OPTIONAL TOUR:
12:00-12:45 p.m. (Central Time)
3M Innovation Center (limited to 50 people and must be registered by April 3rd)
MEETING DATE: April 8, 2026 (Hybrid Meeting)
TIME: 1:00 p.m.-5:30 p.m. (Central Time) – check your time zone
LOCATION: 3M Company Innovation Center
2350 Minnehaha Ave. E
St. Paul, MN 55119
SECURITY NOTE: Official government IDs are required for entry into the 3M site, (Domestic and International guests), This is a site security mandate that cannot be by-passed.
PLATFORM: Zoom
REGISTER: Free to Attend – Advance Registration Required for Security Approval
REGISTER BY APRIL 3, 2026 – If you plan to attend in person and/or signing up for the tour!
Registration for virtual attendance will remain open through April 8th.
(Zoom login details provided upon registration, whether attending virtually or in person)
CO-CHAIRS:
Michael Pevny, 3M Company, mpevny@mmm.com
Bahar Basim, gbbasim@yahoo.com
AGENDA/SPEAKERS
1:00 pm – Welcome and Acknowledgment of Sponsors, Co-Chairs Michael Pevny (3M), Bahar Basim
1:10 pm – PLENARY TALK – CMP Process Challenges in Logic vs. Memory: High-Volume Manufacturing and Technology Development Enhanced by AI, Veera Dandu, Sandisk
1:40 pm – Measure What You Polish: Optical Measurement Techniques for CMP Consumables and Wafer Surface Characterization, Etienne Babnik, Nanofocus
2:05 pm – Impact of Sub-optimal Pad Conditioning Recipes on Process Vibrations in Copper CMP, Dr. Ara Philipposian, Araca Inc
2:30 pm – Addressing Polishing By-Products in Advanced Metals CMP Solution Development, Kevin Dockery, Entegris
2:55 pm – Effects of Conditioning Disc Designs on the Tribological, Vibrational, Thermal, Kinetic, Pad Micro-Textural and Pad Wear Characteristics of Silicon Carbide CMP Processes, Thomas Mooney, 3M Company
3:20 pm – Announcements/Coffee Break
3:50 pm – Correlative Microscopy and Nanoscale Chemical Mapping for CMP Defect Root Cause Analysis, Valerie Brogden, Covalent
4:15 pm – CMP Solutions for Advanced Panel Solutions, Sunghoon Lee, KC Tech
4:40 pm – A Viscosity Measurement Technique for Ultra-low Sample Volumes, Professor Mahesh Tirumkudulu, Rheoheme Pvt Ltd
5:05 pm – Panel Discussion, Semiconductor Manufacturing Mentoring Program
5:30 pm – Closing Remarks
7:00 pm – Offsite Dinner in St. Paul Area
All presentations from this meeting will be posted on the CMPUG Proceedings webpage ~2 weeks following the meeting.
Platinum Sponsors
Gold Sponsors
Sponsorship
If you would like to sponsor a 2026* User Group (CMPUG, JTG, PAG, or TFUG) meeting, click the “BE A SPONSOR” button.
*2026 CMPUG Schedule is posted