CMPUG Announcements

We are now accepting abstracts for the Chemical Mechanical Planarization Users Group (CMPUG) Winter Symposium. We welcome submissions on CMP, post-CMP cleans, and related upstream and downstream technologies. This year, we are also allocating a few speaker slots to highlight work at the interface of AI/ML (Artificial Intelligence / Machine Learning) and CMP/post-CMP cleans.

The symposium serves as an international forum for academic researchers, industrial practitioners, and engineers from around the world for the exchange of information on state-of-the-art research in CMP and post-CMP cleans in the semiconductor, MEMS, and nanotechnology industries.  The CMP User Group fosters the exchange of opportunities, ideas, friendly relationships, and research collaboration.

Key areas of focus for this meeting include:

• CMP and Post-CMP Consumables and Materials
• CMP and Post-CMP Polishing and Metrology Tools
• CMP and Post-CMP Process Integration
• Work at the interface of AI/ML and CMP / Post-CMP cleans

Abstract/Presentation Submissions

• Please submit an abstract (using the abstract submission template) of your presentation no later than Friday October 31, 2025, to the meeting Co-Chairs, Nagella, Katrina, and Richard
• Authors will be notified of acceptance by return e-mail
• This is an all-virtual event therefore, all accepted presenters are required to submit their presentations in pdf or pptx format, approved by their respective organizations/employers for public release, by November 20, 2025
• All presentations will be posted on the CMPUG Proceedings webpage within 2 weeks following the meeting.

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