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TFUG Announcements

NCCAVS Joint User Group Meeting (hosted by CMPUG, PAG, & TFUG)

TOPIC: Challenges in Advanced Multi-layer Packaging

MEETING DATE:  September 10, 2025

TIME: 12:30 p.m.-1:45 p.m. (Pacific Time) – check your time zone

PLATFORM: ZOOM

VIRTUAL MEETING | Free to Attend – Advance Registration Required
(Zoom login details provided upon registering)

REGISTER FREE

Rob Rhoades, X-trinsic, zestrion@gmail.com
Lucia Feng, The OF Group, lmfeng@earthlink.net
Michael Oye, University of California Santa Cruz, moye@ucsc.edu

2025/09/10 12:30:00

The Northern California Chapter of the American Vacuum Society invites you to participate in a Joint User Group Meeting on Wednesday, September 10, 2025. The meeting is being organized by NCCAVS via ZOOM and is jointly hosted by the CMP Users Group, the Plasma Applications Group, and the Thin Film Users Group.

AGENDA (All times are Pacific Daylight Time)

12:30 p.m. Welcome and Acknowledgement of Meeting Sponsors, Co-Chairs: Rob Rhoades, Lucia Feng, Michael Oye

12:35 p.m. Oreste Donzella, Senior Advisor and Board Member, Former C-Suite Executive,“Enabling Semiconductor Technology Roadmap via Advanced Packaging in the AI Era”

1:10 p.m. Catharina Rudolph, Fraunhofer IZM, “CMP in Heterogeneous Integration – Advanced Packaging”

1:45 p.m. Adjourn

All presentations may be posted on the CMPUG, PAG and TFUG Proceedings webpages within 2 weeks following the meeting if presenters make them available for posting.

Joint UG Agenda & Abstracts

Sponsorship

If you would like to sponsor a 2025 or 2026* User Group (CMPUG, JTG, PAG, or TFUG) meeting, click the “BE A SPONSOR” button.

BE A SPONSOR!

*2026 TFUG Schedule is TBD

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