaging for Memory Application, Ming Li, Ph.D., Rambus
• Considerations When Selecting A Wafer Level Bonding Process, Garrett Oakes, EV Group
• Overview of CMP for TSV Applications, Robert L. Rhoades, Ph.D., Entrepix
• Stress-induced Effects Caused by 3D IC TSV Packaging in Advanced Semiconductor Device Performance, V. Sukharev¹, A. Kteyan¹, J-H Choy¹, H. Hovsepyan¹, A. Markosian¹, E. Zschech², and R. Huebner²; ¹Mentor Graphics Corporation, ²Fraunhofer Institute for Non-Destructive Testing
• Cooling Three-Dimensional Integrated Circuits using Power Delivery Networks (PDNs), Hai Wei, Stanford University

September Agenda – Energy Storage

• Energy Storage – the Foundation for a Renewable Energy Future, Robert D. Cormia, Foothill College 
• Energy Storage in Thin Sputtered Films, J.R. Gaines, Jr., Kurt J. Lesker, Co.
• Is There a Moore’s Law for Batteries? James Kaschmitter, PolyStor Energy Corporation 
• Analytical Methods for Characterizing Battery Materials, Sanjay Patel, Evans Analytical Group
• A front‐row seat to electrochemical systems in action: observing in‐situ Li+ transport, Jeff Urban, Berkeley Labs

November Agenda – Advanced Memory

• Interfacial Engineering in ReRAMs based on Strongly Correlated Electron Systems, Seshubabu Desu, Dongmin Chen, Lee Cleveland, and Jean Yang-Scharlotta, 4DS
• How Flash is Changing our Lives, Itzik Gilboa, SanDisk
• Non-Volatile Memory Technology: Directions Beyond Floating Gate Devices, Bob Gleixner, Chandra Mouli, Micron Technology
• Methodologies to Study the Scalability and Reliability Physics of Phase-Change Memory, Rakesh Jeyasingh, Scott Fong, Chiyui Ahn, SangBum Kim, Jiale Liang, Marissa Caldwell, Zijian Li, Jaeho Lee, Elah Bozorg-Grayeli, Mehdi Asheghi, and Kenneth E. Goodson (Stanford University); Delia Milliron (Lawrence Berkeley National Labs)
• Modeling aspects of forming and switching in RRAM devices, including possible doping effects for improved characteristics, Blanka Magyari-Köpe and Yoshio Nishi, Stanford University

2012

February – Technology for Clean Energy

• A Flow Battery for Grid-Scale Energy Storage, Vincent Battaglia, Lawrence Berkeley National Laboratory
• The Molecular Foundry at the Lawrence Berkeley National Laboratory: User Program: Statistics, Experiences, and Opportunities, David Bunzow
• Floating c-Si Thin Films for Solar Cells, U. Cohen and M. Roitberg, UC Consulting
• The Journey of SunPower to 20% Module Efficiency, Doug Kim, Gabriela Bunea, SunPower
• HB-LEDs and Solid State Lighting: Challenges and Opportunities, Tom Morrow, SEMI
• Characterization of Solar Grade Silicon Contaminants, Gary Mount, Evans Analytical Group
• Advances in ULTIMO™ Lithium Ion Capacitor (LIC) Technology, Jim Banas & Maria Peterson, JSR Micro & JM Energy
• Solar Technology; Crystalline Silicon PV Solar Cells, David Tanner, Applied Materials
• Correlation of Cell Efficiency with Photoluminescence Images, Bruce True, Intevac Corp.

June Agenda – 3D Packaging

• Mechanical Stresses and Reliability Study of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH using Synchrotron X-Ray Microdiffraction for 3-D Integration and Reliability, A.S. Budiman¹, H.-A. Shin², B.-J. Kim², S.-H. Hwang², H.-Y. Son³, M.-S. Suh³, Q.-H. Chung³, K.-Y. Byun³, Y.-C. Joo², R. Caramto⁴, L. Smith⁴, M. Kunz⁵, N. Tamura⁵;  ¹Los Alamos National Laboratory (LANL), ²Seoul National University (SNU), ³PKG Development Group, ⁴SEMATECH, ⁵Lawrence Berkeley National Laboratory (LBNL)
• Challenges and Solutions in 3DIC Extractions, Dusan Petranovic, Mentor Graphics
• Process Integration for 2.5D/3D – A Few Steps from the Summit, Niranjan Kumar, Applied Materials
• TSV Reveal Using Low-Selectivity CMP, Robert L. Rhoades, Paul Lenkersdorfer, and Dean Malta, Entrepix

July – Advanced Process and Integration in Semiconductor Technologies
September –

• Applications: Equipment for Characterizing and Processing Materials for Energy Storage Devices, J McGuire Technologies
• Synthesis and Characterization of Nanocarbon using the UCSC MACS Facility at NASA Ames, Robert Cormia, Foothill College, and Michael Oye, UCSC
• An Approach to Mass-produce Si Nanomaterial Composite with High Energy Density in Li-ion Cells without Cycle Life Compromise, Yimin Zhu, Ph.D, Nanosys, Inc

2011

February Agenda – NCCAVS Joint User Group Topical Conference on Photovoltaic Technology

• Trends in Photovoltaics, Dr. Peter Borden, Jasper Ridge LLC
• Kerf-Free Wafering: Technology Overview, Adam A. Brailove, Ph.D., Silicon Genesis Corporation
• Precision Process Power and Controls for Photovoltaic Manufacturing, Randy Heckman, Advanced Energy
• Modeling and Optimization of Silicon Solar Cells, Victor Moroz, Synopsys
• Characterization of Contamination in PV Materials, Ian Mowat, Karol Putyera, Larry Wang, Temel Buyuklimanli and Gary Mount, Evans Analytical Group
• The Flip Side of Technology: how plasma systems must evolve for solar PV applications, E. Ryabova, A. Skumanich, SolarVision Consulting
• The State of the PV Industry – An Association Perspective, Karen Savala, SEMI Americas
• For a Sunny Future, Roth & Rau

June Agenda

• CMP for TSV’s, Robert L. Rhoades, Ph.D., Entrepix
• Monolithic 3D DRAM Technology, Deepak C. Sekar, Brian Cronquist, Israel Beinglass, Paul Lim, Zvi Or-Bach, MonolithIC 3D Inc. 
• Stress-induced Effects Caused by 3D IC TSV Packaging in Advanced Semiconductor Device Performance, V. Sukharev¹, A. Kteyan¹, J-H Choy¹, H. Hovsepyan¹, A. Markosian¹, E. Zschech², and R. Huebner²; ¹Mentor Graphics Corporation, ²Fraunhofer Institute for Non-Destructive Testing

July – Advanced Process and Integration in Semiconductor Technologies

• Pattern Effects in Thermal Processing, P. J. Timans & Y. Lee, Mattson Technology
• Contact Improvement using E-beam and FIB-deposited tungsten in carbon nanofiber interconnects, Patrick Wilhite, Nobuhiko Kanzaki, Shusaku Maeda,Toshishige Yamada, and Cary Y. Yang, Santa Clara University

September – Energy Storage

• Li-Ion Batteries Basics, Mikhail Kislitsyn, Ph.D., Exponent

2010

February – Photovoltaic Energy

• Adhesion and Thermomechanical Reliability for PV Devices and Modules, Vitali Brand, Chris Bruner, Fernando Novoa, Jeff Yang, Monika Kummel, Reinhold H. Dauskardt, Stanford University
• High Performance of High Density and High Transparency Indium Tin oxide (ITO) and Zinc Aluminum Oxide (ZAO), Eduardo del Rio, Eugene Ivanov, Tosoh SMD Inc., K. Omi, H. Teraoka, Tosoh Corporation

April – Display and Imaging Technology

• Flexible Electronics: Why the Interest?  Where Are The Markets? What’s Next? Michael Ciesinski, FlexTech Alliance

June – Bio-Nano, Bio-MEMS and Nano-MEMS Technology

• Nanowires for microelectronics: realistic perspectives for on-wafer Si –compatible growth and applications, Francesca Iacopi, IMEC

August – Energy Storage
October – Advanced Memory

• Status and Challenges for Non-Volatile Spin-Transfer Torque RAM (STT-RAM),  Mohamad T. Krounbi, S. Watts, D. Apalkov, X. Tang, K. Moon, V. Nikitin , A. Ong, V. Nikitin, E. Chen, Grandis, Inc.

December – Advanced Device Integration – FEOL/BEOL

• Process Technology Explosion: New Frontiers at Intersections of Semiconductor and Related Technologies, Brian Goodlin, Texas Instruments
• Developing a robust conditioning system in 300mm CuCMP – Better Ways to Build Better Wafers, John Zabasajja, Michael Pevny, Tammy Engfer and Doug Pysher, 3M Electronics
• FDSOI Metal Gate Transistors for Ultra Low Power Subthreshold Operation, S. A. Vitale, J. Kedzierski, P. W. Wyatt, M. Renzi, C. L. Keast, MIT Lincoln Laboratory

2009

February – Alternative Energy

• Binder Interactions in the Electrodes of the Lithium-ion Batteries, Gao Liu, Honghe Zheng, Xiangyun Song, Paul Ridgeway, Suhan Kim, Andrew Minor, Yonghong Deng, and Vince Battaglia, Lawrence Berkeley National Laboratory
• Designing Nanomaterials for Energy Conversion and Storage, Yi Cui, Stanford University
• JM Energy’s Lithium Ion Capacitor: The Hybrid Energy Storage Advantage, Banas, JSR Micro Materials Innovation

April – Integration – FEOL

• Leakage Study of 45nm SRAM Devices with Different Layouts Using Advanced e-beam Inspection Systems, Hong Xiao, Eric Ma, Fei Wang, Yan Zhao, and Jack Jau, Hermes Microvision, Inc.
• Crystal Oxides On Silicon, Jim Reiner, Kevin Garrity, Alexie Kolpak, Yaron Segal, Fred Walker, Sohrab Ismail-Begi, and Charles Ahn (Yale University); Zhan Zhang, and Hawoong Hong (Argonne National Laboratory); Monica Sawicki, and Christine Broadbridge (Southern Connecticut State University); Dong Su (Brookhaven National Laboratory)
• HiK/MG Gate Stack Issues and Landscape, Steven Hung, Applied Materials
• Synthesis and Integration of Multifunctional Oxide Materials, Jane P. Chang, University of California, Los Angeles

June – Bio-Nano-MEMS Technology

• Enabling Research, Trial production and Manufacture production production and Manufacture Manufacture of Micro devices, Micro Stereolithography system, JSR Micro Inc.
• Biophysics looking forward from the past, Dr. S Jeffrey Rosner, Agilent Technologies
• Development of NanoBiosensors for Diverse Applications, M. Meyyappan, NASA Ames Research Center
• Transdermal delivery of macromolecules using Macroflux® technology, Russell Ford, PhD, Zosana Pharma
• An Investigation into the “World-to-chip” Interface, Sammy Datwani, Ph.D, LabCyte
• Biomimetically Engineered Nanomedical Systems, Demir Akin, M.D. Ph.D., Stanford University

August – Display and Imaging Technology

• Flexible Displays Flexible Displays and Microelectronics: and Microelectronics: Opportunities Opportunities and Challenges, Gregory B. Raupp, Arizona State University
• Depth Profiling of Organic Electronics, Dr. John S. Hammond, Physical Electronics 

October – Advanced Memory

• Spin Torque Devices: A Technology Simulation, Sayeef Salahuddin, University of California, Berkeley
• A Non Volatile MEMS Switch for Harsh Environment Memory Applications, Vikram Joshi, Charles Smith, Roberto Gaddi, Damian Lacey, Toshi Nagata, Mickael Renault, Anartz Unamuno, Rob van Kampen, Richard Knipe, and Dennis Yost, Cavendish Kinetics Inc.
• Phase Change Memory: Status and Challenges to Navigate an Increasingly Competitive Memory Landscape, Chuck Dennison, Ovonyx, Inc.
• Colloidal Metal Nanocrystals for Multilevel Cell NAND Flash Memory with 100,000 Cycling Endurance, Jian Chen, Nanosys, Inc.

2008

February – Alternative Energy

• Solid-State Thermionic Energy Conversion for Waste Heat Recovery, Ali Shakouri, Thermionic Energy Conv. Center
• “Electroactive Polymer Artificial Muscle – A Polymer Based Generator?” Randy Feldman, Artificial Muscle, Inc.
• PARC Cleantech Innovation Program, Scott Elrod, Palo Alto Research Center

April – Display and Imaging Technology

• Roll-to-Roll Manufacturing of Electronics on Flexible Substrates Using Self-Aligned Imprint Lithography, Ohseung Kwon, Marcia Almanza-Workman, Alison Chaiken, Robert Cobene, Richard Elder, Bob Garcia, Warren Jackson, Mehrban Jam, Albert Jeans, Han-Jun Kim, Hao Luo, Ping Mei, Craig Perlov, and Carl Taussig (Hewlett-Packard Company); Frank Jeffrey, Kelly Beacom, Steve Braymen, Jason Hauschildt, and Don Larson (PowerFilm Solar)

August – Advanced FEOL Integration

• Leakage Monitoring and Control with an Advanced e-beam Inspection System, Hermes Liu, J.H Yeh, Chan Lon Yang, S.C Lei, J.Y Kao, Y.D Yang, Mingsheng Tsai, and S.F Tzou (United Microelectronics Corp.); Hong Xiao and Jack Jau (Hermes Microvision, Inc.)
• Stress Engineering and its Interactions with High-k/Metal Gate and USJs, Victor Moroz, Synopsys
• Phase Change Memory: A Memory Technology for All Applications, Stefan Lai, Ovonyx
• Multi‐Gate MOSFETs Front‐End Process and Materials Needs, Prof. Tsu‐Jae King Liu, University of California, Berkeley
• Advanced Activation Using Various Thermal Budget Regimes Such As Flash, Multiple Flashes And Flash + Spike Annealing, J. Gelpey, W. Lerch, S. Paul, J. Niess, S. McCoy, Sing-Pin Tay, Mattson Technology Inc.

October – Advanced Memory Technology

• Physics and 30 nm Materials Science of Memristive devices, Jianhua Yang, Dmitry Strukov, Julien Borghetti, Matthew Picket,John Paul Stracham, Doug Ohlberg, Duncan Stewart, Phil Kuekes, Stan Williams, Hewlett-Packard Laboratories
• Recent Progress in Resistance Change Memory, Yoshio Nishi, Stanford University
• Resistive Switching Memory Technologies, An Chen, Advanced Micro Devices (AMD)

December – Advanced BEOL Integration

2007

March – Energy Technologies

• From Nano-Structured PV Materials to PV Concentrators and Beyond, Dr. Karl Littau, Palo Alto Research Center
• “A Disruptive Process for Low-Cost SOFC Manufacturing” Abhishek Jaiswal, NanoGram Corp.
• Wafer-based and Thin Film Silicon Photovoltaic Technologies, Peter Borden, Applied Materials

April – Diagnostics

• Surface Scattering technique for Micro-roughness characterization, Andy Steinbach, Christine Pelissier and Uday Mahajan, KLA-Tencor
• Diagnosing Adhesion and Cohesion for BEOL Reliability: From Dieseals and Crack Stops to Cu and Low k, Reinhold H. Dauskardt, Stanford University
• Wafer-Level Three Level Three-Dimensional ICs, Ronald J. Gutmann, RPI
• Direct Bond Interconnect for Advanced Packaging Applications, Paul Enquist, Ph. D., Ziptronix, Inc.

June – 3-D Interconnect for Wafer Level Packaging

• A Novel Bonding Mechanism Using Aluminum Using Aluminum-Induced Crystallization of Amorphous Silicon, Markus D. Ong, and Reinhold H. Dauskardt, Stanford University

August – Advanced Thin Films

• Grain Focused Modeling and Simulation, Timothy S. Cale (Rensselaer Polytechnic Institute, Arizona State University, Process Evolution Ltd); and Max Bloomfield (Arizona State University, Process Evolution Ltd)
• Probing Plasticity at Small Scales: From Electromigration in Advanced CU Interconnects to Dislocation Starvation in AU Nanopillars, Arief S. Budiman, Stanford University

October – Advanced FEOL Integration

• Advanced Patterning Thin Films, Minh Tran, Spansion Inc.
• Feature scale modeling of a gate etch Feature scale modeling of a gate etch process used to study SRAM bit cell process used to study SRAM bit cell pattern transfer into a gate stack pattern transfer into a gate stack, Phillip Stout, Applied Materials
• Resistive switching for next generation Flash technology, Christie Marrian, Spansion

November – Intellectual Property in Nano & Semiconductor Technology
December

2006

February

• “Development Low H Damascene SiN for Advanced FLASH Cu BEOL”, Alex Níkel¹, Minh-Van Ngo¹, Lu You¹, Minh Tran¹, Eric Wilson², Hieu Pham², ¹Advanced Process Development, Advanced Micro Devices; ²Sub-micron Development Center, Spansion
• “Pure-Silica-Zeolites as Low-k Materials”, Zijian Li¹,³, Yushan Yan¹, Minwei Sun¹, Christopher Lew¹, Shuang Li¹, Mark Johnson¹, Junlan Wang¹, Mark Davis², Todd Ryan³ , Jeremy Martin³, David Earl⁴, Michael Deem⁴, and Wolfgang Maichen⁵, ¹University of California, Riverside; ²California Institute of Technology; ³AdvancedMicro Devices Inc.; ⁴Rice University; ⁵Teradyne Inc.
• The Case For High Aspect Ratio (HAR) Interconnects, Uri Cohen, UC Consulting

April

• New Devices to Extend Scaling of Non-volatile Memory, Zoran Krivokapič, Strategic Technology Group
• Gate Stack Scaling, Challenges and Approaches in Meeting Technology Requirements, Yi Ma, Applied Materials
• Device and Technology Challenges for Nanoscale CMOS, H.-S. Philip Wong, Stanford University
• Siconi™ Preclean for FEOL Applications, Xinliang Lu, Applied Materials
• Pulse Nucleantion Layer (PNL) WN/W and Its Application on Direct Contact Fill, Juwen Gao, Novellus

August

• The Impact of power supply arc response on production yield and field reliability, Dave Christie, and Dan Carter, Advanced Energy Industries, Inc.

2005

February

• Modern SOI Materials, Jean-Pierre Colinge, University of California, Davis
• IRSE300, Metrology of: SOI, SiGe / SGOI, Strained Si, Bipolar and others, Sopra
• SiGe Epi deposition for NPN HBT base layer, Sagy Levy, Cypress

May

• Optical Measurement of Thickness and Properties of Ultra-Thin Films in Complex Multi-Layer Film Stacks Used in MRAM Fabrication, Alexander Gray, Jacob McPherson, n&k Technology, Inc.
• Equipment Supplier’s Perspective on the Evolution of Si Technology Development, Gregg S. Higashi, Ph.D., Applied Materials

June

• Optical Metrology of Low-κ Dielectrics, Phillip Walsh, n&k Technology, Inc.
• CVD deposited low k dielectrics for gap-fill applications, John Macneil, Trikon Technologies, Inc.

September

• Comprehensive Metrology Tools for Characterization and Measurements of Ultra-Thick Films, Determination of Optical Properties of Materials, n&k Technology, Inc.

December

2004

March

• Advances in Thin Film Metrology for MRAM, Mark Willingham, ADE Corporation
• Current Status of Phase Change Memory and its Future, Stefan Lai, Intel Corporation
• Mram: A New Technology for the Future, Kamel Ounadjela, Cypress Semiconductor

August

• Jets-ECD (JECD) and Multiple Seed Layers For Copper, Interconnects < 0.10µm, Uri Cohen, UC Consulting
• Integrated Integrated Metrology System for Metallization Process Metrology System for Metallization Process – MESEC Series MESEC Series, Gai Chin, ULVAC, Inc.
• Metallurgical Considerations for PVD Materials, Applied Materials

December

• Challenges in Cu/Low K Integration for Multilevel BEOL Wiring, Vincent McGahay, IBM

2003

February
April

• Characterization of High-k Dielectrics (HfO2, Al2O3, HfAlOx) with VUV Spectroscopic Ellipsometer (VUV-SE) and Grazing X-ray Reflectometer (GXR), P. Boher, P. Evrard, C. Defranoux, L. Sun, A. Darragon, J.C. Fouere, and J.L. Stehle (SOPRA); E. Bellandi (STMicroelectronics); H. Bender (IMEC)
• Analysis of high-k HfO2 and HfSiOx dielectric films, Wesley Nieveen, Evans Analytical Group

May

• Fabrication and Fabrication and characterization of characterization of high-performance performance thin-film transistors, Alberto Salleo, Palo Alto Research Center
• Nanowires of four epitaxial hexagonal silicides grown on Si (001), Yong Chen, Douglas A. A. Ohlberg, and R. Stanley Williams, Hewlett-Packard Laboratories
• Nanoscale molecular-switch devices fabricated by imprint lithography, Yong Chen, Douglas A. A. Ohlberg, Xuema Li, Duncan R. Stewart, and R. Stanley Williams, Hewlett-Packard Laboratories
• Nanoscale molecular-switch crossbar circuits, Yong Chen, Gun-Young Jung, Douglas A A Ohlberg, Xuema Li, Duncan R Stewart, Jan O Jeppesen, Kent A Nielsen, J Fraser Stoddart, and R Stanley Williams, Hewlett-Packard Laboratories
• An Overview of OLED Display Technology, Homer Antoniadis, OSRAM Opto Semiconductors Inc.

November

• A Study of Dilute Cu Alloys for Dual-Damascene Interconnect Applications, Cara Hutchison, Anil Bhanap, Mike Pinter, Wuwen Yi, Karen Scholer, Nicole Truong, Bob Prater, Eal Lee, Honeywell Electronic Materials

December

• Integration of Modeling and Simulation into Process Development, P.L.G. Ventzek, S. Rauf, P.J. Stout, Motorola and Digital Dna
• Chamber Conductance Modeling Using Transition Flow CFD and a Thermal Radiation Analogy to Free Molecular Flow, Lawrence A. Gochberg, Novellus
• Modeling in FaST Division, G. Janik, KLA-Tencor
• Gas Surface Interaction Modeling for Carbon Nanotube Deposition, Hash, Govindan, Meyyappan, NASA Ames Research Center

2002

February

• Comments at AVS Panel Discussion, M. David Levenson 
• Massively Parallel Direct Write E-Beam System, H.F. Lockwood (Emission Systems, LLC); W.B. Feller, P.L. White, and P.B. White (Nova Scientific, Inc.)
• IC Industry Lithography Requirements and Nikon’s Plans, J. C. Wiesner, Nikon Precision Inc.

March

• ALD W and TiN for Advanced Contact Application, Alex Yoon, Hongbin Fang, Amy Zhang, Cheryl Knepfler, Jeong Soo Byun, Larry Chen, Toshio Itoh, Jerry Gelatos and Ming Xi, Applied Materials, Inc.
• Scaling Induced Performance Limitations of Metal Interconnects, Prof. Krishna Saraswat, Stanford University

April

• Roadmap of SiGe BiCMOS technologies, Greg U’Ren, Conexant Systems
• Properties and Applications of Strained Si/SiGe, Dr. A. Samoilov, Dr. A. Thilderkvist, Applied Materials, Inc.
• Silicon-Germanium: from Microelectronics to Micromechanics, Tsu-Jae King, University of California, Berkeley

May

• High-κ Gate Dielectrics: Novel Growth Methods, Interface Structures and Electrical Properties, Paul C. McIntyre, Stanford University

June

• InGaAsN: A Promising Material for Long Wavelength Vertical Cavity Lasers, Michael Leary, Agilent Technologies Laboratories

July

• Thin Film Metrology at Applied Materials: Present and Future, Abner F. Bello, Applied Materials, Inc.
• Scanning Probe Microscopy An Ultimate Tool for Nanoscience and Nanotech, Lin Huang, PhD, Veeco Metrology Group

August

• Cu Plating Today and Tomorrow: Managing the Terminal Effect, John Klocke, Semitool
• Thermal Stress and Reliability Characterization of Cu Interconnects, Katsuyuki Musaka, Applied Materials, Inc.

October

• Ultra-Low k Spin-on Polymer; Benefits, Challenges, and Solutions for Damascene Integration, Don Frye, DOW Chemicals
• Low-k Dielectrics for On-Chip Interconnect Applications, Michael Lu, Peter Burke, Hao Cui, Darren Moore, Wei-Jen Hsia, Wilbur Catabay, LSI Logic
• JSR Spin-on dielectrics, JSR-LKD 5109, Low k Challenges Beyond 100nm, Aoki, JSR Micro Materials Innovation
• Metrology for Low-k Materials, Technos S-MAT

November

• Barrier, John Forster, Applied Materials, Inc.
• Cu Seed Layers: Do It Right By Design (Why Repair?), Uri Cohen, Ph.D., UC Consulting
• Microstructural Characterization of Copper Interconnects, Paul R. Besser, Advanced Micro Devices, Inc.

December

• The PE-ALD of Ta Based Metals/Nitrides: The Growth, Materials, Properties, and Applications to Future Device Fabrications, Hyungjun Kim, and Steve M. Rossnagel, IBM Research
• Fundamental Vacuum Beam Studies of Radical Enhanced Atomic Layer Chemical Vapor Deposition (REAL-CVD) of TiN, Dr. Frank Greer, Dr. D. Fraser, Dr. J.W. Coburn, and Professor David B. Graves, University of California, Berkeley