CMPUG Announcements

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AGENDA – December 4, 2024
SESSION ONE – Richard Vreeland, Session Chair, Senior Staff Engineer, Intel Corporation

1:00 PM – Welcome and Acknowledgment of Sponsors; Symposium Co-Chairs Bob Roberts, X-trinsic, and Richard Vreeland, Intel

1:10 PM – Welcome statement from the North America CMP User Group. Bob Roberts, Chair, CMP User Group PC; Senior Director Customer Operations, X-trinsic Inc.

1:15 PM – “The Inception of Chemical Mechanical Polishing for Device Applications,” Dr. Klaus Beyer, IBM Fellow (Retired)

1:35 PM – “How You Polish Determines How You Clean.  The Need for a Holistic Approach to Post-CMP Clean,” Wei-Tsu Tseng, IBM Research Staff

1:55 PM – “Spectroscopic Analysis and Machine Learning to Expedite Oxide Planarization Development,” Shanmukh Kutagulla, Materials Engineering, INTEL Corporation

2:15 PM – “Exploring the Effect of Molecular Structure Enhanced Post-CMP Cleaning Chemistries for SiC and Oxide Surfaces,” Jason Keleher, Professor and Elizabeth M. McDonnell, Department of Chemistry, Lewis University

2:35 PM – “OptiQuiver:  Novel Metrology Solution for in-situ Wafer Shape Measurements,” Robert Shelby, Engineering Manager, Peter Pilarz, Engineering Manager, Quartus Engineering

2:55 PM – Break Time

SESSION TWO – Nagella Nukuna, Session Chair, North American ACST R&D Leader, DuPont Electronics and Industrial

3:10 PM – Impact of Dissolved Oxygen on Metal Corrosion in Post-CMP Cleaning for Advanced Logic Structures,’ Katrina Mikhaylichenko, Senior Director Technical Staff, Applied Materials Corporation

3:10 PM – Impact of Dissolved Oxygen on Metal Corrosion in Post-CMP Cleaning for Advanced Logic Structures,’ Katrina Mikhaylichenko, Senior Director Technical Staff, Applied Materials Corporation

3:30 PM – “Development and Co-optimization of CMP Slurries and Cleans for Enhanced Performance,” Kathryn Gramigna, Research Scientist, and Yi Guo, CMP Slurry Formulation Leader, Dupont Electronics and Industrial Company

3:50 PM – “The Critical Importance of CMP for Hybrid Bonding,“ Swetha Barkam, Product Manager, CMP Business Unit, Applied Materials Inc.

4:10 PM – “How the Evolution of the Supply Chain for CMP + Post-CMP Cleans Consumables has Overcome Challenges,” Mike Corbett, Linx Consulting

4:30 PM – “Megasonically Activated Post-CMP Cleaning,” Ara Philipossian, Founder, CEO Araca Inc.

4:50 PM – Conclusion of Day One, Richard Vreeland, Senior Staff Engineer, Intel

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AGENDA – December 5, 2024
SESSION THREE – Katrina Mikhaylichenko, Session Chair, Senior Director Technical Staff, Applied Materials Corporation

10:30 AM – Brief Welcome and Acknowledgment of Sponsors; Symposium Co-Chairs Bob Roberts, X-trinsic, and Richard Vreeland, Intel

10:35 AM – “The Early Adaptation of Double-Sided Brush Scrubbing in Post-CMP Cleaning,” Jerry Cutini, Co-Founder OnTrak Systems

10:55 AM – “Tailoring Cleaning Solutions for Advanced Packaging Needs,” Volley Wang, Senior Scientist, Dupont Electronics and Industrial

11:15 AM – “Process Issues in Micro via Fabrication and their Impact on CMP,” Knut Gottfried, Managing Director, ErzM Technologies, Senior Scientist, Fraunhofer ENAS, and Chair European CMP and WET Users Group

11:35 AM – “CMP Process Developments for Emerging Microelectronic Device Fabrication,” Serge Ecoffey, Professor Electrical and Computer Engineering, Universite de Sherbrooke

11:55 AM – “Investigating Ceria-Related Defects on SiO2 Films from Nanoparticle Remnants and Tribofilms,” Van-Tuan Nguyen, Graduate Student, Clarkson University

12:15 PM – Break Time

SESSION FOUR – Bahar Basim, Session Chair, Productivity & Selection EM_Planar & Dry Etch, Intel, and Lead Professor of Materials Science and Engineering, University of Florida

12:30 PM – “Optimizing Wafer Polishing:  Innovation in CMP Techniques and Filtration,” Bradley Wood, Applications Engineering Manager, CMP Liquid Filtration, Entegris

12:50 PM – “Influence of Electric Field and Hydrodynamic Interactions in Removal of Uniformly Charged Abrasive Particles in Post-CMP Cleaning,” Abbas Khanmohammadi, PhD Candidate, Goodarz Ahmadi, Professor of Mechanical Engineering, Clarkson University

1:10 PM – “Model Verification Techniques for Analysis of Edge Roll Off Effects During the CMP Process,” Justin Isaacs, Engineering Manager, Kat Johnston, Technical Sales Engineer, Quartus Engineering.

1:30 PM – A Tribo-Electrochemical Approach for Performance Differentiation of CMP Slurry Inhibitors and Post-CMP Cleaning Formulations,’ Temidayo Afekare, Lead R&D Scientist, DuPont Electronics and Industrial

1:50 PM – Closing Statements, Richard Vreeland, Senior Staff Engineer, Intel