HYBRID MEETING | Advance Registration Required
* In-person attendance is highly recommended to foster engaging discussions. However, if you cannot join us in person, we still value your participation. For those attending virtually, we will be sending a special Zoom link to participate in this event. Login details will be sent to the email you use when you register. Login details will be sent 1-2 days prior to the event start date and will be the same for both days.
ABSTRACT DEADLINE EXTENDED: March 14, 2025
MEETING DATE: April 3-4, 2025
TIME: TBD
LOCATION/PLATFORM:
St. Charles Borromeo North Campus, Lewis University
101 W. Airport Road
Romeoville, IL 60446
RECOMMENDED HOTEL
Holiday Inn Express
722 Center Blvd.
Romeoville, IL 60446
(630) 229-6445
CO-CHAIRS:
Bahar Basim, Intel, G.Bahar.Basim@intel.com
Jason Keleher, Lewis University, keleheja@lewisu.edu
Mike Pevny, 3M Company, mpevny@mmm.com
Devon Shipp, Clarkson University, dshipp@clarkson.edu
FREE TO ATTEND! ADVANCE REGISTRATION REQUIRED
(Zoom login details will be provided upon registering)
2025/04/03 13:00:00
CALL FOR ABSTRACTS – Submission Deadline: March 14, 2025
The Chemical Mechanical Planarization Users Group (CMPUG) invites abstracts for the April meeting on Developing the “Next Generation” CMP Ecosystem. This annual symposium provides an international forum for academic researchers, industrial practitioners, and engineers to exchange knowledge on state-of-the-art research in CMP semiconductor technology. CMPUG fosters collaboration, networking, and discussion of opportunities, ideas, and technical advancements in the field.
Held on the campus of Lewis University in Romeoville, Illinois, this hybrid event will highlight research and innovation in CMP and post-CMP cleaning. A symposium session will be dedicated to current student researchers—emerging leaders in the CMP community—to present their work and engage with experts from academia and industry. Discussions will center on fundamental research, cutting-edge technologies, and challenges shaping the future of planarization and cleaning in semiconductor manufacturing.
The key focus areas for this year’s meeting include:
- CMP Consumables and Materials
- CMP Polishing and Metrology Tools
- CMP Process Integration
Thursday morning (April 3) will feature a short CMP and p-CMP cleaning course open to the CMPUG community.
Abstract/Presentation Submissions
Please submit an abstract (less than 200 words) of your presentation by March 14, 2025.
You may submit your abstract by filling in the form linked below. Alternatively, you may submit your abstract to the meeting Co-Chair, Jason Keleher (keleheja@lewisu.edu). Authors will be notified of acceptance by return e-mail.
Abstract Submission Form: https://forms.gle/AJicLxFEJBmm24118
All accepted presenters are required to submit their presentations in .pdf format, approved by their respective organizations/employers for public release, by April 3, 2025.
Platinum Sponsors
Gold Sponsors
All presentations from this meeting will be posted on the CMPUG Proceedings webpage ~2 weeks following the meeting.
Sponsorship
If you would like to sponsor a 2025* User Group (CMPUG, JTG, PAG, or TFUG) meeting, click the “BE A SPONSOR” button.
*2025 CMPUG Schedule is posted, some details are still TBD