CMPUG Announcements

CALL FOR ABSTRACTS

Abstracts are now being accepted for the Chemical Mechanical Planarization Users Group (CMPUG) April 8, 2026 Symposium on Advances in CMP Consumables, Materials and Tools. The symposium will provide an international forum for academic researchers, industrial practitioners and engineers from around the world for the exchange of information on state-of-the-art research in CMP semiconductor technology. The CMPUG promotes the exchange of opportunities, ideas, friendly relationships and research collaboration. The areas of focus for this meeting will be the following:

• CMP Consumables and Materials
• CMP Polishing and Metrology Tools
• CMP Process Integration

Abstract/Presentation Submissions
Please submit an abstract (less than 200 words) of your presentation by March15, 2026to the meeting Co-Chairs, Michael Pevny, mpevny@mmm.com and Bahar Basim, gbbasim@yahoo.com  Authors will be notified of acceptance by return e-mail.

All accepted presenters are required to submit their presentations in pdf or pptx format, approved by their respective organizations/employers for public release, by April 3, 2026

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The Northern California Chapter AVS – NCCAVS 46th Annual Equipment Exhibition will be held in conjunction with the NCCAVS Technical Symposium & Workshop/Tutorial and 13th Annual Student Poster Session.

The Exhibition showcases products and services of companies supporting vacuum-related industries. The theme of the Symposium is “Engineering Matter One Layer at a Time: The Science of Atomic Scale Processing.” The symposium will provide an international forum for academic researchers, industrial practitioners and engineers from around the world for the exchange of information on state-of-the-art research and include a workshop with speakers from academia and industry focusing on Atomic Layer Deposition and Atomic Layer Etching. There will also be a Student Poster Session to round out this annual event. Some highlights include:

• Largest Attendance of any AVS Chapter or Division
• Workshops from industry subject matter experts
• Speaker events at capacity
• Opportunities to speak with aspiring professionals during the Student Poster Session
• Extended hours provide ample time to engage all attendees
• Lunch, evening reception, and cocktails provided at no cost to attendees

For more information please visit the NCCAVS Website.

Exhibits run from 9:00 a.m.-6:00 p.m.

Technical Symposium Agenda

AM Session
Tutorials on Atomic Layer Deposition (ALD) and Atomic Layer Etching (ALE)

One Atom at a Time: ALD Adoption by Semiconductor Industry, Dr. Mihaela Balseanu, Corporate Director, ASM

Wearing The Hat Backwards: Two Decades of Atomic Layer Deposition—From Applications to Fundamentals, Prof. Parag Banerjee, Materials Science and Engineering, University of Central Florida

Fundamentals of Low-Temperature Plasmas and Their Applications in Atomic Layer Processing, Prof. Sumit Agarwal, Chemical Engineering, Colorado School of Mines

PM Session
Invited and Contributed Talks

(INVITED) Enabling High‑Performance Logic Technology at 2 nm Nodes via ALD and ALE Process Engineering, Dr. Gaurav Thareja, Director, Applied Materials

(INVITED) Piezoelectric and Ferroelectric ALD Thin Films for Next-Generation MEMS, Dr. Nicholas Strnad, Materials Research Engineer, Army Research Lab

(INVITED) Precursor Design for Atomic Layer Deposition and Future Trends, Dr. Corbin Feit, Research Scientist, Air Liquide

Atomic Layer Etch Process for Nb and Ta Using CF4/H2 Plasma, Ryan Walsh, Graduate Student, University of Nevada, Reno

IR-PiFM: Nanoscale Chemical Analysis and Mapping for ALD Process Development and Control, Padraic O’Reilly, Applications Scientist, Molecular Vista

Sponsor Talks
TBD

Student Poster Session

The poster session will immediately follow all technical sessions and will include the evening reception.

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