NCCAVS Joint User Group Virtual Meeting
TOPIC: Evolving Trends in Advanced Packaging
CO-CHAIRS:
Rob Rhoades, X-trinsic, zestrion@gmail.com
Jeff Shields, Independent Consultant, jeffrey.shields@att.net
Paul Werbaneth, Independent Consultant, pfwerbaneth@gmail.com
Rob Rhoades, X-trinsic, zestrion@gmail.com
Jeff Shields, Independent Consultant, jeffrey.shields@att.net
Paul Werbaneth, Independent Consultant, pfwerbaneth@gmail.com
FREE TO ATTEND! ADVANCE REGISTRATION REQUIRED
(Zoom login details provided upon registering)
2024/08/21 13:00:00
The Northern California Chapter of the American Vacuum Society invites you to participate in a Joint User Group Meeting on Wednesday, August 21, 2024. The meeting is being hosted by NCCAVS via ZOOM and is jointly hosted by the CMP Users Group, the Plasma Applications Group, and the Thin Film Users Group.
AGENDA (All times are Pacific Daylight Time)
1:00 p.m. Welcome and Acknowledgement of Meeting Sponsors,
Co-Chairs: Rob Rhoades, Jeff Shields, Paul Werbaneth
1:10 p.m. Knut Gottfried, ErzM and Fraunhofer ENAS, “Improved CMP processes through architecture & design optimizations”
1:40 p.m. Daniel Pascual, ONTOS, ”Atmospheric Plasma Simplifies Die-to-Wafer Bonding”
2:10 p.m. Jeff Gelb, Sigray Inc, “Advanced X-Ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection”
2:40 p.m. Mike Slessor, FormFactor, “Strategies for Probe to enable Advanced Packaging”
3:10 p.m. Swetha Barkam, Applied Materials, “Chemical Mechanical Planarization (CMP) for hybrid bonding”
3:40 p.m. Thank you and adjournment
All presentations from this meeting will be posted on the CMP, PAG, & TFUG Proceedings webpage ~2 weeks following the meeting.
Sponsorship
If you would like to sponsor a 2024* User Group (CMPUG, JTG, PAG, or TFUG) meeting, click the “BE A SPONSOR” button