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CMPUG About

Chemical Mechanical Polishing Users Group (CMP)

Chemical Mechanical Polishing (CMP) is a technology used for planarization and surface finishing in the manufacture of silicon wafers, integrated circuits (IC’s), magnetic heads and micro-electro-mechanical systems (MEMS). CMP is recognized as the premiere method for achieving ultraflat and ultrasmooth surfaces when they are most critical, thus enabling many of the advanced electronic devices currently in production.  At various steps in the process flow, surface bumps or topography from the underlying layers can cause yield-limiting problems for the next process step.  CMP was developed specifically to address these issues.  Since its mainstream introduction in the mid-1990’s, applications have continued to grow rapidly in both volume and complexity.  None of the advanced microprocessor or memory circuits manufactured today would be possible in their current form without multiple CMP process steps.  Newer technologies, such as 3D packaging and thru-silicon vias, also continue to leverage CMP for its unique planarization capabilities. Cell phones, computers, tablets, medical analytical devices, wearables, implants, advanced sensors, electric and autonomous vehicles and thousands of other digital driven devices all require advanced circuitry enabled by the Chemical Mechanical Polishing process for the Planarization of Thin Films.

The CMP Users Group (CMPUG) was formed in October 1995 to explore the issues and challenges associated with this fast growing technology. The CMPUG’s main activity is a quarterly meeting with technical presentations on a topic of interest to the CMP community.

Admission to the quarterly technical meetings and membership in the CMPUG is FREE and open to anyone involved or interested in joining the CMP Users Group, including those in device and equipment manufacturing, academia, or consulting.

The US CMP User Group is a charter co-sponsor of the International Conference on Planarization Technology.  ICPT is an annual multiple-day, high-level conference covering all aspects of CMP technology as it is used in nearly countless applications.  The foundation of the ICPT is strongly based within the co-operation of the CMP Users Groups of China, Europe, Japan, Korea, Taiwan and the United States. This annual conference is held generally in fall at changing locations.  The following list indicates how strongly CMP has become the enabling technology for advanced circuitry all across the globe.  This is truly an international event.

2004     Tokyo, Japan
2005     Seoul, South Korea
2006     Foster City, CA, USA
2007     Dresden, Germany
2008     Hsinchu, Taiwan
2009     Fukuoka, Japan
2010     Phoenix, Arizona, USA
2011     Seoul, South Korea
2012     Grenoble, France
2013     Hsinchu, Taiwan
2014     Kobe, Japan
2015     Chandler, AZ, USA
2016     Beijing, China
2017     Leuven, Belgium
2018     Seoul, South Korea
2019     Hsinchu, Taiwan
2020     Portland, Oregon, USA (Postponed to 2022 due to COVID-19)
2021     Japan (Postponed to 2023 due to COVID-19)
2022     Portland, Oregon, USA
2023     Japan

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