CO-CHAIRS:
Michael Pevny, 3M Company, mpevny@mmm.com
Michael Wedlake, michael.wedlake@gmail.com
MEETING DATE: May 2, 2024
TIME: 11:30 a.m.-5:00 p.m. (Central Time) TIMEZONE CONVERTER
Location:
University of Texas at Austin
Thompson Conference Center
Room: Auditorium #1.110
2405 Robert Dedman Dr.
Austin, TX 78712
Important Parking Information: Free parking for conference attendees in Lot 40 https://thompsoncenter.utexas.edu/location-and-parking
FREE TO ATTEND! ADVANCE REGISTRATION REQUIRED
*Virtual Option Available via Zoom
(Zoom login details provided upon registering)
Platinum Sponsors
Gold Sponsors
We are pleased to announce a packed agenda with outstanding content for our 2024 NCCAVS CMPUG Spring Symposium!
- Each technical talk will be 25 minutes with 20 minutes for presentation and 5 minutes for Q&A.
- Each business talk will be 20 minutes with 15 minutes for presentation and 5 minutes for Q&A.
UPDATED AGENDA (as of 4/30/24)
11:30 am – Welcome and Acknowledgment of Sponsors; Symposium Co-Chairs Michael Pevny, 3M, and Michael Wedlake and U.S. CMPUG Chair Bob Roberts, X-Trinsic
11:40 am – Semi Americas Outlook Growth Opportunities (Keynote), Dr. Daniel Muscat, EMD Electronics
12:05 pm – European CMP Users Group Activities and ICPT2024, Dr. Knut Gottfried and Imme Ellebrecht, Fraunhofer ENAS, ErzM-Technologies, European CMP & WET User Group (Remote)
12:25 pm – Advanced Semiconductor Technology Roadmaps and Implications to CMP Materials, Dr. Karey Holland and Diane Scott, Techcet
12:45 pm – Tailoring Molecular Structure for Defect Activated p-CMP Cleaning Processes, Dr Jason Keleher, Lewis University
1:10 pm – Trends in CMP and Impact on Consumables, Mike Corbett, Linx Consulting
1:30 pm – Announcements/Coffee Break
1:45 pm – Controlling the Coefficient of Friction in CMP, Len Borucki, Araca (ret.) (Remote)
2:10 pm – Environmentally Friendly Amino Acid-Based Polishing Slurry with Reduced Galvanic Corrosion at Copper/Cobalt Interface for Advanced Cu Interconnect Applications, Thi Thuy Hoang Tran (Senior PhD Student), Elizabeth J. Podlaha, and Jihoon Seo, Clarkson University
2:35 pm – SiC CMP – A Process Perspective, Rob Rhoades, X-Trinsic
3:00 pm – Electrochemical Innovation for Sustainable Copper Management in CuCMP Wastewater, Dr. Cameron Lippert, ElectraMet
3:25 pm – The Value of CMP Education, Dr. Andrew Mansson, Samsung Austin Semiconductor
3:45 pm – Reducing CMP Process Mass Intensity, Steve Benner, Confluense, LLC
4:10 pm – Total Holographic Characterization of large particle contaminants in CMP slurries, Laura Philips, Spheryx (Remote)
4:35 pm – Pad-Level Spent Slurry Extraction During Polish, Dr. Ara Philipposian, Araca Inc
5:00 pm – Closing Remarks, Co-chairs Michael Pevny, 3M, and Michael Wedlake
5:05 pm – Depart for Offsite Dinner & Networking (Optional)
Need a Hotel?
For those seeking hotel accommodations to attend this event in person, the 4-star and highly rated AT&T Hotel and Conference Center is conveniently located a mere 1.3 miles (5 min) from the Thompson Conference Center where our event will be hosted. If you choose to extend your stay into Friday or the weekend, The University of Texas at Austin and surrounding area has wonderful museums, art galleries, and live music venues. We believe by concentrating attendees at this hotel it would also facilitate follow-up networking meetings on Friday and over the weekend as desired. We hope you have an enjoyable stay in Austin!
Sponsorship
If you would like to sponsor a 2024* User Group (CMPUG, JTG, PAG, or TFUG) meeting, click the “BE A SPONSOR” button
*2024 Schedules are TBD for some User Groups