CMPUG Announcements

Below Schedule is in Central Time (please check your time zone)

AGENDA DAY 1 (April 3, 2025)

9:00 a.m.-12:00 p.m. Short Course: Discussions and Case Studies on CMP and Post-CMP Processes (IN PERSON ONLY)

ZOOM WEBCAST OPENS AT 12:30 p.m. | Technical Program Begins at 1:00 p.m.

12:00-1:00 p.m.  In-person attendees will arrive and be directed to the location of the conference proceedings, the Zoom meeting will be started and Virtual attendees can log in

1:00-1:10 p.m.  Welcome to Lewis University, Jason Keleher

1:10-1:20 p.m.  CMPUG Welcome, Bob Roberts

1:20-1:40 p.m.  Functionalized Polyurethane CMP Pads for Bulk Copper Polishing: Abrasive-free Polishing Systems, Zinnat Morsada (Student Talk)

1:40-2:00 p.m.  Toward Sustainable CMP: A Methodological Framework for Assessing Ceria Slurry Environmental Impacts, Ravitej Venkataswamy (Student Talk)

2:00-2:30 p.m.  Tribological, Thermal, Kinetic, and Surface Microtextural Characterization of Prime p-Type <100> Silicon Wafter CMP for Direct Wafer Bonding Applications, Ara Philipossian (Industry Talk)*

2:30-3:00 p.m. BREAK

3:00-3:20 p.m.  Advancing CMP Technology: Collaborative Research Opportunitieswith the Texas A&M Semiconductor Institute, Steve Putna (University Talk)*

3:20-3:40 p.m.  Synthesis of Model Functional Polyurethane and their Interactions with Metal Ions: Implications Regarding Pad-Metal Ion Interactions in CMP, Harini Gunasekaran (Student Talk)

3:40-4:10 p.m.  Effect of Conditioning Disc Designs and Optimized Downforces on the Tribological, Vibrational, Kinetic, Pad Micro-Textural, and Pad Wear Characteristics of High-Rate STI CMP Processes, Matt Fritz (Industry Talk)

4:10-4:30 p.m.  BREAK

4:30-5:30 p.m  Lewis Campus Tours

5:30-6:30 p.m.  Poster Session

6:30-7:30 p.m.  Buffet Dinner

7:30-7:40 p.m.  Provost Welcome, Christopher Sindt

7:40-8:30 p.m. Keynote Session:

Pathways for Employment in the Semiconductor Industry, Tricia Burroughs*

Discussion on the Experience of Being “Un” Employed, Bradley Wood

*Virtual Presentation

Agenda – Day 2 (April 4, 2025)

8:00 a.m.-9:00 a.m.  In-person attendees will arrive and be directed to the location of the conference proceedings, the Zoom meeting will be started and Virtual attendees can log in

ZOOM WEBCAST OPENS AT 8:30 a.m. | Technical Program Begins at 9:00 a.m.

9:00-9:15 a.m.  Pad Conditioners, Ben Lurie, 3M (Platinum Sponsor)

9:15-9:30 a.m.  Test Wafers, Mitch Yanase, AMTI (Gold Sponsor)

9:30-9:45 a.m.  Pad Conditioners, Mark Fagin and Nathaniel Palone, Saesol (Platinum Sponsor)*

9:45-10:00 a.m.  Megasonic Cleaning Systems, Don Dussault, Prosys (Gold Sponsor)

10:00-10:15 a.m.  Pad Conditioners, Scott Lawing, Kinik NA (Gold Sponsor)*

10:15-10:30 a.m.  CMP Slurries and Post-CMP Cleaning Chemicals, Nagella Nukuna, DuPont Electronics (Platinum Sponosor)

10:30-10:45 a.m.  Tribological Polishers/Instruments, Melinda Bullaro, Bruker (Platinum Sponsor)*

10:45-11:00 a.m.  Abrasives, Jeff McKinnis, Fujimi (Gold Sponsor)*

11:00-11:30 a.m.  BREAK

11:30 a.m.-12:00 p.m.  Process Optimization/Improvement of Removal Rate and Profile in ILD Applications, Alexandra Patrick (Industry Talk)

12:00-12:20 p.m.  Improved Molybdenum CMP Corrosion Stability via Sulfer-based Functional Group Amino Acid Inhibitors, Seok Gyu Ryu (Postdoc Talk)

12:20-12:40 p.m.  “Micelle-like” Reducing Amino Alcohol Chemistries for Enhanced CeO2 Removal in Post-CMP Sti Cleaning, Elizabeth McDonnell (Student Talk)

12:40-1:40 p.m.  Working lunch

1:40-2:00 p.m.  Data-Driven Prediction of Organic Corrosion Inhibitors for Cu CMP using Structure-Dependent Property, Murali Ramu (Student Talk)

2:00-2:30 p.m.  Designing Silica Abrasivees for Tunable CMP of Silicone Oxide and Silicon Nitride in ILD Applications, Stephen Boakye Ansah (Industry Talk)

2:30-2:50 p.m.  A Step Towards Autonomous CMP Labs: Text Mining Strategies for Synthesis of Enhanced Ceria Slurry in CMP, Prabhu Kiran Vandranki (Student Talk)

2:50-3:00 p.m. Closing Remarks

*Virtual Presentation

Platinum Sponsors

Gold Sponsors